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MT29F8T08EWLEEM5-T:E
+物料清單IC FLASH 8TBIT LBGA
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製造商部分 #MT29F8T08EWLEEM5-T:E
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規格
| 屬性 | 價值 |
| Part Status | Active |
| Base Product Number | MT29F8T08 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (TLC) |
| Memory Size | 8Tbit |
| Memory Organization | 1T x 8 |
| Memory Interface | Parallel |
| Operating Temperature | 0°C ~ 70°C |
| Packaging | Box |
概述
Description
MT29F8T08EWLEEM5-T:E is Micron’s MT29F8T08EWLEEM5 NAND flash memory device. Key points:
- 8-Gbit, multi-level cell (MLC) NAND flash
- ONFI-compatible NAND interface with page/block organization
- Used as non-volatile storage in electronic devices; requires a flash controller and ECC
- The suffix -T:E denotes a specific temperature grade and packaging variant (exact specs shown in the datasheet)
- For exact electrical specs (page size, block size, timings, endurance, voltage), refer to the MT29F8T08EWLEEM5-T:E datasheet from Micron.
- 8-Gbit, multi-level cell (MLC) NAND flash
- ONFI-compatible NAND interface with page/block organization
- Used as non-volatile storage in electronic devices; requires a flash controller and ECC
- The suffix -T:E denotes a specific temperature grade and packaging variant (exact specs shown in the datasheet)
- For exact electrical specs (page size, block size, timings, endurance, voltage), refer to the MT29F8T08EWLEEM5-T:E datasheet from Micron.
Features
MT29F8T08EWLEEM5-T:E is Micron’s 8 Gbit NAND Flash. Key features (summary):
- Density: 8 Gbit (1 Gbyte) NAND Flash memory
- Interface: x8 data bus with Toggle DDR; ONFI-compatible
- Architecture: multi-plane and multi-die design for higher throughput
- Organization: page sizes (2K/4K options) with spare/OOB area; robust block structure
- Reliability: on-die ECC support plus bad-block management and wear leveling
- Endurance/Retention: typical NAND P/E endurance with long data retention
- Power: single 3.3V I/O supply with low-power modes
- Packaging: conventional Micron packaging options (e.g., EWLEEM5 form factor)
- Applications: embedded systems, firmware/storage/media boot, data storage
Note: exact page size, ECC level, and performance figures are specified in the datasheet for this specific device revision.
- Density: 8 Gbit (1 Gbyte) NAND Flash memory
- Interface: x8 data bus with Toggle DDR; ONFI-compatible
- Architecture: multi-plane and multi-die design for higher throughput
- Organization: page sizes (2K/4K options) with spare/OOB area; robust block structure
- Reliability: on-die ECC support plus bad-block management and wear leveling
- Endurance/Retention: typical NAND P/E endurance with long data retention
- Power: single 3.3V I/O supply with low-power modes
- Packaging: conventional Micron packaging options (e.g., EWLEEM5 form factor)
- Applications: embedded systems, firmware/storage/media boot, data storage
Note: exact page size, ECC level, and performance figures are specified in the datasheet for this specific device revision.
Pinout
- Pin count: 48 pins
- Function: Micron MT29F8T08EWLEEM5-T:E is a NAND flash memory device (non-volatile storage) with a x8 data interface (ONFi-compatible in typical use).
- Function: Micron MT29F8T08EWLEEM5-T:E is a NAND flash memory device (non-volatile storage) with a x8 data interface (ONFi-compatible in typical use).
Manufacturer
- Manufacturer: Micron Technology, Inc. (Micron)
- What kind of company: An American multinational semiconductor company that designs, manufactures, and sells memory and storage technologies (DRAM, NAND Flash, NOR Flash) and related products. It is one of the world's largest memory makers.
- What kind of company: An American multinational semiconductor company that designs, manufactures, and sells memory and storage technologies (DRAM, NAND Flash, NOR Flash) and related products. It is one of the world's largest memory makers.
Application
MT29F8T08EWLEEM5-T:E is Micron NAND flash memory (8 Gbit) used as non-volatile storage. Typical applications include:
- Mobile and consumer electronics: smartphones, tablets, cameras, wearables
- Embedded/industrial and automotive: infotainment, instrument clusters, ADAS, industrial controllers, IoT gateways (extended temperature range)
- Data-storage products: raw NAND for SSDs, USB flash drives, SD/eMMC cards
- Firmware/boot storage: code and boot data for SoCs and microcontrollers
- Any system requiring high-density, reliable non-volatile storage with broad temperature capability
- Mobile and consumer electronics: smartphones, tablets, cameras, wearables
- Embedded/industrial and automotive: infotainment, instrument clusters, ADAS, industrial controllers, IoT gateways (extended temperature range)
- Data-storage products: raw NAND for SSDs, USB flash drives, SD/eMMC cards
- Firmware/boot storage: code and boot data for SoCs and microcontrollers
- Any system requiring high-density, reliable non-volatile storage with broad temperature capability
Package
FBGA (ball-grid array) package.
