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MX30LF1G08AA-TI
+物料清單IC FLASH 1GBIT PARALLEL 48TSOP
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製造商部分 #MX30LF1G08AA-TI
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規格
| 屬性 | 價值 |
| Series | MX30LF |
| Part Status | Obsolete |
| Base Product Number | MX30LF1 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 30ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 48-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 48-TSOP |
| Packaging | Tray |
| Access Time | 30 ns |
概述
Description
Key features of the MX30LF1G08AA-TI include a 3.3V power supply, support for standard NAND Flash interface, and a small form factor, which makes it suitable for space-constrained applications. It offers robust data integrity and supports error correction code (ECC) to minimize data errors during operation. The chip operates over a wide temperature range, making it suitable for industrial applications.
This NAND Flash memory is ideal for use in consumer electronics, industrial devices, and automotive applications where high reliability and durability are required. Its compact design and efficient performance make it a popular choice for modern embedded systems.
Equivalent
1. Micron MT29F1G08ABADAWP - 1Gb SLC NAND.
2. Samsung K9F1G08U0F - 1Gb SLC NAND.
3. Toshiba TC58NVG0S3HTA00 - 1Gb SLC NAND.
4. Winbond W29N01GV - 1Gb SLC NAND.
Each of these offers similar storage capacity and target applications. Compatibility should be verified based on specific technical requirements.
Features
1. Capacity: It provides a storage capacity of 1Gb (gigabit).
2. Architecture: The chip is designed with a multi-level cell (MLC) structure, which stores more data per cell compared to single-level cell (SLC) designs.
3. Interface: It utilizes a standard NAND interface for communication, suitable for various applications.
4. Voltage: Operates at a supply voltage range of 2.7V to 3.6V.
5. Performance: Offers fast read and write speeds, essential for efficient data handling.
6. Reliability: Incorporates error correction code (ECC) support to enhance data reliability and integrity.
7. Endurance: Designed for a high number of program/erase cycles, which is typical for NAND flash memory.
8. Packaging: Available in a TSOP (Thin Small Outline Package) for easy integration into devices.
These features make the MX30LF1G08AA-TI suitable for a wide array of consumer electronics, embedded systems, and industrial applications.
Pinout
Key functions of the MX30LF1G08AA-TI include:
1. Data Storage: It is used for non-volatile storage, retaining data without power.
2. Read/Write Operations: Supports fast read and write operations, essential for high-performance storage solutions.
3. Erase Capability: Allows for block-level erasing, which is a standard function in NAND Flash to clear data.
4. ECC Support: It incorporates Error Correction Code (ECC) to ensure data integrity during read and write operations.
These functionalities make the MX30LF1G08AA-TI suitable for use in consumer electronics, industrial applications, and other devices requiring reliable data storage solutions.
Manufacturer
Application
1. Consumer Electronics: Utilized in devices like smartphones, tablets, and digital cameras for storing operating systems, applications, and user data.
2. Industrial Applications: Used in embedded systems within industrial equipment for data logging and firmware storage.
3. Networking Equipment: Provides storage solutions in routers, switches, and other networking devices.
4. Automotive Systems: Employed in infotainment systems, navigation units, and other electronic control units (ECUs) in vehicles.
5. Data Storage Solutions: Integral to SSDs and other data storage devices requiring high-capacity, non-volatile memory.
Package
Frequently Asked Questions
Q: What is the storage capacity of the MX30LF1G08AA-TI?
A: It offers 1 Gbit (128M x 8) of non-volatile NAND Flash memory, suitable for code and data storage.
Q: Does this device support a parallel interface?
A: Yes, it uses a parallel memory interface for high-speed data transfer with an access time of 30 ns.
Q: What is the operating voltage range for this chip?
A: The supply voltage ranges from 2.7V to 3.6V, making it compatible with standard 3.3V systems.
Q: Is this component suitable for industrial temperature environments?
A: Yes, it operates reliably across -40°C to +85°C (TA), ideal for industrial applications.
Q: What package type is available for the MX30LF1G08AA-TI?
A: It comes in a 48-TFSOP (0.724", 18.40mm Width) package, with a 48-TSOP supplier device package.
Q: Is the page write cycle time specified for this Flash memory?
A: Yes, the write cycle time for word and page operations is 30 ns, ensuring fast programming.
Q: Can this part be used in new designs since it is marked as Obsolete?
A: As the part status is Obsolete, it is recommended for legacy design support or bulk purchase for existing products only.