Part A
10M16DAF256I7G
訊息
- Lifecycle
- Active
- Stock
- 6815 件
- Package
- BGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256I7G and 10M16DAF484I6G are functionally compatible as both are Intel MAX 10 FPGA devices with identical 16,000 logic elements, 549 KB embedded memory, and 396 embedded 18x18 multipliers. The primary distinction lies in package type and speed grade, which may affect PCB layout and timing closure. Designers should validate footprint compatibility and timing performance before substituting.
Logic Density
High match
Embedded Memory
High match
Package Type
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M16DAF484I6G
訊息
- Lifecycle
- Active
- Stock
- 6552 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256I7G | 10M16DAF484I6G | Why it matters |
|---|---|---|---|
| Package / Pin Count | 256-pin FBGA | 484-pin FBGA | Different package and pin count affect PCB footprint, routing, and available I/O, so they are not drop-in replacements. |
| Speed Grade | 7 (faster) | 6 (slower) | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet the same performance requirements. |
| Maximum User I/O | 178 | 346 | I/O count limits how many external signals can be interfaced; the 484-pin device supports more peripherals. |
| Logic Elements (LEs) | 16000 | 16000 | Logic capacity determines the complexity of digital designs that can be implemented; identical capacity supports similar logic density. |
| Embedded Memory | 562 kbit | 562 kbit | On-chip memory affects buffering, FIFO depth, and data storage capability; matching memory supports similar applications. |
| 18x18 Multipliers | 160 | 160 | Dedicated multipliers are critical for DSP and arithmetic functions; identical count supports comparable signal processing performance. |
| Supply Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | Core voltage must match the board power design; identical voltage requirements simplify power supply compatibility. |
| Operating Temperature | -40°C to 100°C | -40°C to 100°C | Industrial temperature range ensures reliable operation in harsh environments; matching range supports similar application conditions. |
| Package Size | 17 x 17 mm | 23 x 23 mm | Physical dimensions affect board layout and space constraints; the larger package requires more PCB area. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256I7G | 10M16DAF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256I7G and the 10M16DAF484I6G?
The primary differences are package type, pin count, and speed grade. The 10M16DAF256I7G is a 256-pin FineLine BGA (FBGA) device with an I7 speed grade, while the 10M16DAF484I6G is a 484-pin FBGA device with a faster I6 speed grade. Both are Intel (Altera) MAX 10 FPGA devices with 16,000 logic elements and dual configuration flash memory.
Are the 10M16DAF256I7G and 10M16DAF484I6G functionally interchangeable?
No. Although both are MAX 10 10M16 devices with the same logic density and feature set, they differ in package footprint, pin count, and speed grade. The 256-pin and 484-pin packages have different PCB land patterns and pinouts, so they are not drop-in replacements. The speed grade difference (I7 vs I6) also affects timing performance.
What is the logic density of the 10M16DAF256I7G and 10M16DAF484I6G?
Both devices feature 16,000 logic elements (LEs), which is the defining characteristic of the MAX 10 10M16 family. They also include the same embedded memory blocks, DSP blocks, and analog-to-digital converter (ADC) blocks as part of the MAX 10 architecture.
What does the speed grade suffix I7 and I6 indicate for these devices?
The I7 and I6 suffixes denote industrial temperature range speed grades. I6 is a faster speed grade than I7, meaning the 10M16DAF484I6G can achieve higher maximum operating frequencies for certain timing paths compared to the 10M16DAF256I7G. Both are rated for industrial temperature operation.
Do both devices support dual configuration flash memory?
Yes. Both the 10M16DAF256I7G and 10M16DAF484I6G are MAX 10 devices that include dual configuration flash memory, allowing them to store two configuration images. This supports features such as fail-safe updates and dual-boot functionality.
Which package options are available for the 10M16DAF256I7G and 10M16DAF484I6G?
The 10M16DAF256I7G uses a 256-pin FineLine BGA (FBGA) package, while the 10M16DAF484I6G uses a 484-pin FineLine BGA (FBGA) package. The 484-pin package provides more user I/O pins than the 256-pin package, which is a key consideration for designs requiring higher pin counts.
Can the 10M16DAF256I7G be used as a substitute for the 10M16DAF484I6G in an existing design?
No, not without significant redesign. The 256-pin and 484-pin packages have different physical dimensions, ball counts, and pin assignments. Additionally, the speed grade difference means timing closure must be re-evaluated. A direct substitution is not possible without verifying pin compatibility and timing requirements against the manufacturer datasheet.
Are both devices part of the Intel MAX 10 FPGA family?
Yes. Both the 10M16DAF256I7G and 10M16DAF484I6G are Intel MAX 10 family FPGAs, specifically the 10M16 density variant. They share the same architecture, including non-volatile configuration flash, instant-on capability, and support for the same development tools such as Intel Quartus Prime.