Part A
10M40DAF256C8G
訊息
- Lifecycle
- Active
- Stock
- 5091 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M40DAF256C8G and 10M40DCF256I6G are both Intel MAX 10 FPGA devices sharing the same 40K logic element density and 256-ball FineLine BGA footprint, making them functionally interchangeable in many designs. However, the 10M40DCF256I6G offers a faster speed grade and a wider industrial temperature range, while the 10M40DAF256C8G targets commercial applications with lower power and cost. Designers should validate timing closure, power budget, and thermal requirements before substituting one for the other.
Logic Density
High match
Package Type
High match
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10M40DCF256I6G
訊息
- Lifecycle
- Active
- Stock
- 7809 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DAF256C8G | 10M40DCF256I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is essential for pinout, toolchain, and IP compatibility. |
| Logic Elements (LEs) | 40,000 | 40,000 | Matching logic density ensures equivalent capacity for implementing the same design without resource overflow. |
| Embedded Memory | 1,260 Kbits | 1,260 Kbits | Identical on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| Package | 256-ball FBGA | 256-ball FBGA | Same package and ball count allow drop-in PCB compatibility without layout changes. |
| Operating Temperature Range | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | The industrial-grade variant supports harsher environments, so substitution depends on the target application's thermal requirements. |
| Speed Grade | 8 (Fastest) | 6 (Slower) | Different speed grades affect maximum operating frequency and timing closure, impacting achievable performance. |
| Core Supply Voltage | 1.2 V | 1.2 V | Identical core voltage ensures the same power supply design and decoupling strategy can be reused. |
| Configuration Method | Instant-on / Dual configuration | Instant-on / Dual configuration | Same configuration features allow identical boot and fail-safe strategies in the end system. |
| RoHS Compliance | RoHS Compliant | RoHS Compliant | Both meet environmental regulations, so no compliance barrier exists for substitution. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M40DAF256C8G | 10M40DCF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M40DAF256C8G and the 10M40DCF256I6G?
The primary differences are speed grade, operating temperature range, and configuration memory type. The 10M40DAF256C8G is a Commercial-grade device (0°C to 85°C junction temperature) with a speed grade of 8 and features a flash-based configuration memory. The 10M40DCF256I6G is an Industrial-grade device (-40°C to 100°C junction temperature) with a faster speed grade of 6 and uses a compact configuration memory. Both share the same 40,000 logic elements, 256-ball FineLine BGA package, and belong to the Intel MAX 10 family.
Are the 10M40DAF256C8G and 10M40DCF256I6G pin-to-pin compatible?
Yes, both devices are offered in the same 256-ball FineLine BGA (FBGA) package with identical pinouts as defined by Intel for the MAX 10 10M40 device density. However, designers must verify that the configuration scheme and any dual-purpose pins are correctly assigned for the specific configuration memory type (flash vs. compact) before substituting one for the other.
Can the 10M40DAF256C8G be used as a drop-in replacement for the 10M40DCF256I6G in an existing design?
Not directly. Although the package and pinout are the same, the 10M40DCF256I6G has a faster speed grade (6 vs. 8) and a wider industrial temperature range. A design validated for the 10M40DAF256C8G may not meet timing or environmental requirements if replaced with the industrial-grade part without re-timing analysis. Conversely, replacing the industrial part with the commercial part may violate the target application's temperature requirements.
What is the difference in configuration memory between the 10M40DAF256C8G and the 10M40DCF256I6G?
The 10M40DAF256C8G uses flash-based configuration memory (the "F" in the part number), which allows the device to be configured directly from internal flash. The 10M40DCF256I6G uses compact configuration memory (the "C" in the part number), which requires an external configuration source or a different internal configuration architecture. This difference affects boot time, configuration scheme, and external component requirements.
What are the operating temperature ranges for these two devices?
The 10M40DAF256C8G is rated for commercial operation with a junction temperature range of 0°C to 85°C. The 10M40DCF256I6G is rated for industrial operation with a junction temperature range of -40°C to 100°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled environments.
Do both devices support the same number of logic elements and embedded memory?
Yes, both the 10M40DAF256C8G and the 10M40DCF256I6G belong to the 10M40 density of the Intel MAX 10 family, offering 40,000 logic elements. They also provide the same embedded memory capacity and number of embedded multipliers, as these resources are determined by the device density (10M40) and not by the speed grade, temperature grade, or configuration memory type.
Which device is more suitable for a high-volume consumer application?
The 10M40DAF256C8G is generally more suitable for high-volume consumer applications because its commercial temperature grade and flash-based configuration memory reduce system cost by eliminating the need for external configuration devices. The 10M40DCF256I6G, with its industrial temperature range and faster speed grade, is typically reserved for industrial, automotive, or applications requiring wider temperature tolerance.
Are the speed grades of the 10M40DAF256C8G and 10M40DCF256I6G interchangeable in timing-critical designs?
No. The 10M40DAF256C8G has a speed grade of 8, while the 10M40DCF256I6G has a speed grade of 6, which is faster. A design that meets timing with the speed grade 6 device may not meet timing with the speed grade 8 device. Intel's timing models and datasheets must be consulted to confirm whether the slower device can satisfy the design's setup, hold, and clock-to-out requirements.