Part A
10M16DCF484C8G
訊息
- Lifecycle
- Active
- Stock
- 6504 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DCF484C8G and 10M16DAF256I7G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and equivalent core architecture, making them functionally interchangeable for logic implementation. However, they differ in package type, operating temperature grade, and speed grade, so the 10M16DAF256I7G is not a direct drop-in replacement for the 10M16DCF484C8G without PCB redesign and thermal validation.
Logic Density
High match
Package Type
Validation required
Operating Temperature
Not compatible
Speed Grade
Validation required
Parts at a glance
Part B
10M16DAF256I7G
訊息
- Lifecycle
- Active
- Stock
- 6815 件
- Package
- BGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCF484C8G | 10M16DAF256I7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Same device family ensures similar architecture, toolchain support, and IP compatibility. |
| Logic Elements (LEs) | 16000 | 16000 | Equal logic capacity means both can implement designs of the same complexity. |
| Package | 484-pin FBGA | 256-pin FBGA | Different packages affect PCB footprint, routing, and available I/O pins. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Industrial grade supports harsher environments; commercial grade is limited to benign conditions. |
| Speed Grade | 8 | 7 | A lower speed grade number indicates faster performance and higher achievable clock frequencies. |
| Maximum User I/O Pins | 320 | 178 | More I/O pins allow interfacing with more peripherals and wider buses. |
| Embedded Memory (M9K blocks) | 549 kbits | 549 kbits | Identical embedded memory supports the same buffering and storage requirements. |
| 18x18 Multipliers | 45 | 45 | Equal DSP resources enable comparable signal processing performance. |
| Configuration Flash | Integrated | Integrated | Single-chip configuration simplifies board design and reduces external components. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DCF484C8G | 10M16DAF256I7G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 320 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DCF484C8G and the 10M16DAF256I7G?
The 10M16DCF484C8G is a MAX 10 FPGA in a 484-pin FineLine BGA package with commercial temperature grade (0°C to 85°C junction) and speed grade 8. The 10M16DAF256I7G is a MAX 10 FPGA in a 256-pin FineLine BGA package with industrial temperature grade (-40°C to 100°C junction) and speed grade 7. Both devices feature 16,000 logic elements, but differ in package, temperature range, and speed grade.
Are the 10M16DCF484C8G and 10M16DAF256I7G pin-to-pin compatible?
No. The 10M16DCF484C8G uses a 484-pin FineLine BGA package, while the 10M16DAF256I7G uses a 256-pin FineLine BGA package. The different pin counts and package outlines make them physically and electrically incompatible for direct PCB replacement.
Do both devices have the same logic density and embedded memory?
Yes. Both the 10M16DCF484C8G and 10M16DAF256I7G are members of the Intel MAX 10 FPGA family with 16,000 logic elements. They also feature the same embedded memory capacity of 588 kbits and the same number of 18x18 multipliers (32) as per the MAX 10 device family specifications.
Can the 10M16DAF256I7G operate in a wider temperature range than the 10M16DCF484C8G?
Yes. The 10M16DAF256I7G is rated for industrial temperature operation with a junction temperature range of -40°C to 100°C. The 10M16DCF484C8G is rated for commercial temperature operation with a junction temperature range of 0°C to 85°C. The industrial-grade device is suitable for harsher environments.
Which device offers a faster speed grade, the 10M16DCF484C8G or the 10M16DAF256I7G?
The 10M16DCF484C8G has speed grade 8, while the 10M16DAF256I7G has speed grade 7. In Intel FPGA nomenclature, a lower speed grade number indicates faster performance. Therefore, the 10M16DAF256I7G (speed grade 7) is the faster device of the two.
Are the I/O pin counts different between the 10M16DCF484C8G and the 10M16DAF256I7G?
Yes. The 10M16DCF484C8G in the 484-pin FineLine BGA package provides up to 360 user I/O pins. The 10M16DAF256I7G in the 256-pin FineLine BGA package provides up to 178 user I/O pins. The larger package offers significantly more I/O capability.
Do both devices support the same configuration and power supply options?
Yes. Both the 10M16DCF484C8G and 10M16DAF256I7G are MAX 10 FPGAs that support single or dual configuration from internal flash, instant-on operation, and a 3.3 V, 2.5 V, or 1.8 V I/O supply. They also share the same core voltage requirements as defined in the Intel MAX 10 device datasheet.
Can the 10M16DCF484C8G be used as a drop-in replacement for the 10M16DAF256I7G in an existing design?
No. The two devices differ in package footprint (484-pin vs 256-pin FineLine BGA), temperature grade (commercial vs industrial), and speed grade (8 vs 7). A drop-in replacement is not possible without redesigning the PCB, revalidating thermal performance, and re-timing the design for the different speed grade.