AM1808EZWTA3
德州儀器
- Lifecycle
- Active
- Stock
- 4875 件
- Package
- NFBGA-361
- Series
- 嵌入式微處理器
對 AM1808EZWTA3 和 AM1802BZCED3 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The AM1802BZCED3 is not a direct drop-in replacement for the AM1808EZWTA3, as the two devices differ in core clock speed, on-chip memory configuration, and package footprint. However, both are Sitara ARM926EJ-S application processors sharing the same AM18x architecture and peripheral ecosystem, making the AM1802BZCED3 a viable functional candidate for lower-performance designs after validating clock, memory, and board-level requirements.
德州儀器
德州儀器
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1808EZWTA3 | AM1802BZCED3 | Why it matters |
|---|---|---|---|
| Core / CPU | ARM926EJ-S (ARM9) single core | ARM926EJ-S (ARM9) single core | Both use the same ARM9 core, so instruction set and software compatibility are preserved. |
| Maximum CPU Frequency | 456 MHz | 300 MHz | Higher clock speed yields more processing throughput; a slower part may not meet timing budgets of the original design. |
| On-chip RAM (SRAM) | 128 KB | 8 KB | Larger internal SRAM reduces external memory dependency and affects boot and buffer capabilities. |
| Package / Pin Count | 361-ball NFBGA (ZWT) | 361-ball NFBGA (ZCE) | Package footprint and ballout determine PCB layout compatibility and whether a drop-in replacement is possible. |
| Operating Temperature Range | -40°C to +105°C (extended) | -40°C to +90°C (industrial) | The wider temperature range of the AM1808 supports harsher environments; the AM1802 may not be rated for the same conditions. |
| Ethernet MAC | 10/100 Mbps EMAC with MDIO | 10/100 Mbps EMAC with MDIO | Both provide the same networking interface, so connectivity features remain equivalent. |
| USB Support | USB 2.0 High-Speed OTG + Host | USB 2.0 High-Speed OTG + Host | Identical USB capability preserves peripheral and host connectivity options. |
| LCD Controller | Integrated LCD controller | Integrated LCD controller | Both include a display controller, so HMI/display functionality is retained. |
| uPP / External Memory Interface | uPP, EMIFA, DDR2/mDDR, SDRAM | uPP, EMIFA, DDR2/mDDR, SDRAM | Matching external memory and parallel interfaces support the same board-level memory and peripheral designs. |
| Serial Interfaces | McASP, McSPI, I2C, UART, SPI | McASP, McSPI, I2C, UART, SPI | Equivalent serial interface set ensures audio, sensor, and communication peripherals remain compatible. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1808EZWTA3 | AM1802BZCED3 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 375MHz | 300MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| Ethernet | 10/100Mbps (1) | 10/100Mbps (1) |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 105°C (TJ) | -40°C ~ 90°C (TJ) |
| SATA | SATA 3Gbps (1) | - |
The AM1808EZWTA3 is a Sitara ARM microprocessor based on the ARM926EJ-S core running at 375 MHz, featuring 128 KB on-chip RAM, an integrated LCD controller, and a 16-bit DDR2/mDDR memory interface, supplied in a 361-ball NFBGA (ZWT) package. The AM1802BZCED3 is a lower-tier Sitara ARM microprocessor based on the same ARM926EJ-S core but running at 300 MHz, with 128 KB on-chip RAM and a reduced peripheral set, supplied in a 361-ball NFBGA (ZCE) package. The AM1808EZWTA3 adds an LCD controller and higher clock speed, while the AM1802BZCED3 omits the LCD controller.
Both devices are offered in 361-ball NFBGA packages, but the ball maps are not identical because the AM1808EZWTA3 exposes additional peripheral functions (such as the LCD controller) that the AM1802BZCED3 does not. A direct drop-in replacement should not be assumed; the ball assignments and pin multiplexing must be verified against the respective manufacturer datasheets before any substitution.
The AM1808EZWTA3 is specified for the industrial temperature range of -40°C to +105°C (the "T" suffix in the orderable part number denotes the extended/industrial grade). The AM1802BZCED3 is specified for the commercial temperature range of 0°C to +70°C (the "C" suffix denotes commercial grade). Designs requiring extended temperature operation should account for this difference.
Both the AM1808EZWTA3 and AM1802BZCED3 integrate an ARM926EJ-S RISC core. The AM1808EZWTA3 operates at 375 MHz, while the AM1802BZCED3 operates at 300 MHz. The higher clock rate of the AM1808EZWTA3 provides additional processing headroom for compute-intensive tasks.
No. The AM1808EZWTA3 integrates an on-chip LCD controller capable of driving a display interface, whereas the AM1802BZCED3 does not include an LCD controller. Applications requiring direct display support should select the AM1808EZWTA3 or add an external display controller.
Both the AM1808EZWTA3 and AM1802BZCED3 provide a 16-bit DDR2/mDDR SDRAM interface, asynchronous EMIF (NAND flash, NOR flash, SRAM), and serial interfaces including SPI and I2C. On-chip memory is 128 KB RAM on both devices. External memory expansion should be validated against the specific datasheet memory map for each part.
Only if the target design does not require the LCD controller, does not need 375 MHz operation, and operates within the 0°C to +70°C commercial temperature range. Because the peripheral set, clock speed, temperature grade, and ball map differ, a substitution requires full validation against the AM1802BZCED3 datasheet and the specific application requirements.
Both devices are supplied in a 361-ball NFBGA (PBGA) package. The AM1808EZWTA3 uses the ZWT package designator, and the AM1802BZCED3 uses the ZCE package designator. PCB land patterns and thermal considerations should be confirmed from the respective package drawings in the manufacturer documentation.