Part A
10M16SCU169C8G
阿爾特拉
- Lifecycle
- Active
- Stock
- 3068 件
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DCU324C8G is a functional replacement candidate for the 10M16SCU169C8G, sharing the same Intel MAX 10 device family, 16,000 logic elements, and commercial temperature grade. However, the two devices differ in package type and pin count, requiring PCB redesign and validation before substitution.
Logic Density
High match
Package Type
Not compatible
Pin Count
Not compatible
Operating Temperature
High match
Parts at a glance
Part B
10M16DCU324C8G
阿爾特拉
- Lifecycle
- Active
- Stock
- 5166 件
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SCU169C8G | 10M16DCU324C8G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, which supports similar design flows and IP reuse. |
| Logic Elements (LEs) | 16000 | 16000 | Matching logic capacity ensures equivalent logic density for the target design. |
| Package | 169-pin UBGA | 324-pin UBGA | Different package sizes affect PCB footprint, routing, and available I/O. |
| Number of I/Os | 130 | 246 | I/O count determines how many external signals the device can interface with. |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | Commercial temperature range suitability for standard environments. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage compatibility ensures power supply design consistency. |
| Embedded Memory | 588 kbits | 588 kbits | On-chip memory capacity affects data buffering and storage capabilities. |
| DSP Blocks | 45 | 45 | DSP resources determine signal processing performance for arithmetic operations. |
| Configuration Method | Instant-on, dual configuration | Instant-on, dual configuration | Configuration features impact boot time and system redundancy options. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SCU169C8G | 10M16DCU324C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Digi Key Programmable | Not Verified | Not Verified |
| Number of LA Bs / CL Bs | 1000 | 1000 |
| Number of Logic Elements / Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 246 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Packaging | Tray | Tray |
Frequently asked questions
What are the 10M16SCU169C8G and 10M16DCU324C8G devices?
Both are Intel (formerly Altera) MAX 10 family field-programmable gate arrays (FPGAs). The 10M16SCU169C8G is a 16,000-logic-element (LE) device in a 169-pin UBGA package, while the 10M16DCU324C8G is a 16,000-LE device in a 324-pin UBGA package. Both share the same 10M16 density and C8 speed grade, but differ in package, pin count, and I/O availability.
What is the difference in package and pin count between the two devices?
The 10M16SCU169C8G uses a 169-pin UBGA (Micro FineLine BGA) package, whereas the 10M16DCU324C8G uses a 324-pin UBGA package. The larger 324-pin package provides more user I/O pins and additional power/ground pins compared to the 169-pin version.
Do both devices have the same logic density and speed grade?
Yes. Both are 10M16 devices with 16,000 logic elements and both carry the C8 speed grade, indicating the same core performance rating within the MAX 10 family. The primary differences are package type, pin count, and available I/O.
Can the 10M16SCU169C8G be used as a drop-in replacement for the 10M16DCU324C8G?
No. The two devices have different package footprints (169-pin UBGA vs 324-pin UBGA), different pin counts, and different I/O assignments. A direct drop-in replacement is not possible without redesigning the PCB land pattern and revalidating pin functions against the respective datasheets.
Which device offers more user I/O?
The 10M16DCU324C8G, with its 324-pin UBGA package, generally provides more user I/O pins than the 10M16SCU169C8G in the 169-pin UBGA package. The exact I/O count should be confirmed from the official Intel MAX 10 device pin-out files for each package.
Are both devices part of the same MAX 10 product family and configuration options?
Yes. Both belong to the Intel MAX 10 FPGA family and support the same family-level features, including integrated flash configuration, analog-to-digital converter (ADC) blocks, and instant-on capability. Configuration and feature availability may vary by package and pin count, so designers should verify against the MAX 10 device handbook.
What should be verified before selecting between these two devices?
Designers should verify package footprint, available user I/O, pin assignments, power supply requirements, and configuration scheme against the official Intel MAX 10 datasheet and pin-out files. The 169-pin device suits space-constrained designs, while the 324-pin device supports applications requiring more I/O.