圖片僅供參考
THGAMVG7T13BAIL
+物料清單IC FLASH 128GBIT EMMC 153FBGA
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製造商Kioxia美國股份有限公司。
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製造商部分 #THGAMVG7T13BAIL
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有存貨1514
365 天品質保證
7*24 小時服務保證
90-日售後保障
正品保證
規格
| 屬性 | 價值 |
| Package | Tray |
| ProductStatus | Active |
概述
Description
1. Contextual Clarity: Determine the context in which THGAMVG7T13BAIL is used. It could relate to a class, a project, or a specific domain like technology or finance.
2. Purpose and Use: Identify the purpose of THGAMVG7T13BAIL. Is it a part of a broader system or a standalone element? Understanding its role can help explain its significance.
3. Components: If applicable, break down the identifier to uncover any meaningful subcomponents that might suggest functionality or classification.
4. Access and Relevance: Establish who needs to know about THGAMVG7T13BAIL and why. Is it relevant for a particular group or industry?
For a precise introduction, additional details about THGAMVG7T13BAIL are necessary to tailor the explanation to its specific application or significance.
Equivalent
Features
1. Processor and Graphics: Powered by high-performance processors such as Intel or AMD Ryzen, paired with NVIDIA GeForce RTX graphics cards for enhanced gaming capabilities.
2. Display: High refresh rate screen, possibly 144Hz or 240Hz, often with a Full HD or QHD resolution for smooth and detailed visuals.
3. Cooling Solutions: Advanced cooling technologies, like multiple dedicated heat pipes and fans, to maintain optimal performance during intense gaming sessions.
4. Memory and Storage: Configured with ample RAM (16GB or more) and fast SSD storage (512GB or more) for quick load times and multitasking.
5. Design and Build: Sleek and sturdy design with customizable RGB lighting, and a mechanical keyboard for responsive inputs.
6. Connectivity: Comprehensive connectivity options including multiple USB ports, HDMI, and possibly Thunderbolt support, alongside Wi-Fi 6 for faster internet speeds.
These features cater to gamers seeking high-end performance and immersive gaming experiences.
Pinout
The primary function of the THGAMVG7T13BAIL is to provide non-volatile storage for a variety of devices, including smartphones, tablets, and other embedded systems. It combines NAND Flash memory with a controller and standard interface in a single package, simplifying the integration process for device manufacturers.
The e-MMC interface supports a range of functions, including storage read/write operations, error correction, wear leveling, and garbage collection. This chip is typically used where high-density storage is required in a compact form factor, offering a balance of performance, size, and power efficiency.