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FDG6301N
+物料清單MOSFET 2N-CH 25V 0.22A SC88
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製造商安森美
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製造商部分 #FDG6301N
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規格
| 屬性 | 價值 |
| Part Status | Obsolete |
| Base Product Number | FDG6301 |
| Technology | MOSFET (Metal Oxide) |
| Configuration | 2 N-Channel (Dual) |
| FET Feature | Logic Level Gate |
| Drain to Source Voltage (Vdss) | 25V |
| Current - Continuous Drain (Id) @ 25°C | 220mA |
| Rds On (Max) @ Id, Vgs | 4Ohm @ 220mA, 4.5V |
| Vgs(th) (Max) @ Id | 1.5V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 0.4nC @ 4.5V |
| Input Capacitance (Ciss) (Max) @ Vds | 9.5pF @ 10V |
| Power - Max | 300mW |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package | 6-TSSOP, SC-88, SOT-363 |
| Supplier Device Package | SC-88 (SC-70-6) |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
概述
Description
For a precise understanding, it's essential to consult the course catalog or syllabus provided by the institution, which would outline the course objectives, the main topics covered, assessment methods, and any required materials or textbooks. Often, such courses aim to build on foundational knowledge, offering deeper insights into the subject matter, promoting critical thinking, and enhancing practical skills in the field.
If FDG6301N is being discussed in a specific context or institution, referring to their official resources would provide the most accurate and relevant information.
Equivalent
1. DMN62D0LDW from Diodes Incorporated
2. SI2312DS from Vishay
3. BSS138from Nexperia
4. 2N7002DW from ON Semiconductor
These alternatives may have slightly different specifications, so it's important to verify the parameters like maximum voltage, current, and R_DS(on) to ensure compatibility with your application.
Features
Additionally, it comes in a compact SOT-23 package, making it ideal for space-constrained applications. The FDG6301N is designed to provide a low gate threshold voltage, enabling it to be driven by low voltage levels from microcontrollers or other logic devices. Its robust thermal characteristics and reliability make it suitable for use in battery-operated devices, load switching, and power management tasks. Overall, the FDG6301N is valued for its efficiency, compact size, and reliability in various electronic circuits.
Pinout
1. Gate (G): This pin is responsible for controlling the MOSFET. A voltage applied to the gate determines whether the MOSFET is in an on or off state, thus controlling the flow of current between the drain and source.
2. Drain (D): This pin is the output terminal for the MOSFET. When the device is turned on, current flows from the drain to the source.
3. Source (S): This pin acts as the input terminal. It is where the current enters the MOSFET before flowing to the drain when the MOSFET is on.
This configuration allows the FDG6301N to be used for switching and amplifying electronic signals in various applications. Always refer to the specific datasheet for precise characteristics and additional details.
Manufacturer
ON Semiconductor serves a variety of markets including automotive, industrial, cloud power, and Internet of Things (IoT). The company focuses on delivering solutions that help design engineers solve their unique design challenges in these markets, emphasizing energy efficiency and sustainability. With a global presence, ON Semiconductor operates manufacturing, sales, and design centers around the world, aiming to drive technology advancements and provide solutions that enable smarter and more connected lives.
Application
Package
Frequently Asked Questions
Q: What is the maximum drain-to-source voltage for the FDG6301N?
A: The maximum Drain to Source Voltage (Vdss) is 25V, suitable for low-voltage logic-level switching applications.
Q: What is the maximum continuous drain current at 25°C?
A: The continuous drain current (Id) is rated at 220mA at 25°C, ideal for small-signal switching.
Q: Is this MOSFET suitable for battery-powered or portable devices?
A: Yes, with a logic-level gate threshold (Vgs(th) max 1.5V) and low gate charge (0.4nC), it is optimized for low-voltage drive and low-power applications.
Q: What package type does the FDG6301N use?
A: It comes in a 6-TSSOP (SC-88, SOT-363) surface-mount package, with the supplier device package being SC-88 (SC-70-6).
Q: What is the maximum power dissipation of this dual MOSFET?
A: The maximum power dissipation is 300mW, suitable for low-power, space-constrained designs.
Q: What is the typical input capacitance for switching speed estimation?
A: The input capacitance (Ciss) is 9.5pF at Vds=10V, indicating very fast switching for high-frequency low-current circuits.
Q: Can this be used in high-temperature environments?
A: Yes, the operating temperature range is -55°C to +150°C (TJ), making it reliable for harsh industrial or automotive environments.