AD9777BSVZ
ADI公司
- Lifecycle
- Active
- Stock
- 2987 件
- Package
- TQFP-80
- Series
- 資料獲取-數模轉換器(DAC)
對 AD9777BSVZ 和 AD9777BSV 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The AD9777BSVZ and AD9777BSV are functionally equivalent 16-bit, 400 MSPS dual-channel DACs in the same 80-lead TQFP package, differing only in the RoHS-compliant lead finish of the BSVZ suffix. The BSVZ variant is a direct drop-in replacement for the BSV part in existing designs, with identical electrical performance and pinout.
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AD9777BSVZ | AD9777BSV | Why it matters |
|---|---|---|---|
| Resolution | 16 bit | 16 bit | Determines the quantization accuracy of the DAC output; both parts share the same resolution so reconstruction fidelity is equivalent. |
| Number of DAC Channels | 2 | 2 | Dual-channel architecture enables I/Q signal generation; identical channel count means the same signal-chain topology can be used. |
| Maximum Update Rate | 160 MSPS | 160 MSPS | Sets the maximum input data rate and achievable output bandwidth; matching rates allow the same clocking and interface design. |
| Supply Voltage | 3.3 V | 3.3 V | Defines the required power rail; identical supply voltage means the same power design can be reused. |
| Output Interface | Parallel CMOS | Parallel CMOS | Determines how the host FPGA/DSP connects to the DAC; identical interface allows drop-in digital connectivity. |
| Package / Mounting | 80-TQFP, Surface Mount | 80-TQFP, Surface Mount | Package and mounting style must match for PCB footprint compatibility; both use the same 80-lead TQFP. |
| RoHS / Lead-Free Status | RoHS compliant, lead-free (Z suffix) | Non-RoHS, contains lead | Affects regulatory compliance and solder process; the Z-suffix part is lead-free while the non-Z part contains lead, which matters for environmental and assembly requirements. |
| Part Number Suffix Meaning | Z denotes RoHS-compliant lead-free package | No Z suffix, standard leaded package | The suffix distinguishes compliance grade; functionally the silicon is the same, but procurement and compliance documentation differ. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AD9777BSVZ | AD9777BSV |
|---|---|---|
| Series | TxDAC+® | TxDAC+® |
| Part Status | Active | Obsolete |
| Mounting Type | - | Surface Mount |
| Base Product Number | - | AD9777 |
| Number of Bits | 16 | - |
| Number of D/A Converters | 2 | - |
| Settling Time | 11µs (Typ) | - |
| Output Type | Current - Unbuffered | - |
| Differential Output | Yes | - |
| Data Interface | Parallel | - |
| Reference Type | External, Internal | - |
| Voltage - Supply, Analog | 3.1V ~ 3.5V | - |
| Voltage - Supply, Digital | 3.1V ~ 3.5V | - |
| INL / DNL(LSB) | ±6, ±3 | - |
| Architecture | Oversampling Interpolating DAC | - |
| Operating Temperature | -40°C ~ 85°C | - |
The AD9777BSVZ and AD9777BSV are functionally identical 16-bit, 400 MSPS dual-channel TxDAC+ digital-to-analog converters from Analog Devices. The primary difference is the package/ordering suffix: the "Z" suffix on AD9777BSVZ denotes RoHS-compliant lead-free construction, while AD9777BSV is the non-RoHS (leaded) version. Both are supplied in a 80-lead TQFP-EP package.
Yes. Both parts share the same datasheet specifications, including 16-bit resolution, 400 MSPS maximum update rate, dual DAC channels, on-chip 2x/4x/8x interpolating filters, and a 1.8 V to 3.3 V digital interface. The only documented difference is the RoHS/lead-free status of the package finish, so they are interchangeable in function, though the Z version is preferred for RoHS-compliant assemblies.
Yes. Both devices are offered in the same 80-lead TQFP-EP (exposed pad) package with identical pin assignments. PCB land patterns and thermal pad requirements are the same for both variants, so no layout change is required when switching between them.
The AD9777BSVZ should be selected for RoHS-compliant designs because its "Z" suffix indicates lead-free, RoHS-compliant construction per Analog Devices ordering conventions. The AD9777BSV is the non-RoHS version and may not satisfy RoHS-restricted assembly requirements.
Both variants share the AD9777 datasheet specifications: 16-bit resolution, 400 MSPS maximum DAC update rate, dual current-output DACs, selectable 2x/4x/8x interpolation filters, on-chip PLL clock multiplier, and a 1.8 V to 3.3 V digital input interface. These parameters are identical because the silicon die is the same; only the package finish differs.
Yes, from a functional and footprint standpoint the AD9777BSVZ is a drop-in replacement for the AD9777BSV, since both use the same 80-lead TQFP-EP package and pinout with identical electrical specifications. The substitution only changes the RoHS/lead-free status of the part, which should be confirmed against the assembly's compliance requirements.
Yes. Both the AD9777BSVZ and AD9777BSV are specified over the same industrial temperature range as defined in the AD9777 datasheet, since they are the same device in the same package with only the finish differing. Designers should still verify the exact temperature grade against the current Analog Devices datasheet for the specific orderable part number.