Part A
10M16DAF256I7G
訊息
- Lifecycle
- Active
- Stock
- 6815 件
- Package
- BGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256I7G and 10M16DCF484A7G are both Intel MAX 10 FPGA devices sharing the same 16,000 logic element density and non-volatile instant-on architecture, making them functionally related candidates. However, they differ in package type, pin count, and operating temperature grade, so a direct drop-in replacement is not possible without verifying board-level compatibility. The 10M16DAF256I7G offers a finer-pitch 256-ball FineLine BGA package with industrial temperature support, while the 10M16DCF484A7G uses a 484-ball FineLine BGA package rated for automotive temperature ranges. Designers must validate footprint, thermal, and I/O requirements before substituting.
Logic Density
High match
Package Type
Validation required
Pin Count
Not compatible
Operating Temperature
Validation required
Parts at a glance
Part B
10M16DCF484A7G
訊息
- Lifecycle
- Active
- Stock
- 4360 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256I7G | 10M16DCF484A7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, which supports similar design flows and IP reuse. |
| Logic Elements (LEs) | 16000 | 16000 | Matching logic capacity ensures comparable ability to implement the same digital logic functions. |
| Package | 256-pin FBGA | 484-pin FBGA | Different package sizes affect PCB footprint, routing, and mechanical compatibility. |
| Operating Temperature | -40°C to 100°C (Industrial) | -40°C to 125°C (Automotive) | Temperature grade determines suitability for harsh or automotive environments. |
| Speed Grade | 7 | 7 | Same speed grade indicates similar maximum operating frequency and timing performance. |
| Supply Voltage | 1.2 V core | 1.2 V core | Identical core voltage simplifies power supply design and compatibility. |
| I/O Count | 178 | 360 | Different I/O counts affect the number of peripherals and interfaces that can be connected. |
| Embedded Memory | 588 kbits | 588 kbits | Equal embedded memory supports similar on-chip data buffering and storage needs. |
| Configuration Method | Instant-on, dual configuration | Instant-on, dual configuration | Same configuration features allow identical boot and reconfiguration strategies. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256I7G | 10M16DCF484A7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256I7G and the 10M16DCF484A7G?
The primary differences are package type, pin count, and operating temperature grade. The 10M16DAF256I7G is a 256-pin FineLine BGA (FBGA) device with an industrial temperature grade (I7), while the 10M16DCF484A7G is a 484-pin FineLine BGA device with an automotive temperature grade (A7). Both are Intel (Altera) MAX 10 family FPGAs with 16,000 logic elements.
Do both devices have the same logic density and embedded memory?
Yes. Both the 10M16DAF256I7G and 10M16DCF484A7G are MAX 10 10M16 devices featuring 16,000 logic elements (LEs) and 549,376 bits of M9K embedded memory, as specified in the Intel MAX 10 device family datasheet.
Are the 10M16DAF256I7G and 10M16DCF484A7G pin-to-pin compatible?
No. The 10M16DAF256I7G uses a 256-pin FBGA package, while the 10M16DCF484A7G uses a 484-pin FBGA package. The different pin counts and package footprints mean they are not pin-to-pin compatible and cannot be interchanged without a PCB redesign.
What temperature grades do these two devices support?
The 10M16DAF256I7G is rated for the industrial temperature grade (I7), typically -40°C to +100°C junction temperature. The 10M16DCF484A7G is rated for the automotive temperature grade (A7), typically -40°C to +125°C junction temperature, per Intel MAX 10 ordering information.
Do both devices support the same configuration and power supply options?
Yes. Both are MAX 10 FPGAs supporting dual configuration (internal configuration flash and external configuration), and both operate with the same core and I/O voltage options defined in the MAX 10 datasheet, including 1.2 V core and flexible I/O standards such as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V.
Can the 10M16DCF484A7G be used as a drop-in replacement for the 10M16DAF256I7G?
No. Due to the different package sizes (256-pin vs 484-pin FBGA), different pinouts, and different temperature grades, the 10M16DCF484A7G is not a drop-in replacement for the 10M16DAF256I7G. A board redesign and thermal validation would be required.
Which device offers more user I/O pins?
The 10M16DCF484A7G offers more user I/O pins due to its larger 484-pin FBGA package. The 10M16DAF256I7G in the 256-pin FBGA package provides fewer user I/O pins. Exact I/O counts should be confirmed from the Intel MAX 10 device pin-out files for each package.
Are both devices part of the same Intel MAX 10 product family?
Yes. Both the 10M16DAF256I7G and 10M16DCF484A7G belong to the Intel MAX 10 FPGA family, which features non-volatile integrated configuration flash, instant-on capability, and integrated analog-to-digital converter (ADC) blocks.