OMAPL138EZWTA3

圖片僅供參考

OMAPL138EZWTA3

+物料清單

IC MPU OMAP-L1X 375MHZ 361NFBGA

  • 製造商德州儀器

  • 製造商部分 #OMAPL138EZWTA3

  • 包裹 NFBGA-361

  • 有存貨3923

365 天品質保證

7*24 小時服務保證

90-日售後保障

正品保證

規格

屬性 價值
Package / Case Tray
Series OMAP-L1x
Part Status Active
Core Processor ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 375MHz
Co - Processors / DSP Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM
Graphics Acceleration No
Display&Interface Controllers LCD
Ethernet 10/100Mbps (1)
SATA SATA 3Gbps (1)
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I / O 1.8V, 3.3V
Operating Temperature -40°C ~ 105°C (TJ)
Security Features Boot Security, Cryptography

概述

Description

The OMAPL138EZWTA3 is a low-power applications processor from Texas Instruments, part of the OMAP-L138 family. It integrates an ARM9 and a C674x DSP core, designed for applications requiring a mix of general-purpose processing and real-time signal processing. This dual-core architecture allows for efficient handling of complex tasks like audio and video processing, industrial automation, and medical instrumentation.
Key features include a rich set of peripherals, such as USB, Ethernet, and various serial interfaces, making it versatile for embedded applications. The processor supports multiple operating systems, including Linux and real-time operating systems (RTOS), allowing developers flexibility in software design. Additionally, its low power consumption and small form factor make it suitable for battery-powered and space-constrained applications.
The device is supported by extensive development tools and software libraries from Texas Instruments, facilitating efficient development cycles. Overall, the OMAPL138EZWTA3 is well-suited for developers needing a balance of performance, connectivity, and energy efficiency in embedded systems.

Equivalent

The OMAP-L138 is a low-power applications processor by Texas Instruments. Equivalent or similar products may include other Texas Instruments processors like the Sitara series (e.g., AM335x), or processors from other manufacturers like the Microchip PIC32MZ series, NXP's i.MX 6 series, or STMicroelectronics' STM32MP1 series. Always ensure to check the specifications and compatibility for your specific application requirements when seeking an equivalent.

Features

The OMAP-L138EZWTA3 is a low-power applications processor from Texas Instruments, designed for applications requiring an efficient blend of DSP and ARM processing power. Key features include:
1. Dual-Core Architecture: Combines an ARM9 and a C674x DSP core for versatile processing capabilities.
2. Clock Speed: Operates at up to 456 MHz for ARM and 456 MHz for DSP, providing robust performance.
3. Memory: Supports efficient memory interfaces, including DDR2/DDR, NAND Flash, and NOR Flash.
4. Peripherals: Includes a range of integrated peripherals such as UART, SPI, I2C, McASP, and USB 2.0 OTG.
5. Power Management: Optimized for low power consumption, ideal for portable and battery-operated devices.
6. Connectivity: Features Ethernet and MMC/SD/SDIO interfaces for connectivity options.
7. Package: Available in a 361-pin BGA package, suitable for compact designs.
8. Software Support: Compatible with several operating systems including Linux and Windows CE, ensuring flexibility in application development.
This processor is well-suited for applications in industrial, medical, and communications sectors, where efficient processing and low power consumption are crucial.

Pinout

The OMAP-L138 (specifically, the OMAPL138EZWTA3 model) is a low-power applications processor from Texas Instruments. It integrates an ARM9 and a C674x DSP core, making it suitable for a range of applications that require both general-purpose processing and digital signal processing.
Pin Count and Package:
The OMAPL138EZWTA3 comes in a 361-ball BGA (Ball Grid Array) package.
Functions:
- ARM9 Core: Handles general-purpose processing tasks.
- C674x DSP Core: Targets digital signal processing applications.
- Peripheral Interfaces: Includes USB, Ethernet, UART, SPI, I2C, and more, facilitating diverse connectivity options.
- Memory Interfaces: Supports DDR2, mDDR, and NAND flash, allowing flexible memory configurations.
- Multimedia Capabilities: Provides video and audio processing functionalities.
- Power Management: Features efficient power management to suit portable and low-power applications.
This processor is designed to cater to applications such as industrial automation, medical devices, communications, and multimedia processing, offering a balance of performance and power efficiency.

Manufacturer

The OMAPL138EZWTA3 is manufactured by Texas Instruments (TI). Texas Instruments is an American technology company that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. TI is known for its development of analog chips and embedded processors, which are used in a wide range of electronics applications. The company has a strong presence in the consumer electronics, automotive, industrial, and communications sectors, among others. TI is one of the largest semiconductor companies in the world and is recognized for its innovation and contributions to the electronics industry.

Application

The OMAP-L138EZWTA3 is a low-power, mixed-signal system-on-chip (SoC) with a dual-core architecture combining a DSP and ARM processor. It is commonly used in applications requiring efficient digital signal processing and control, such as industrial automation, medical devices, and communications infrastructure. Its low-power consumption makes it suitable for portable and battery-operated devices. Additionally, it finds application in audio and video processing, security systems, and embedded systems requiring real-time data processing. Its versatile connectivity options also support various interfacing needs in complex embedded environments.

Package

The OMAPL138EZWTA3 is a microprocessor unit from Texas Instruments and comes in a BGA (Ball Grid Array) package type. Specifically, it uses a 361-ball BGA package, which allows for a compact design, facilitating efficient heat dissipation and high-density connections suitable for embedded applications.

與OMAPL138EZWTA3相關的產品