Part A
10M40DAF256C8G
訊息
- Lifecycle
- Active
- Stock
- 5091 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M40DAF256C8G and 10M40DAF256I6G are functionally equivalent Intel MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration. The only material difference is the operating temperature grade, making the industrial-grade 10M40DAF256I6G a viable replacement for the commercial-grade 10M40DAF256C8G in most applications, provided the higher temperature range is acceptable and speed grade requirements are validated.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M40DAF256I6G
訊息
- Lifecycle
- Active
- Stock
- 4333 件
- Package
- LBGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DAF256C8G | 10M40DAF256I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing, affecting achievable system performance. |
| Logic Elements (LEs) | 40000 | 40000 | Defines the available programmable logic capacity for implementing user designs. |
| Package | 256-pin FBGA | 256-pin FBGA | Must match the PCB footprint and assembly process for physical interchangeability. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must be compatible with the board power design for correct operation. |
| Embedded Memory | 1260 kbit M9K | 1260 kbit M9K | On-chip memory capacity affects buffering, storage, and implementation of memory-intensive functions. |
| Multiplier Blocks (18x18) | 116 | 116 | Dedicated multipliers determine DSP throughput for arithmetic-intensive applications. |
| PLLs | 4 | 4 | PLL count limits the number of independent clock domains and frequency synthesis options. |
| Maximum User I/O | 178 | 178 | Available I/O pins constrain interfacing capability with external peripherals and systems. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M40DAF256C8G | 10M40DAF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M40DAF256C8G and the 10M40DAF256I6G?
The primary differences are the operating temperature grade and the speed grade. The 10M40DAF256C8G is specified for commercial temperature range (0°C to 85°C junction temperature) with a speed grade of 8, while the 10M40DAF256I6G is specified for industrial temperature range (-40°C to 100°C junction temperature) with a faster speed grade of 6. Both devices are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in a 256-pin FineLine BGA (FBGA) package with 40,000 logic elements (LEs) and dual configuration flash memory.
Are the 10M40DAF256C8G and 10M40DAF256I6G pin-to-pin compatible?
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined in the Intel MAX 10 device pin-out files. The package designation "256" and the "F" suffix indicate the same FBGA package type and pin count, so they are physically and electrically pin-to-pin compatible when used in the same PCB footprint.
Can the 10M40DAF256C8G be used as a direct drop-in replacement for the 10M40DAF256I6G in an existing design?
Not without design validation. Although the package and pinout are identical, the industrial-grade 10M40DAF256I6G has a faster speed grade (6 vs. 8) and a wider temperature range. A faster speed grade may affect timing closure, power consumption, and signal integrity. The commercial-grade 10M40DAF256C8G cannot operate reliably over the industrial temperature range. Intel recommends re-validating timing, power, and thermal performance before substituting one for the other.
What is the logic capacity and memory specification of these MAX 10 devices?
Both the 10M40DAF256C8G and 10M40DAF256I6G feature 40,000 logic elements (LEs), 1,260 Kbits of M9K embedded memory, and 288 Kbits of user flash memory (UFM). They also include 4 phase-locked loops (PLLs) and 2 analog-to-digital converter (ADC) blocks. These parameters are identical because both part numbers refer to the same MAX 10 10M40 device family with the same die.
What are the operating temperature ranges for the 10M40DAF256C8G and 10M40DAF256I6G?
The 10M40DAF256C8G is rated for the commercial temperature range with a junction temperature (Tj) of 0°C to 85°C. The 10M40DAF256I6G is rated for the industrial temperature range with a junction temperature (Tj) of -40°C to 100°C. These ratings are specified in the Intel MAX 10 FPGA Device Datasheet and must be observed for reliable operation.
What is the speed grade difference and how does it affect performance?
The 10M40DAF256C8G has a speed grade of 8, while the 10M40DAF256I6G has a speed grade of 6. In Intel FPGA nomenclature, a lower speed grade number indicates faster performance. Therefore, the 10M40DAF256I6G offers shorter propagation delays and higher maximum operating frequencies (fMAX) than the 10M40DAF256C8G. Designers must use the correct speed grade in timing analysis to ensure proper operation.
Do both devices support dual configuration flash memory and instant-on operation?
Yes. Both the 10M40DAF256C8G and 10M40DAF256I6G are MAX 10 devices with dual configuration flash memory, which allows two configuration images to be stored on-chip. They support instant-on operation, meaning the device can begin functioning immediately after power-up without an external configuration device. This feature is common to all MAX 10 10M40 devices regardless of temperature or speed grade.
Which device should be selected for an industrial application with ambient temperatures down to -40°C?
The 10M40DAF256I6G must be selected for industrial applications requiring operation down to -40°C ambient or junction temperature. The 10M40DAF256C8G is only rated for 0°C to 85°C junction temperature and is not guaranteed to function correctly below 0°C. Always verify the actual junction temperature in the target application and refer to the Intel MAX 10 FPGA Device Datasheet for derating guidelines.
Are these devices RoHS compliant and lead-free?
Yes. Both the 10M40DAF256C8G and 10M40DAF256I6G are offered in RoHS-compliant, lead-free packages as stated in Intel's product material declarations and distributor product pages. The "G" suffix in the part number indicates RoHS compliance and lead-free (Pb-free) construction. Customers should confirm the specific ordering code and environmental status with Intel or an authorized distributor before finalizing a design.