10M40DAF256C8G
訊息
- Lifecycle
- Active
- Stock
- 5091 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 10M40DAF256C8G 和 10M40DAF256C7G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 10M40DAF256C8G and 10M40DAF256C7G are functionally equivalent Intel MAX 10 FPGA devices sharing identical logic density, package, I/O count, and feature set; the only distinction is the speed grade, where the C7G offers a faster core timing closure than the C8G. Both parts are drop-in compatible at the board level, and selection should be driven by timing margin requirements rather than functional substitution.
訊息
訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DAF256C8G | 10M40DAF256C7G | Why it matters |
|---|---|---|---|
| Speed Grade | 8 | 7 | The speed grade determines the maximum operating frequency and timing closure margin; a grade 7 device is faster than a grade 8 device, so timing-critical designs may require the faster part. |
| Family | MAX 10 | MAX 10 | Both parts belong to the same device family, ensuring identical architecture, IP compatibility, and tool support. |
| Logic Elements (LEs) | 40000 | 40000 | Logic capacity must match the design's resource requirements; identical LE counts mean the same logic can be implemented in either device. |
| Package | 256-pin FBGA | 256-pin FBGA | Package type and pin count determine PCB footprint and pinout compatibility; matching packages allow drop-in replacement on the same board. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | The temperature grade defines the environmental conditions under which the device is guaranteed to operate reliably. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core supply voltage must match the board's power delivery design; identical voltages ensure electrical compatibility. |
| Configuration Memory | Internal configuration flash | Internal configuration flash | On-chip configuration flash enables instant-on operation and single-chip solution, affecting system boot architecture. |
| Number of I/O Pins | 178 | 178 | Available user I/O count determines how many external interfaces and peripherals can be connected. |
| Embedded Memory | 1260 Kbits | 1260 Kbits | Embedded memory blocks are used for data buffering, FIFOs, and on-chip storage; identical capacity supports the same memory-intensive functions. |
| Manufacturer | Intel / Altera | Intel / Altera | Same manufacturer ensures consistent quality, documentation, and long-term availability from a single source. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DAF256C8G | 10M40DAF256C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The primary difference is the speed grade. The 10M40DAF256C8G is specified with a speed grade of 8, while the 10M40DAF256C7G is specified with a faster speed grade of 7. Both devices are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-pin FineLine BGA (FBGA) package, with 40,000 logic elements and dual-configuration flash memory. The speed grade affects timing performance, with grade 7 offering faster maximum operating frequencies than grade 8.
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out specifications. The only difference is the speed grade, so they are pin-to-pin compatible and can be used on the same PCB footprint.
In terms of package and pinout, yes, they are drop-in compatible. However, because the speed grade differs, the timing characteristics change. A design originally compiled for the C8G speed grade may not meet timing if the C7G is substituted without recompiling the design with the correct speed grade setting. The C7G is faster, so it will generally meet or exceed the timing of the C8G, but the design should be recompiled and timing-verified for the C7G to ensure correct operation.
Both devices are specified for commercial temperature range operation, typically 0°C to 85°C junction temperature (TJ), as indicated by the "C" in the part number. This is consistent with Intel MAX 10 commercial-grade specifications.
Yes. Both the 10M40DAF256C8G and 10M40DAF256C7G are MAX 10 devices with the "D" designation indicating dual-configuration flash memory. This allows the device to store two configuration images and support features such as instant-on operation and dual-boot capability.
Both devices feature 40,000 logic elements (LEs), which is indicated by the "40" in the part number. They also include embedded memory blocks and user flash memory as per the Intel MAX 10 10M40 device specifications. The logic density and memory resources are identical between the two speed grades.
The selection depends on the timing requirements of the design. The 10M40DAF256C7G offers faster performance and is suitable for designs with tighter timing constraints. The 10M40DAF256C8G is a lower-cost option for designs that can meet timing at the slower speed grade. Intel's timing models and datasheets should be consulted to verify that the chosen speed grade meets all design timing requirements.
Yes. Both devices are offered in RoHS-compliant packages as part of Intel's environmental compliance program. The "G" suffix in the part number indicates RoHS compliance and lead-free packaging. Detailed compliance information is available in Intel's product material declarations.