10M16SCU169C8G
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- Lifecycle
- Active
- Stock
- 3068 件
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 10M16SCU169C8G 和 10M16DCU324I6G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 10M16SCU169C8G and 10M16DCU324I6G are both Intel MAX 10 FPGA devices sharing 16,000 logic elements, but they differ in package, speed grade, and temperature range. The 10M16SCU169C8G offers a faster C8 speed grade in a 169-pin UBGA package with commercial temperature support, while the 10M16DCU324I6G provides an I6 speed grade in a 324-pin UBGA package with industrial temperature support. Functional substitutability is possible only when the target design accommodates the package footprint, timing margin, and thermal environment differences.
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訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SCU169C8G | 10M16DCU324I6G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Same device family ensures similar architecture, toolchain support, and IP compatibility. |
| Logic Elements (LEs) | 16000 | 16000 | Equal logic capacity means comparable ability to implement the same design logic. |
| Package | 169-pin UBGA | 324-pin UBGA | Different package and pin count affect PCB footprint, routing, and mechanical compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Industrial temperature range is required for harsh environments and affects reliability. |
| Speed Grade | 8 | 6 | A faster speed grade (lower number) allows higher clock frequencies and tighter timing closure. |
| Embedded Memory (M9K blocks) | 549 kbits | 549 kbits | Identical embedded memory supports the same on-chip buffering and storage needs. |
| User I/O Count | 130 | 246 | Different I/O counts limit or expand peripheral interfacing options. |
| Supply Voltage | 1.2 V core | 1.2 V core | Same core voltage simplifies power supply design and board-level compatibility. |
| Configuration Method | Instant-on, dual configuration | Instant-on, dual configuration | Identical configuration features support the same boot and fail-safe strategies. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M16SCU169C8G | 10M16DCU324I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 1000 |
| Number of Logic Elements/Cells | - | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 246 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 1000 | - |
| Number of Logic Elements / Cells | 16000 | - |
| Packaging | Tray | - |
The 10M16SCU169C8G is a MAX 10 FPGA in a 169-pin UBGA package with commercial temperature grade (C8 speed grade), while the 10M16DCU324I6G is a MAX 10 FPGA in a 324-pin UBGA package with industrial temperature grade (I6 speed grade). Both devices feature 16,000 logic elements (LEs), but they differ in package, pin count, speed grade, and operating temperature range.
No. The 10M16SCU169C8G uses a 169-pin UBGA package, while the 10M16DCU324I6G uses a 324-pin UBGA package. The different pin counts and package sizes mean they are not pin-to-pin compatible and cannot be used as direct drop-in replacements without PCB redesign.
Yes. Both the 10M16SCU169C8G and 10M16DCU324I6G are members of the Intel MAX 10 FPGA family with 16,000 logic elements (LEs). They also feature the same embedded memory capacity and number of embedded multipliers, as these resources are determined by the device density (10M16) rather than the package or speed grade.
The 10M16SCU169C8G has a commercial temperature grade, typically rated for 0°C to 85°C junction temperature. The 10M16DCU324I6G has an industrial temperature grade, typically rated for -40°C to 100°C junction temperature. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for standard office or consumer environments.
The C8 suffix on the 10M16SCU169C8G indicates a commercial temperature grade with speed grade 8. The I6 suffix on the 10M16DCU324I6G indicates an industrial temperature grade with speed grade 6. A lower speed grade number generally corresponds to faster performance, so the I6 device offers faster timing characteristics than the C8 device, though the industrial temperature range may affect overall achievable performance.
No, not without significant redesign. The 10M16DCU324I6G has a different package (324-pin UBGA vs. 169-pin UBGA), different pinout, and different speed grade. While both have the same 16,000 LE density, the physical and electrical differences prevent direct substitution. A new PCB layout and timing analysis would be required.
The 10M16DCU324I6G is more suitable for industrial applications due to its industrial temperature grade rating (typically -40°C to 100°C junction temperature). The 10M16SCU169C8G is rated for commercial temperatures (typically 0°C to 85°C junction temperature) and is better suited for consumer or office environments.
Yes. Both the 10M16SCU169C8G and 10M16DCU324I6G support the same MAX 10 FPGA family features, including instant-on configuration, integrated analog-to-digital converters (ADCs), and flash memory for single-chip configuration. Feature availability is determined by the device family and density, not by package or temperature grade.