規格
| 屬性 | 價值 |
| Supplier | Intel |
| Package / Case | Tray |
| Series | Stratix® IV GX |
| Part Status | Obsolete |
| Number of LABs/CLBs | 4224 |
| Number of Logic Elements/Cells | 105600 |
| Total RAM Bits | 9793536 |
| Number of I/O | 488 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
概述
Description
EP4SGX110HF35C2N is an Intel/Altera Stratix IV GX FPGA. It belongs to the Stratix IV GX family and is a high‑density device with about 110k logic elements (LEs). It integrates high‑speed GX transceivers (multi‑gigabit SERDES), abundant DSP blocks, and on‑chip memory, making it suitable for demanding, high‑bandwidth applications such as telecom, data networking, video processing, and complex embedded systems. The “C2N” suffix indicates the ball‑grid/packaging option, and “HF35” denotes the speed grade/temperature/package variant. Design and synthesis are done with Intel Quartus Prime; configuration typically uses standard schemes (e.g., EPCS/EPCQ in-system configuration). Key design considerations include adequate power delivery and cooling, proper I/O bank planning for SERDES interfaces, and leveraging the DSP blocks and memory efficiently.
Pinout
- Pin count: 1,152 pins (FineLine BGA, HF35C2N package).
- Function: Stratix IV GX FPGA with ~110,000 logic elements and integrated high-speed transceivers for digital logic and IO.
- Function: Stratix IV GX FPGA with ~110,000 logic elements and integrated high-speed transceivers for digital logic and IO.
Manufacturer
Manufacturer: Intel Corporation (via its Programmable Solutions Group; originally Altera).
Company type: A multinational technology and semiconductor company that designs and manufactures electronic components, including programmable logic devices like FPGAs.
Company type: A multinational technology and semiconductor company that designs and manufactures electronic components, including programmable logic devices like FPGAs.
Application
EP4SGX110HF35C2N is a Stratix IV GX FPGA with high‑speed transceivers and substantial DSP resources. Common application areas include:
- High‑end telecom and data networking (10/40/100 GbE, PCIe, backplane switching)
- Optical transport and packet switching (ROADM, OTN)
- Wireless infrastructure (base stations, RF front‑end signal processing)
- Video, imaging and multimedia processing (HD/4K, computer vision accelerators)
- Defense and aerospace (radar signal processing, EW, avionics)
- Industrial automation and measurement (real‑time control, data acquisition, test equipment)
- High‑end telecom and data networking (10/40/100 GbE, PCIe, backplane switching)
- Optical transport and packet switching (ROADM, OTN)
- Wireless infrastructure (base stations, RF front‑end signal processing)
- Video, imaging and multimedia processing (HD/4K, computer vision accelerators)
- Defense and aerospace (radar signal processing, EW, avionics)
- Industrial automation and measurement (real‑time control, data acquisition, test equipment)
Package
The EP4SGX110HF35C2N uses a C2N FineLine BGA (FBGA) package.
