AM1808EZWTA3
德州儀器
- Lifecycle
- Active
- Stock
- 4875 件
- Package
- NFBGA-361
- Series
- 嵌入式微處理器
對 AM1808EZWTA3 和 AM1808BZCED4 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The AM1808EZWTA3 and AM1808BZCED4 are both Sitara AM1808 ARM926EJ-S application processors sharing the same core architecture, peripheral set, and 375 MHz maximum clock rate, making them functionally interchangeable at the system level. The primary distinction lies in their package and temperature-grade options, so the AM1808BZCED4 can serve as a functional replacement for the AM1808EZWTA3 provided the target design accommodates the differing package footprint and operating temperature range. Designers should validate board layout, thermal margin, and qualification requirements before committing to the substitution.
德州儀器
德州儀器
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1808EZWTA3 | AM1808BZCED4 | Why it matters |
|---|---|---|---|
| Operating Temperature Range | -40°C to 105°C (extended/industrial) | -40°C to 90°C (industrial) | The wider upper temperature limit of the EZWTA3 allows operation in harsher thermal environments; substituting with the BZCED4 reduces the maximum ambient/junction margin. |
| Package / Case | 361-LFBGA (16x16) | 361-NFBGA (13x13) | Different package footprints and ball maps affect PCB layout, routing, and mechanical fit; a drop-in replacement requires matching the package and pinout. |
| Core / CPU | ARM926EJ-S up to 375 MHz | ARM926EJ-S up to 456 MHz | The higher maximum clock of the BZCED4 provides more processing headroom; firmware timing and performance assumptions may differ between the two. |
| On-chip Memory (RAM/ROM) | 8 KB ARM RAM, 128 KB on-chip RAM, 64 KB ROM | 8 KB ARM RAM, 128 KB on-chip RAM, 64 KB ROM | Identical internal memory resources mean software memory maps and boot behavior are consistent between the parts. |
| External Memory Interface | mDDR/DDR2, NAND, NOR, SRAM, SDRAM | mDDR/DDR2, NAND, NOR, SRAM, SDRAM | Matching memory interface support ensures the same external memory devices and board designs can be reused. |
| Peripheral Set (USB, Ethernet, UART, SPI, I2C) | USB 2.0 OTG, 10/100 EMAC, 3x UART, 2x SPI, 2x I2C, LCDC, uPP | USB 2.0 OTG, 10/100 EMAC, 3x UART, 2x SPI, 2x I2C, LCDC, uPP | Equivalent peripheral integration means the same firmware drivers and external connections apply, supporting functional substitutability. |
| Core Supply Voltage (VDDCORE) | 1.2 V (1.14–1.32 V) | 1.2 V (1.14–1.32 V) | Same core voltage requirements allow reuse of the same power supply design and sequencing. |
| I/O Supply Voltage (VDDIO) | 3.3 V (3.0–3.6 V) | 3.3 V (3.0–3.6 V) | Identical I/O voltage levels ensure direct compatibility with the same external logic and level-shifting schemes. |
| Product Status / Lifecycle | Active (extended temperature variant) | Active (industrial temperature variant) | Both are active, but the temperature-grade variant affects long-term availability planning and suitability for the target environment. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1808EZWTA3 | AM1808BZCED4 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 375MHz | 456MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| Ethernet | 10/100Mbps (1) | 10/100Mbps (1) |
| SATA | SATA 3Gbps (1) | SATA 3Gbps (1) |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 105°C (TJ) | -40°C ~ 90°C (TJ) |
Both are Sitara AM1808 ARM926EJ-S application processors from Texas Instruments, but they differ in package type and temperature grade. The AM1808EZWTA3 is supplied in a 361-ball PBGA (ZWT) package rated for the extended commercial temperature range of -40°C to 90°C (TA suffix). The AM1808BZCED4 is supplied in a 361-ball NFBGA (ZCE) package rated for the industrial temperature range of -40°C to 90°C (ED4 suffix). Core architecture, clock speed (456 MHz), and peripheral set are equivalent across both orderables.
No. The AM1808EZWTA3 uses the ZWT 361-ball PBGA package, while the AM1808BZCED4 uses the ZCE 361-ball NFBGA package. Although both are 361-ball BGA packages, the ball pitch, ball map, and PCB land pattern differ between the ZWT and ZCE package options, so they are not drop-in replacements on the same footprint.
Yes. Both the AM1808EZWTA3 and AM1808BZCED4 are rated for a maximum ARM926EJ-S core clock of 456 MHz, consistent with the AM1808 device family. The suffix digits in each orderable part number (TA3 and ED4) denote package and temperature grade rather than a different speed bin.
Both orderables are specified over the industrial temperature range of -40°C to 90°C ambient (TA). The AM1808EZWTA3 carries the TA temperature designator, and the AM1808BZCED4 carries the ED4 designator; both correspond to the same -40°C to 90°C operating range per the AM1808 datasheet. Designs should still be validated against the specific datasheet revision for the chosen orderable.
Only after PCB redesign and validation. Because the ZCE and ZWT packages have different ball maps and land patterns, a board laid out for the AM1808EZWTA3 (ZWT) cannot accept the AM1808BZCED4 (ZCE) without a new footprint. Electrical and functional behavior of the AM1808 core and peripherals is equivalent, but package-level compatibility must be confirmed against the respective datasheets before substitution.
Both orderables share the AM1808 feature set: an ARM926EJ-S core with 16 KB instruction and 16 KB data caches, 8 KB ARM local RAM, 128 KB on-chip RAM, DDR2/mDDR and SDRAM controllers, an EMIFA external memory interface, USB 2.0 OTG and host, 10/100 Ethernet MAC, LCD controller, uPP, McASP, SPI, I2C, UART, and eHRPWM/eCAP modules. Package and temperature grade are the distinguishing factors between the two orderables.
Selection depends on PCB constraints and sourcing. The AM1808EZWTA3 (ZWT PBGA) and AM1808BZCED4 (ZCE NFBGA) offer the same core performance and peripheral set at 456 MHz over -40°C to 90°C. Choose based on the package your PCB land pattern supports, availability from authorized distributors, and the specific datasheet revision for the orderable. Confirm lifecycle status with Texas Instruments or an authorized distributor before committing to production.