AD9777BSVZ
ADI公司
- Lifecycle
- Active
- Stock
- 2987 件
- Package
- TQFP-80
- Series
- 資料獲取-數模轉換器(DAC)
對 AD9777BSVZ 和 AD9775BSVZ 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The AD9777BSVZ and AD9775BSVZ are functionally related 16-bit dual-channel DACs from the same Analog Devices family, sharing the 80-lead TQFP-EP package and overlapping supply architecture. However, they differ in maximum update rate, on-chip interpolation/filtering capability, and output configuration, so the AD9775BSVZ is not a direct drop-in substitute for the AD9777BSVZ in all designs. The AD9777BSVZ offers higher throughput and integrated 2x/4x/8x interpolation, making it the more capable part where signal bandwidth and reconstruction filtering matter, while the AD9775BSVZ remains a viable candidate only after confirming the application's sample-rate, filtering, and output-interface requirements.
ADI公司
ADI公司
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AD9777BSVZ | AD9775BSVZ | Why it matters |
|---|---|---|---|
| Resolution (DAC bits) | 16 | 14 | Higher resolution provides finer output quantization and lower quantization noise, which affects achievable signal-to-noise performance in synthesis applications. |
| Maximum Update Rate (MSPS) | 160 | 160 | The DAC update rate sets the maximum output sample rate and usable signal bandwidth for the transmit path. |
| Input Data Rate per Channel (MSPS) | 160 | 160 | Determines the maximum baseband input sample rate the digital interface can accept before interpolation. |
| Interpolation Factor | 2x, 4x, 8x | 2x, 4x, 8x | Selectable interpolation filters ease analog reconstruction filtering and shift images away from the band of interest. |
| On-chip Digital Modulation | Yes (fine/coarse NCO, complex modulation) | Yes (fine/coarse NCO, complex modulation) | Digital upconversion allows frequency translation in the digital domain, reducing analog mixer requirements in transmit chains. |
| Supply Voltage (Analog/Digital) | 3.3 V | 3.3 V | Supply voltage compatibility determines whether the part can drop into an existing 3.3 V board design without level shifting. |
| Package | 80-lead TQFP (SVZ) | 80-lead TQFP (SVZ) | Identical package and pinout enable direct PCB footprint compatibility for substitution. |
| Output Type | Current-steering DAC (differential current output) | Current-steering DAC (differential current output) | Matching output architecture ensures the same external reconstruction/filter network can be reused. |
| SFDR (at rated conditions) | Higher (16-bit device) | Lower (14-bit device) | Spurious-free dynamic range affects spectral purity; the higher-resolution device generally offers better SFDR, impacting compliance with spectral masks. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AD9777BSVZ | AD9775BSVZ |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Analog Devices Inc. |
| Series | TxDAC+® | TxDAC+® |
| Part Status | Active | Active |
| Number of Bits | 16 | 14 |
| Number of D/A Converters | 2 | 2 |
| Settling Time | 11µs (Typ) | 11ns (Typ) |
| Output Type | Current - Unbuffered | Current - Unbuffered |
| Differential Output | Yes | Yes |
| Data Interface | Parallel | Parallel |
| Reference Type | External, Internal | External, Internal |
| Voltage - Supply, Analog | 3.1V ~ 3.5V | 3.1V ~ 3.5V |
| Voltage - Supply, Digital | 3.1V ~ 3.5V | 3.1V ~ 3.5V |
| INL / DNL(LSB) | ±6, ±3 | ±1.5, ±1 |
| Architecture | Oversampling Interpolating DAC | Oversampling Interpolating DAC |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C |
Both are dual-channel, 16-bit digital-to-analog converters from Analog Devices in a 100-lead TQFP_EP (SVZ) package. The AD9777BSVZ supports an update rate of up to 400 MSPS, while the AD9775BSVZ supports up to 160 MSPS. The AD9777 also offers higher maximum input data rates and a wider range of interpolation options (2x, 4x, 8x) compared with the AD9775, making the AD9777 better suited for higher-speed applications.
Yes. Both devices are offered in the same 100-lead TQFP_EP package (SVZ suffix) and share a common pinout, which allows board-level interchangeability. However, because the maximum sample rate and interpolation capabilities differ, the surrounding clocking and digital interface must be validated for the target device before substitution.
The AD9777BSVZ has a maximum DAC update rate of 400 MSPS. The AD9775BSVZ has a maximum DAC update rate of 160 MSPS. Designs requiring sample rates above 160 MSPS must use the AD9777BSVZ.
The AD9777BSVZ provides selectable 2x, 4x, and 8x interpolation filters. The AD9775BSVZ provides 2x and 4x interpolation. The additional 8x interpolation mode on the AD9777BSVZ allows lower input data rates for a given DAC output rate.
Both devices use a dual-channel 16-bit input data path with a flexible input data rate and support for complex signal processing. Because the AD9777BSVZ supports higher maximum input and DAC rates, the digital source and clocking must be verified against the AD9777BSVZ timing specifications when migrating from the AD9775BSVZ.
Both the AD9777BSVZ and AD9775BSVZ are dual-channel, 16-bit digital-to-analog converters. Each device integrates two 16-bit DAC cores with on-chip digital signal processing, including interpolation and modulation functions.
Because both parts share the same 100-lead TQFP_EP package and pinout, the AD9777BSVZ can be considered as a higher-speed alternative. However, the replacement must be validated against the AD9777BSVZ datasheet for supply current, clock timing, interpolation configuration, and thermal performance, since the AD9777BSVZ operates at higher sample rates and may require different decoupling and layout considerations.
Both devices are supplied in a 100-lead TQFP_EP (thermally enhanced quad flat package) with the SVZ suffix, which indicates a lead-free, RoHS-compliant package. The exposed pad requires proper PCB thermal and ground connection per the manufacturer's layout guidelines.