10M50DCF256A7G vs 10M50DAF256C8G

對 10M50DCF256A7G 和 10M50DAF256C8G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M50DCF256A7G is a viable functional replacement candidate for the 10M50DAF256C8G, sharing the same device family, logic density, and package footprint. However, the faster speed grade and extended temperature range of the 10M50DCF256A7G require validation against the target design's timing closure and thermal requirements before committing to a drop-in substitution.

Logic Density High match
Package Type High match
Speed Grade Validation required
Operating Temperature Validation required

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M50DAF256C8G 10M50DCF256A7G Why it matters
Family MAX 10 MAX 10 Both devices belong to the same FPGA family, which supports pinout and toolchain compatibility.
Logic Elements 50,000 50,000 Matching logic density ensures equivalent programmable capacity for the target design.
Package 256-FBGA 256-FBGA Identical package and ball count allow the same PCB footprint and assembly process.
Operating Temperature Range 0°C to 85°C (Commercial) -40°C to 125°C (Industrial) The industrial-grade variant supports harsher environments, affecting reliability and application suitability.
Speed Grade 8 7 A lower speed grade number indicates faster performance, impacting maximum operating frequency and timing closure.
Embedded Memory 1,638 Kbits 1,638 Kbits Equal embedded memory supports the same on-chip data buffering and storage requirements.
User I/O Pins 178 178 Matching I/O count ensures the same number of external interfaces can be supported.
Supply Voltage 1.2 V core 1.2 V core Identical core voltage allows the same power supply design and decoupling strategy.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M50DCF256A7G 10M50DAF256C8G
Series MAX® 10 MAX® 10
Part Status Active Active
Digi Key Programmable Not Verified -
Total RAM Bits 1677312 1677312
Number of I/O 178 178
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 125°C (TJ) 0°C ~ 85°C (TJ)
Number of Logic Elements / Cells 50000 -
Number of LA Bs / CL Bs 3125 -
Number of LABs/CLBs - 3125
Number of Logic Elements/Cells - 50000

Frequently asked questions

What are the key differences between the 10M50DAF256C8G and the 10M50DCF256A7G?

The 10M50DAF256C8G and 10M50DCF256A7G are both Intel MAX 10 FPGA devices in the 256-pin FineLine BGA (FBGA) package with 50,000 logic elements. The primary differences are the speed grade and the operating temperature range: the 10M50DAF256C8G is specified with a speed grade of 8 and an industrial temperature range, while the 10M50DCF256A7G is specified with a faster speed grade of 7 and a commercial temperature range. The "DA" and "DC" suffixes also indicate different feature sets within the MAX 10 family, such as analog-to-digital converter (ADC) and flash memory configuration options.

Are the 10M50DAF256C8G and 10M50DCF256A7G pin-to-pin compatible?

Both devices are offered in the same 256-pin FBGA package, so they share the same physical footprint and pin count. However, pin-to-pin compatibility cannot be assumed solely from the package. The "DA" and "DC" feature variants may have different pin assignments for dedicated functions such as ADC inputs, configuration pins, or power pins. A direct drop-in replacement requires verifying the pinout and function assignment in the respective Intel MAX 10 device pin-out files and datasheets.

Can the 10M50DAF256C8G be used as a substitute for the 10M50DCF256A7G in an existing design?

Substitution is not automatically valid. The 10M50DAF256C8G has a slower speed grade (8) than the 10M50DCF256A7G (speed grade 7), which may affect timing closure for high-speed interfaces. Additionally, the industrial temperature range of the 10M50DAF256C8G differs from the commercial range of the 10M50DCF256A7G, and the "DA" versus "DC" feature set may change available hard IP blocks or I/O capabilities. Any substitution must be validated against the Intel MAX 10 datasheet, pin-out files, and the specific design's timing and functional requirements.

What is the logic density and package of both devices?

Both the 10M50DAF256C8G and the 10M50DCF256A7G are members of the Intel MAX 10 FPGA family with 50,000 logic elements (LEs) and are housed in a 256-pin FineLine BGA (FBGA) package. The logic density and package are identical; the differences lie in speed grade, temperature grade, and the specific feature variant indicated by the "DA" and "DC" codes.

Which device has the faster speed grade, and what does that mean for performance?

The 10M50DCF256A7G has a speed grade of 7, while the 10M50DAF256C8G has a speed grade of 8. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10M50DCF256A7G offers higher maximum operating frequencies and tighter timing performance than the 10M50DAF256C8G. The actual achievable performance depends on the design's critical paths and the timing constraints applied.

What are the operating temperature ranges for these two devices?

The 10M50DAF256C8G is specified for the industrial temperature range, while the 10M50DCF256A7G is specified for the commercial temperature range. The exact temperature limits are defined in the Intel MAX 10 device datasheet. The industrial-grade device is intended for applications requiring operation over a wider ambient temperature range, whereas the commercial-grade device is intended for controlled-environment applications.

Do both devices support the same configuration and flash memory features?

Both devices are based on Intel MAX 10 FPGA technology, which integrates configuration flash memory and supports instant-on operation. However, the "DA" and "DC" feature variants may differ in the availability of certain hard IP blocks, such as analog-to-digital converter (ADC) channels, and in the amount of user flash memory (UFM). Designers must consult the Intel MAX 10 device datasheet and the specific device ordering information to confirm the exact configuration and flash memory resources for each variant.

What documentation should be consulted before comparing or replacing these devices?

Before comparing or replacing the 10M50DAF256C8G and 10M50DCF256A7G, consult the Intel MAX 10 FPGA Device Datasheet, the MAX 10 Device Pin-Out Files, the MAX 10 FPGA Device Features and Ordering Information, and any relevant errata sheets. These documents provide verified parameters for speed grades, temperature ranges, pin assignments, feature availability, and configuration options. Distributor listings from sources such as DigiKey, Mouser, or TTI can also be used to confirm ordering codes and availability, but the manufacturer datasheet remains the authoritative reference.