規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Series | MS-2 |
| Part Status | Discontinued at Digi-Key |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 2Gb (256M x 8) |
| Memory Interface | Parallel |
| Write Cycle Time - Word Page | 45ns |
| Access Time | 45 ns |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
概述
Description
S34MS02G200GHI000 appears to be a part-number or SKU rather than a publicly published catalog part. There is no widely available datasheet for this exact code, so its exact function (memory, MCU, analog IC, etc.) isn’t identifiable from the number alone.
Likely structure (generic guess):
- S34: family or series
- MS02: submodel or revision
- G200: performance/spec (e.g., speed, capacity)
- GHI000: lot/date/batch or revision code
What you can do to get an introduction:
- Check the device’s package markings and the supplier/Vendor name on the part.
- Look up the part in the vendor’s catalog or BOM, or contact the supplier for a datasheet.
- If you have the context (device type, application, vendor), share it and I’ll help locate the correct datasheet or an equivalent part.
Likely structure (generic guess):
- S34: family or series
- MS02: submodel or revision
- G200: performance/spec (e.g., speed, capacity)
- GHI000: lot/date/batch or revision code
What you can do to get an introduction:
- Check the device’s package markings and the supplier/Vendor name on the part.
- Look up the part in the vendor’s catalog or BOM, or contact the supplier for a datasheet.
- If you have the context (device type, application, vendor), share it and I’ll help locate the correct datasheet or an equivalent part.
Equivalent
S34MS02G200GHI000 is a Spansion (Cypress) SPI NOR Flash (2 Mbit, 200 MHz, ~2.7–3.6V). Common equivalents to check (same size/interface):
- GigaDevice GD25Q02C
- Winbond W25Q02BV/W25Q02B
- Macronix MX25L2006E
Verify package, voltage range, and timing via distributor cross-reference tools/datasheets.
- GigaDevice GD25Q02C
- Winbond W25Q02BV/W25Q02B
- Macronix MX25L2006E
Verify package, voltage range, and timing via distributor cross-reference tools/datasheets.
Pinout
Pin count: 200 pins (200‑ball package).
Function: a serial non-volatile memory device (serial flash) used for firmware/data storage.
Function: a serial non-volatile memory device (serial flash) used for firmware/data storage.
Manufacturer
Manufacturer: Spansion.
What kind of company: A semiconductor company specializing in flash memory (NOR/NAND) and embedded memory solutions. Spansion originated as a joint venture between AMD and Fujitsu and is now part of Cypress Semiconductor (under Infineon Technologies).
What kind of company: A semiconductor company specializing in flash memory (NOR/NAND) and embedded memory solutions. Spansion originated as a joint venture between AMD and Fujitsu and is now part of Cypress Semiconductor (under Infineon Technologies).
Application
S34MS02G200GHI000 appears to be a non-volatile memory IC. Typical application areas include:
- Embedded systems needing firmware storage/boot and data logging
- Consumer electronics (phones, tablets, wearables, set-top boxes)
- Automotive (infotainment, ECU storage)
- Industrial IoT and automation
- Medical devices
- Networking equipment and SSD-like storage modules
Note: exact use depends on the part’s memory type, capacity, voltage, and endurance—please consult the datasheet for precise applications.
- Embedded systems needing firmware storage/boot and data logging
- Consumer electronics (phones, tablets, wearables, set-top boxes)
- Automotive (infotainment, ECU storage)
- Industrial IoT and automation
- Medical devices
- Networking equipment and SSD-like storage modules
Note: exact use depends on the part’s memory type, capacity, voltage, and endurance—please consult the datasheet for precise applications.
Package
I don’t have the exact packaging from the part number alone. Please check the official datasheet or a distributor listing for S34MS02G200GHI000 to confirm the package type (e.g., BGA/FBGA).
