規格
| 屬性 | 價值 |
| Supplier | Microchip Technology |
| Package / Case | Tray |
| Series | ProASIC3 |
| Part Status | Active |
| Total RAM Bits | 147456 |
| Number of I/O | 300 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
概述
Description
A3P1000-1FGG484 is a hardware model/part number that likely denotes a specific component (for example a processor, controller board, or module) in a vendor’s catalog. A precise intro requires the manufacturer’s name to locate the official datasheet.
In general, an intro would cover:
- product category and primary function
- block diagram or architecture
- key specifications (e.g., core count/clock, memory, power, interfaces)
- package/form factor
- target applications and typical use cases
How to verify:
- search the vendor site or datasheets for “A3P1000-1FGG484”
- check cross-reference tables
- request the data sheet and confirm revision/compatibility with your system
If you provide the manufacturer or a link, I can give a tailored summary with exact specs, features, and recommended use cases.
In general, an intro would cover:
- product category and primary function
- block diagram or architecture
- key specifications (e.g., core count/clock, memory, power, interfaces)
- package/form factor
- target applications and typical use cases
How to verify:
- search the vendor site or datasheets for “A3P1000-1FGG484”
- check cross-reference tables
- request the data sheet and confirm revision/compatibility with your system
If you provide the manufacturer or a link, I can give a tailored summary with exact specs, features, and recommended use cases.
Features
A3P1000-1FGG484 features:
- ProASIC3 family flash-based FPGA (non-volatile configuration)
- Density: ~1,000K system gates (A3P1000)
- Packaging: FG484 (484-ball Fine Grid Array), -1 speed grade
- On-chip non-volatile configuration memory with fast boot
- In-system programmable (ISP) via JTAG/SPI; field reconfigurable
- Security: AES-128 encrypted bitstreams and device locking
- Low power with multiple power-management modes
- I/O: multiple banks with 2.5V/3.3V-tolerant I/O and support for various standards
- On-chip RAM blocks and flexible logic resources for memory and logic needs
- ProASIC3 family flash-based FPGA (non-volatile configuration)
- Density: ~1,000K system gates (A3P1000)
- Packaging: FG484 (484-ball Fine Grid Array), -1 speed grade
- On-chip non-volatile configuration memory with fast boot
- In-system programmable (ISP) via JTAG/SPI; field reconfigurable
- Security: AES-128 encrypted bitstreams and device locking
- Low power with multiple power-management modes
- I/O: multiple banks with 2.5V/3.3V-tolerant I/O and support for various standards
- On-chip RAM blocks and flexible logic resources for memory and logic needs
Pinout
- Pin count: 484 pins (package FGG484, 484-ball BGA)
- Function: Field-programmable gate array (FPGA) device used for programmable logic.
- Function: Field-programmable gate array (FPGA) device used for programmable logic.
Manufacturer
- Manufacturer: Actel Corporation (now part of Microchip Technology).
- What kind of company: A fabless semiconductor company that designs and sells field-programmable gate arrays (FPGAs) and other programmable logic devices, with a focus on low-power and radiation-tolerant solutions for aerospace/defense.
- What kind of company: A fabless semiconductor company that designs and sells field-programmable gate arrays (FPGAs) and other programmable logic devices, with a focus on low-power and radiation-tolerant solutions for aerospace/defense.
Application
A3P1000-1FGG484 is a high‑density FPGA used where large logic, DSP, and I/O bandwidth are needed. Common applications include:
- Telecommunications infrastructure: protocol processing, line cards, packet switching
- Networking accelerators and data-center tasks: crypto, compression, offload engines
- Video/image/DSP processing: encoding/decoding, vision, AI inference
- Embedded and industrial automation: motor control, instrumentation, control planes
- Automotive and aerospace: cockpit electronics, radar/sensor processing
- Prototyping and R&D: custom accelerators and rapid development
Note: suitability depends on project requirements.
- Telecommunications infrastructure: protocol processing, line cards, packet switching
- Networking accelerators and data-center tasks: crypto, compression, offload engines
- Video/image/DSP processing: encoding/decoding, vision, AI inference
- Embedded and industrial automation: motor control, instrumentation, control planes
- Automotive and aerospace: cockpit electronics, radar/sensor processing
- Prototyping and R&D: custom accelerators and rapid development
Note: suitability depends on project requirements.
Package
FGG484 package — Flip-Chip Ball Grid Array (484-ball).
