10M50DAF256I7G
訊息
- Lifecycle
- Active
- Stock
- 1541 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 10M50DAF256I7G 和 10M50DAF256C8G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 10M50DAF256C8G and 10M50DAF256I7G are functionally equivalent MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration, with the primary distinction being the operating temperature grade. The I7G variant supports industrial temperature range operation, making it suitable for the C8G's commercial-grade applications with enhanced thermal margin, though design validation is recommended to confirm timing closure across the extended temperature range.
訊息
訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256C8G | 10M50DAF256I7G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions. |
| Speed Grade | 8 | 7 | A lower speed grade number indicates faster maximum operating frequency and tighter timing performance. |
| Logic Elements (LEs) | 50,000 | 50,000 | Defines the available programmable logic capacity for implementing user designs. |
| Total RAM Bits | 1,677,312 | 1,677,312 | Determines on-chip memory available for buffering, storage, and data processing within the FPGA. |
| Number of I/Os | 178 | 178 | Specifies how many external signals the device can interface with, affecting system connectivity. |
| Package / Case | 256-FBGA (17x17) | 256-FBGA (17x17) | Ensures physical footprint and PCB layout compatibility between the two devices. |
| Supply Voltage | 1.15V to 1.25V | 1.15V to 1.25V | Core voltage must match the board power design for correct operation and electrical compatibility. |
| Number of PLLs | 4 | 4 | PLLs provide clock synthesis and management essential for multi-clock domain designs. |
| Mounting Type | Surface Mount | Surface Mount | Confirms both parts use the same assembly method, ensuring manufacturing compatibility. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256I7G | 10M50DAF256C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-pin FineLine BGA (FBGA) package. They share the same logic density, memory, and DSP resources, but differ in their speed grade and operating temperature range.
The suffix indicates speed grade and temperature grade. The 10M50DAF256C8G is a commercial-grade device (C) with speed grade 8, while the 10M50DAF256I7G is an industrial-grade device (I) with speed grade 7. Speed grade 7 is faster than speed grade 8, and the industrial grade supports a wider operating temperature range than the commercial grade.
Yes. Both devices use the same 256-pin FBGA package and the same pinout for the MAX 10 10M50 device family. They are physically and functionally pin-compatible, allowing the same PCB footprint to be used for either device.
They can be used on the same PCB footprint, but they are not identical in performance or environmental ratings. The I7G offers a faster speed grade and a wider industrial temperature range, while the C8G is limited to commercial temperature ranges and a slower speed grade. Design timing closure and thermal requirements must be validated for the specific device used.
The 10M50DAF256C8G is rated for commercial operation, typically 0°C to 85°C junction temperature (TJ). The 10M50DAF256I7G is rated for industrial operation, typically -40°C to 100°C junction temperature (TJ). Exact limits should be confirmed in the Intel MAX 10 device datasheet.
Yes. Both are MAX 10 10M50 devices and support the same family features, including internal configuration flash, analog-to-digital converter (ADC) blocks, and instant-on capability. The primary differences are speed grade and temperature grade, not feature set.
The 10M50DAF256I7G is the appropriate choice for industrial applications because its industrial temperature grade supports operation over the extended -40°C to 100°C junction temperature range. The 10M50DAF256C8G is intended for commercial-temperature environments.
Yes. Speed grade 7 (I7G) provides faster internal timing than speed grade 8 (C8G). A design closed with the slower C8G timing may also meet timing with the faster I7G, but the reverse is not guaranteed. Timing analysis must be performed for the specific speed grade used in production.