Part A
10M50DAF256I6G
訊息
- Lifecycle
- Active
- Stock
- 5635 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M50DAF256C8G and 10M50DAF256I6G are functionally compatible FPGA devices sharing identical logic density, package, and I/O configuration, with the primary distinction being the operating temperature grade. The industrial-grade 10M50DAF256I6G can directly replace the commercial-grade 10M50DAF256C8G in most applications, while the reverse substitution requires careful thermal validation.
Logic Density
High match
Package Type
High match
I/O Count
High match
Operating Temperature
Validation required
Parts at a glance
Part B
10M50DAF256C8G
訊息
- Lifecycle
- Active
- Stock
- 2856 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256C8G | 10M50DAF256I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing performance. |
| Logic Elements (LEs) | 50,000 | 50,000 | Defines the available programmable logic capacity for implementing user designs. |
| Embedded Memory | 1,638 Kbits | 1,638 Kbits | On-chip memory is used for buffering, data storage, and implementing memory functions within the FPGA. |
| Package / Pin Count | 256-pin FBGA | 256-pin FBGA | Physical footprint and pinout must match for board-level drop-in compatibility. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must be compatible with the board power design for correct operation. |
| Number of I/O Pins | 178 | 178 | I/O count determines how many external signals the device can interface with. |
| Embedded Multipliers (18x18) | 144 | 144 | Dedicated multipliers are essential for DSP, filtering, and arithmetic-intensive applications. |
| PLLs | 4 | 4 | PLLs provide clock synthesis and management needed for varied timing requirements. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256I6G | 10M50DAF256C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M50DAF256C8G and the 10M50DAF256I6G?
The primary difference is the operating temperature grade and speed grade. The 10M50DAF256C8G is a commercial-grade device with a speed grade of 8 and a commercial temperature range of 0°C to 85°C (junction temperature). The 10M50DAF256I6G is an industrial-grade device with a speed grade of 6 and an industrial temperature range of -40°C to 100°C (junction temperature). Both are Intel MAX 10 FPGA devices in the same 256-pin FineLine BGA (FBGA) package with 50,000 logic elements.
Are the 10M50DAF256C8G and 10M50DAF256I6G pin-to-pin compatible?
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out specifications. The package designation "F256" indicates the same physical footprint and ball assignment, allowing for a common PCB layout.
Can the 10M50DAF256C8G be used as a drop-in replacement for the 10M50DAF256I6G in an existing design?
Not without design validation. Although the package and pinout are identical, the speed grade and temperature grade differ. The 10M50DAF256I6G has a faster speed grade (6) and a wider industrial temperature range (-40°C to 100°C), while the 10M50DAF256C8G is slower (speed grade 8) and rated only for commercial temperatures (0°C to 85°C). Timing closure, power consumption, and thermal performance must be re-verified against the target application requirements.
What is the logic density and embedded memory of both devices?
Both the 10M50DAF256C8G and 10M50DAF256I6G are Intel MAX 10 10M50 devices featuring 50,000 logic elements (LEs). They include 1,638 Kbits of M9K embedded memory blocks and 288 Kbits of user flash memory (UFM). These parameters are identical across both speed and temperature grades.
Do both devices support the same configuration methods?
Yes. Both the 10M50DAF256C8G and 10M50DAF256I6G support the same configuration options for Intel MAX 10 devices, including internal configuration via on-chip flash, dual configuration images, and external configuration through JTAG, active serial (AS), and passive serial (PS) modes. Configuration features are not differentiated by speed or temperature grade.
What are the operating temperature ranges for each device?
The 10M50DAF256C8G is specified for commercial operation with a junction temperature (Tj) range of 0°C to 85°C. The 10M50DAF256I6G is specified for industrial operation with a junction temperature (Tj) range of -40°C to 100°C. These ranges are defined in the Intel MAX 10 device datasheet and determine the environmental suitability of each part.
Which device is better suited for industrial or automotive applications?
The 10M50DAF256I6G is better suited for industrial applications because its industrial temperature grade supports operation from -40°C to 100°C junction temperature. The 10M50DAF256C8G, with its commercial temperature range of 0°C to 85°C, is intended for controlled-environment applications. Neither device is automotive-qualified unless a specific automotive-grade variant is ordered.
Do both devices have the same power supply requirements?
Yes. Both the 10M50DAF256C8G and 10M50DAF256I6G require the same nominal supply voltages as defined for the Intel MAX 10 10M50 device family: VCCINT (1.2 V), VCCA (2.5 V or 3.0 V/3.3 V depending on PLL usage), and VCCIO (1.2 V to 3.3 V depending on I/O bank configuration). Power supply requirements are not differentiated by speed grade or temperature grade.