規格
| 屬性 | 價值 |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | TrenchFET® |
| Part Status | Active |
| FET Type | 2 P-Channel (Dual) |
| FET Feature | Standard |
| Drain to Source Voltage (Vdss) | 30V |
| Current - Continuous Drain(Id) @ 25°C | 8A |
| Rds On(Max) @ Id Vgs | 29mOhm @ 7.3A, 10V |
| Vgs(th)(Max) @ Id | 3V @ 250µA |
| Gate Charge(Qg)(Max) @ Vgs | 50nC @ 10V |
| Input Capacitance(Ciss)(Max) @ Vds | 1350pF @ 15V |
| Power - Max | 5W |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
概述
Description
The SI4925DDY-T1-GE3 is a dual P-channel MOSFET from Vishay Siliconix, designed for high-efficiency power management in applications like load switches, battery protection, and DC-DC converters.
### Key Features:
- Voltage Rating: -30V (drain-to-source).
- Current Handling: -5.8A (continuous drain current).
- Low On-Resistance: 36mΩ (max at VGS = -10V), reducing power losses.
- Compact Package: PowerPAK® SO-8 for space-constrained designs.
- Optimized for Fast Switching: Low gate charge (Qg) and capacitance.
### Applications:
- Power distribution in portable devices.
- Battery management systems.
- Motor control and power supplies.
### Advantages:
- High efficiency due to low RDS(on).
- Robust thermal performance.
- AEC-Q101 qualified for automotive use.
Ideal for designs requiring high power density and reliability. Check the datasheet for detailed specs.
### Key Features:
- Voltage Rating: -30V (drain-to-source).
- Current Handling: -5.8A (continuous drain current).
- Low On-Resistance: 36mΩ (max at VGS = -10V), reducing power losses.
- Compact Package: PowerPAK® SO-8 for space-constrained designs.
- Optimized for Fast Switching: Low gate charge (Qg) and capacitance.
### Applications:
- Power distribution in portable devices.
- Battery management systems.
- Motor control and power supplies.
### Advantages:
- High efficiency due to low RDS(on).
- Robust thermal performance.
- AEC-Q101 qualified for automotive use.
Ideal for designs requiring high power density and reliability. Check the datasheet for detailed specs.
Equivalent
Equivalent products to the SI4925DDY-T1-GE3 (30V P-channel MOSFET) include:
- AO3401A (30V, -4A, SOT-23)
- DMG2305UX (30V, -5.2A, SOT-23)
- IRLML6401 (30V, -4A, SOT-23)
- FDC5612P (30V, -5A, SOT-23)
These are similar P-channel MOSFETs with comparable voltage, current ratings, and SOT-23 packaging. Verify specs for exact compatibility.
- AO3401A (30V, -4A, SOT-23)
- DMG2305UX (30V, -5.2A, SOT-23)
- IRLML6401 (30V, -4A, SOT-23)
- FDC5612P (30V, -5A, SOT-23)
These are similar P-channel MOSFETs with comparable voltage, current ratings, and SOT-23 packaging. Verify specs for exact compatibility.
Pinout
The SI4925DDY-T1-GE3 is a dual N-channel MOSFET in a PowerPAK® SO-8 package with 8 pins.
### Key Functions:
- Dual N-channel MOSFET (two independent MOSFETs in one package).
- Low on-resistance (RDS(on)) for efficient power switching.
- Logic-level gate drive (compatible with 3.3V/5V control signals).
- High current handling (suitable for power management in DC-DC converters, motor drives, etc.).
### Pin Configuration (SO-8):
- Pins 1, 2, 3 (Gate1, Drain1, Source1) – First MOSFET.
- Pins 5, 6, 7 (Gate2, Drain2, Source2) – Second MOSFET.
- Pins 4 & 8 – Typically NC (No Connection) or thermal pad (depending on variant).
Applications: Load switches, battery protection, power supplies.
### Key Functions:
- Dual N-channel MOSFET (two independent MOSFETs in one package).
- Low on-resistance (RDS(on)) for efficient power switching.
- Logic-level gate drive (compatible with 3.3V/5V control signals).
- High current handling (suitable for power management in DC-DC converters, motor drives, etc.).
### Pin Configuration (SO-8):
- Pins 1, 2, 3 (Gate1, Drain1, Source1) – First MOSFET.
- Pins 5, 6, 7 (Gate2, Drain2, Source2) – Second MOSFET.
- Pins 4 & 8 – Typically NC (No Connection) or thermal pad (depending on variant).
Applications: Load switches, battery protection, power supplies.
Package
The SI4925DDY-T1-GE3 is a PowerPAK® SO-8 dual N-channel MOSFET package. It features a compact, surface-mount design with enhanced thermal performance, suitable for high-efficiency power applications. The package includes an exposed pad for improved heat dissipation.
