Part A
10M16SCU169C8G
阿爾特拉
- Lifecycle
- Active
- Stock
- 3068 件
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DCU324A7G is a viable functional replacement candidate for the 10M16SCU169C8G in non-timing-critical applications, sharing the same 16,000-logic-element Intel MAX 10 FPGA architecture and core feature set. However, designers must account for the different package footprint, lower speed grade, and narrower commercial temperature range before committing to a drop-in substitution.
Logic Density
High match
Package Type
Validation required
Speed Grade
Validation required
Operating Temperature
Not compatible
Parts at a glance
Part B
10M16DCU324A7G
訊息
- Lifecycle
- Active
- Stock
- 9937 件
- Package
- LFBGA-324
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SCU169C8G | 10M16DCU324A7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Same device family ensures similar architecture, toolchain support, and IP compatibility. |
| Logic Elements (LEs) | 16000 | 16000 | Matching logic density allows equivalent logic implementation and resource utilization. |
| Package | 169-pin UBGA | 324-pin UBGA | Different package footprints affect PCB layout, routing, and mechanical compatibility. |
| Operating Temperature | Commercial (0°C to 85°C) | Automotive (-40°C to 125°C) | Temperature grade determines suitability for commercial versus automotive or industrial environments. |
| Speed Grade | 8 | 7 | Speed grade affects maximum operating frequency and timing closure margins. |
| User I/O Count | 130 | 246 | I/O count determines how many external signals and peripherals can be interfaced. |
| Embedded Memory | 588288 bits | 588288 bits | On-chip memory capacity impacts buffering, data storage, and implementation of memory-intensive functions. |
| Embedded Multiplier (18x18) | 45 | 45 | DSP blocks enable efficient implementation of arithmetic and signal processing functions. |
| Configuration Flash | Yes (integrated) | Yes (integrated) | Integrated configuration memory simplifies board design by eliminating external configuration devices. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SCU169C8G | 10M16DCU324A7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 1000 |
| Number of Logic Elements/Cells | - | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 246 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 125°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 1000 | - |
| Number of Logic Elements / Cells | 16000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the 10M16SCU169C8G and the 10M16DCU324A7G?
The 10M16SCU169C8G is a MAX 10 FPGA in a 169-pin UBGA package with commercial temperature grade (C8 speed grade), while the 10M16DCU324A7G is a MAX 10 FPGA in a 324-pin UBGA package with automotive temperature grade (A7 speed grade). Both devices feature 16,000 logic elements (LEs), but they differ in package, speed grade, and operating temperature range.
Do the 10M16SCU169C8G and 10M16DCU324A7G have the same logic density?
Yes. Both devices are part of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with equivalent embedded memory and DSP resources as defined by the MAX 10 10M16 device specification.
Are the 10M16SCU169C8G and 10M16DCU324A7G pin-to-pin compatible?
No. The 10M16SCU169C8G uses a 169-pin UBGA package, while the 10M16DCU324A7G uses a 324-pin UBGA package. The different pin counts and ball maps mean they are not pin-to-pin compatible and require different PCB footprints.
What temperature grades do the 10M16SCU169C8G and 10M16DCU324A7G support?
The 10M16SCU169C8G is rated for commercial temperature operation (typically 0°C to 85°C junction temperature), while the 10M16DCU324A7G is rated for automotive temperature operation (typically -40°C to 125°C junction temperature), as indicated by the "C" and "A" suffixes in their ordering codes.
What do the speed grade suffixes C8 and A7 indicate for these MAX 10 FPGAs?
The C8 suffix on the 10M16SCU169C8G indicates a commercial-grade speed grade 8, while the A7 suffix on the 10M16DCU324A7G indicates an automotive-grade speed grade 7. Speed grade 7 is faster than speed grade 8, meaning the 10M16DCU324A7G can achieve higher maximum operating frequencies for the same logic design.
Can the 10M16SCU169C8G be used as a direct substitute for the 10M16DCU324A7G in an existing design?
No. Direct substitution is not possible because the two devices differ in package (169-pin UBGA vs 324-pin UBGA), speed grade (8 vs 7), and temperature grade (commercial vs automotive). A redesign of the PCB footprint and revalidation of timing and thermal requirements would be necessary.
Do both the 10M16SCU169C8G and 10M16DCU324A7G support instant-on configuration and integrated flash?
Yes. Both devices belong to the Intel MAX 10 FPGA family, which features integrated flash memory for instant-on configuration, dual configuration images, and analog-to-digital converter (ADC) blocks, as specified in the MAX 10 device family documentation.
Which device is more suitable for automotive applications, the 10M16SCU169C8G or the 10M16DCU324A7G?
The 10M16DCU324A7G is more suitable for automotive applications because its "A" temperature grade and A7 speed grade are specified for automotive operating conditions, whereas the 10M16SCU169C8G is a commercial-grade device intended for standard temperature environments.