10M50DAF256C8G vs 10M50DCF256C7G

對 10M50DAF256C8G 和 10M50DCF256C7G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M50DAF256C8G and 10M50DCF256C7G are both Intel MAX 10 FPGA devices in the same 256-pin FBGA package with identical logic density and feature set, making them functionally interchangeable in most designs. The primary distinction is speed grade and temperature range, so the 10M50DCF256C7G can serve as a drop-in replacement for the 10M50DAF256C8G provided the target application tolerates the faster speed grade and the narrower commercial temperature window.

Logic Density High match
Package Type High match
Speed Grade Validation required
Operating Temperature Validation required

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M50DAF256C8G 10M50DCF256C7G Why it matters
Family / Series MAX 10 MAX 10 Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability.
Logic Elements (LEs) 50,000 50,000 Identical logic capacity ensures the same design fits without resource re-estimation.
Package 256-pin FBGA 256-pin FBGA Same package and pin count allow drop-in board-level replacement without layout changes.
Speed Grade 8 (fastest commercial) 7 (fastest commercial) Speed grade affects maximum operating frequency and timing closure; a faster grade can improve performance but may change power and timing margins.
Operating Temperature Range 0°C to +85°C (commercial) 0°C to +85°C (commercial) Matching temperature ranges ensures both parts are suitable for the same environmental conditions.
Embedded Memory (M9K blocks) 1,638 Kbits 1,638 Kbits Identical embedded memory capacity supports the same on-chip buffering and storage requirements.
User I/O Pins 178 178 Same I/O count ensures all peripheral interfaces can be routed identically.
Configuration Flash (Internal) Yes (dual configuration) Yes (dual configuration) Integrated configuration flash eliminates external configuration memory, simplifying board design and boot-up.
Supply Voltage (Core) 1.2 V 1.2 V Same core voltage means identical power supply design and decoupling requirements.
RoHS / Lead-Free Yes Yes Both are RoHS-compliant, meeting environmental and regulatory requirements for the same markets.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M50DAF256C8G 10M50DCF256C7G
Supplier - Intel
Series MAX® 10 MAX® 10
Part Status Active Active
Number of LABs/CLBs 3125 3125
Number of Logic Elements/Cells 50000 50000
Total RAM Bits 1677312 1677312
Number of I/O 178 178
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 10M50DAF256C8G and the 10M50DCF256C7G?

The primary differences are the speed grade and the operating temperature range. The 10M50DAF256C8G is a speed grade 8 device specified for commercial temperature range (0°C to 85°C junction). The 10M50DCF256C7G is a faster speed grade 7 device specified for commercial temperature range (0°C to 85°C junction). Both are Intel MAX 10 FPGA devices with 50,000 logic elements in a 256-pin FineLine BGA (FBGA) package.

Are the 10M50DAF256C8G and 10M50DCF256C7G pin-to-pin compatible?

Yes. Both devices are offered in the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel MAX 10 device pin-out specifications. However, designers must verify that the faster speed grade of the 10M50DCF256C7G does not introduce signal integrity or timing issues in the target design.

Can the 10M50DAF256C8G be replaced by the 10M50DCF256C7G in an existing design?

In many cases yes, because the 10M50DCF256C7G is a faster speed grade (7 vs. 8) in the same package and temperature range. However, a direct substitution requires timing analysis to confirm that the faster device does not violate hold-time or other timing constraints, and that power consumption remains within the board's thermal and electrical limits. Always validate against the Intel MAX 10 device datasheet and your design's timing report.

What is the logic capacity of the 10M50DAF256C8G and 10M50DCF256C7G?

Both devices feature 50,000 logic elements (LEs), 1,638 Kbits of M9K embedded memory, and 288 18x18 multiplier blocks, as specified in the Intel MAX 10 device family datasheet. They also include integrated analog-to-digital converter (ADC) blocks and flash memory for configuration.

Do both devices support the same configuration methods?

Yes. Both the 10M50DAF256C8G and 10M50DCF256C7G are MAX 10 FPGA devices with integrated flash configuration memory. They support internal configuration from the on-chip flash, as well as external configuration via JTAG, and they can be used in dual-configuration mode. Refer to the Intel MAX 10 FPGA Configuration User Guide for detailed methods.

What is the operating temperature range for these two devices?

Both the 10M50DAF256C8G and the 10M50DCF256C7G are specified for the commercial temperature range, with a junction temperature (Tj) of 0°C to 85°C. The "C" in the part number indicates commercial grade. Industrial-grade versions would carry an "I" designator and a different temperature range.

Which device is faster, the 10M50DAF256C8G or the 10M50DCF256C7G?

The 10M50DCF256C7G is faster. In Intel FPGA speed grade nomenclature, a lower number indicates a faster speed grade. Speed grade 7 is faster than speed grade 8, resulting in shorter propagation delays and higher maximum operating frequencies for the 10M50DCF256C7G compared to the 10M50DAF256C8G.

Are the 10M50DAF256C8G and 10M50DCF256C7G RoHS compliant?

Yes. Both devices are offered in RoHS-compliant packages as stated in Intel's product material declarations and distributor documentation. The 256-pin FBGA package is lead-free and meets RoHS requirements. Always confirm the specific ordering code and latest compliance documentation from Intel or authorized distributors.