IS46DR16640C-25DBLA2-TR

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IS46DR16640C-25DBLA2-TR

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IC DRAM 1GBIT PARALLEL 84TWBGA

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規格

屬性 價值
PartStatus Active
DigiKeyProgrammable Not Verified
MemoryType Volatile
MemoryFormat DRAM
Technology SDRAM - DDR2
MemorySize 1Gbit
MemoryOrganization 64M x 16
MemoryInterface Parallel
ClockFrequency 400 MHz
WriteCycleTime-Word,Page 15ns
AccessTime 400 ps
Voltage-Supply 1.7V ~ 1.9V
OperatingTemperature -40°C ~ 105°C (TA)
MountingType Surface Mount
Package/Case 84-TFBGA
SupplierDevicePackage 84-TWBGA (8x12.5)
BaseProductNumber IS46DR16640

概述

Description

The IS46DR16640C-25DBLA2-TR is a high-performance DRAM (Dynamic Random Access Memory) chip produced by Integrated Silicon Solution, Inc. It is a 64 Meg x 16-bit (1 Gigabit) DDR3 SDRAM device, designed for applications requiring fast data access and high bandwidth. Operating at a clock speed of 800 MHz (DDR3-1600), it supports data rates up to 1600 MT/s (million transfers per second) and has a low power consumption profile, making it suitable for mobile devices and energy-efficient applications.
The "C" in the part number signifies the component's commercial temperature range, while “-25” indicates a -25°C to 85°C operational temperature. The “A2” denotes the revision of the silicon. The “-TR” suffix indicates that the product is provided in tape and reel packaging for automated assembly.
This memory chip is ideal for various applications including smartphones, tablets, and embedded systems, where performance and efficiency are critical.

Equivalent

The IS46DR16640C-25DBLA2-TR is a 1Gb DDR3 SDRAM memory chip. Equivalent products include:
1. Micron MT41J1G8XB-15E
2. Hynix H5TQ1G83MFR-10C
3. Samsung K4B4G1646D-BCK0
Ensure to check specific datasheets for pin compatibility, voltage, and performance characteristics.

Features

The IS46DR16640C-25DBLA2-TR is a 1Gb (Gigabit) DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip. Key features include:
1. Density: 1 Gb (128MB x 8).
2. Data Rate: Operates at 800 MT/s (megatransfers per second).
3. Speed Grade: Specified at 25 ns (nanoseconds).
4. Interface: 8-bit wide data bus.
5. Operating Voltage: 1.5V (standard DDR3 voltage).
6. Packaging: Available in a small, compact 78-ball TFBGA (Thin Fine Ball Grid Array).
7. Temperature Range: Supports commercial temperature range (0°C to 70°C).
8. Features: Includes features such as burst lengths of 4 or 8 and an on-die termination (ODT) for improved signal integrity.
This memory is suitable for various applications, including consumer electronics, networking, and industrial devices, providing high-speed data access and efficiency.

Pinout

The IS46DR16640C-25DBLA2-TR is a 64 Megabit (8 Megabyte) DDR3 SDRAM chip organized as 8 bits x 8 banks x 8 rows. It has a total pin count of 78 pins.
The key functions of its pins include:
- Data I/O Pins: For data transfer.
- Address Pins: For row and column address selection.
- Control Pins: Such as Chip Select (CS), Write Enable (WE), and Read Enable (RE) for controlling read and write operations.
- Clock Pins: To synchronize data transfer.
- Power and Ground Pins: To provide necessary voltage and ground connections.
This device operates at a clock frequency of 400 MHz and supports a data transfer rate of up to 1600 MT/s. It is typically used in applications requiring high-speed memory, such as mobile devices and computing systems.

Manufacturer

The IS46DR16640C-25DBLA2-TR is manufactured by ISSI, which stands for Integrated Silicon Solution, Inc. ISSI is a semiconductor company that specializes in the design and production of a variety of memory solutions, including DRAM, SRAM, and Flash memory products. Established in 1988 and headquartered in San Jose, California, ISSI serves a wide range of industries including consumer electronics, telecommunications, automotive, and industrial applications. The company is known for its focus on high-performance and cost-effective memory solutions, catering to both standard and customized product requirements.

Application

The IS46DR16640C-25DBLA2-TR is a 64Mb DDR2 SDRAM memory chip primarily used in various applications requiring high-speed memory access. Its primary application areas include consumer electronics, such as digital TVs, set-top boxes, and gaming consoles. It is also utilized in networking equipment, industrial automation systems, and telecommunications devices. Additionally, it serves in automotive applications, medical devices, and embedded systems where efficient data processing and storage are critical. Its low power consumption and high performance make it suitable for mobile applications as well.

Package

The IS46DR16640C-25DBLA2-TR is packaged in a 48-ball TFBGA (Thin Fine Ball Grid Array) format.

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