規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Series | Spartan®-3A |
| Part Status | Active |
| Number of LABs/CLBs | 448 |
| Number of Logic Elements/Cells | 4032 |
| Total RAM Bits | 294912 |
| Number of I/O | 248 |
| Number of Gates | 200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
概述
Equivalent
The XC3S200A-4FGG320I is a Spartan-3A FPGA. Equivalent alternatives include:
1. XC3S200A-4FGG320C (Commercial grade, same specs).
2. XC3S400A-4FGG320I (Higher capacity, same package).
3. Lattice MachXO2-1200 (Similar logic, lower cost).
4. Altera Cyclone II EP2C5 (Comparable density).
Check pin compatibility and features before substitution. For exact replacements, consider Xilinx's Spartan-3A family or newer Spartan-6/7 series for upgrades.
1. XC3S200A-4FGG320C (Commercial grade, same specs).
2. XC3S400A-4FGG320I (Higher capacity, same package).
3. Lattice MachXO2-1200 (Similar logic, lower cost).
4. Altera Cyclone II EP2C5 (Comparable density).
Check pin compatibility and features before substitution. For exact replacements, consider Xilinx's Spartan-3A family or newer Spartan-6/7 series for upgrades.
Features
The XC3S200A-4FGG320I is a Spartan-3A FPGA from Xilinx with key features:
- Logic Cells: 200K (4,320 slices, 4 LUTs/slice)
- Memory: 216 Kb block RAM (12 × 18 Kb)
- DSP: 16 × 18-bit multipliers
- I/O Pins: 221 (supports LVCMOS, LVTTL, HSTL, SSTL)
- Speed Grade: -4 (moderate performance)
- Package: FGG320 (Fine-pitch BGA, 320 pins)
- Clock Management: 4 DCMs (Digital Clock Managers)
- Operating Voltage: 1.2V core, 3.3V/2.5V I/O
- Configuration: SPI, BPI, or JTAG
- Max Frequency: ~300 MHz (varies by design)
Ideal for embedded, industrial, and consumer applications requiring low-cost, low-power FPGAs.
- Logic Cells: 200K (4,320 slices, 4 LUTs/slice)
- Memory: 216 Kb block RAM (12 × 18 Kb)
- DSP: 16 × 18-bit multipliers
- I/O Pins: 221 (supports LVCMOS, LVTTL, HSTL, SSTL)
- Speed Grade: -4 (moderate performance)
- Package: FGG320 (Fine-pitch BGA, 320 pins)
- Clock Management: 4 DCMs (Digital Clock Managers)
- Operating Voltage: 1.2V core, 3.3V/2.5V I/O
- Configuration: SPI, BPI, or JTAG
- Max Frequency: ~300 MHz (varies by design)
Ideal for embedded, industrial, and consumer applications requiring low-cost, low-power FPGAs.
Pinout
The XC3S200A-4FGG320I is a Spartan-3A FPGA from Xilinx in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package.
### Key Features:
- Pin Count: 320 (1.0 mm ball pitch).
- Logic Cells: 200K (4,032 logic slices).
- I/O Pins: 221 user I/Os (supports LVCMOS, LVTTL, HSTL, SSTL).
- Block RAM: 216 Kb (12 × 18 Kb blocks).
- DSP Slices: 16 (18 × 18 multipliers).
- Clock Management: 4 DCMs (Digital Clock Managers).
- Speed Grade: -4 (moderate performance).
### Applications:
Used in embedded systems, communications, and industrial control due to its balance of logic, I/O, and power efficiency.
### Key Features:
- Pin Count: 320 (1.0 mm ball pitch).
- Logic Cells: 200K (4,032 logic slices).
- I/O Pins: 221 user I/Os (supports LVCMOS, LVTTL, HSTL, SSTL).
- Block RAM: 216 Kb (12 × 18 Kb blocks).
- DSP Slices: 16 (18 × 18 multipliers).
- Clock Management: 4 DCMs (Digital Clock Managers).
- Speed Grade: -4 (moderate performance).
### Applications:
Used in embedded systems, communications, and industrial control due to its balance of logic, I/O, and power efficiency.
Application
The XC3S200A-4FGG320I, a Spartan-3A FPGA, is used in:
- Embedded Systems (control, interfacing)
- Industrial Automation (motor control, sensors)
- Consumer Electronics (displays, audio processing)
- Communications (protocol bridging, networking)
- Medical Devices (portable diagnostics, imaging)
- Military/Aerospace (ruggedized applications)
Its low cost, moderate logic density (200K gates), and 320-pin BGA package make it suitable for cost-sensitive, space-constrained designs.
- Embedded Systems (control, interfacing)
- Industrial Automation (motor control, sensors)
- Consumer Electronics (displays, audio processing)
- Communications (protocol bridging, networking)
- Medical Devices (portable diagnostics, imaging)
- Military/Aerospace (ruggedized applications)
Its low cost, moderate logic density (200K gates), and 320-pin BGA package make it suitable for cost-sensitive, space-constrained designs.
Package
The XC3S200A-4FGG320I is a Spartan-3A FPGA from Xilinx. It comes in a Fine-Pitch Ball Grid Array (FBGA) package with the designation FGG320. This package has 320 pins, a 1.0 mm ball pitch, and is lead-free (RoHS compliant). It is designed for surface-mount assembly, offering a compact footprint for embedded and high-density applications.
