5CEBA7F23C7N
訊息
- Lifecycle
- Active
- Stock
- 4498 件
- Package
- FBGA-484
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 5CEBA7F23C7N 和 5CEBA2U15C7N 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 5CEBA7F23C7N and 5CEBA2U15C7N are not drop-in replacements for each other. They differ in logic density, package type, I/O pin count, and operating temperature grade, making them unsuitable for direct substitution without a full board redesign and thermal revalidation.
訊息
訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA7F23C7N | 5CEBA2U15C7N | Why it matters |
|---|---|---|---|
| Family | Cyclone V E | Cyclone V E | Same device family ensures toolchain and IP compatibility. |
| Logic Elements (LE) | 149,500 | 25,000 | Determines available logic capacity for the design. |
| Adaptive Logic Modules (ALM) | 56,480 | 9,430 | ALM count reflects the granular logic resources available. |
| Total Embedded Memory | 6,860 Kbit | 1,760 Kbit | On-chip memory affects buffering and data storage capability. |
| 18x18 Multipliers | 312 | 72 | DSP blocks determine arithmetic and signal processing throughput. |
| Maximum User I/O | 480 | 240 | I/O count limits peripheral and interface connectivity. |
| Package | FBGA-484 | UBGA-324 | Package type affects PCB footprint and assembly compatibility. |
| Speed Grade | 7 | 7 | Speed grade influences maximum operating frequency and timing closure. |
| Operating Temperature Range | 0°C to 85°C | 0°C to 85°C | Commercial temperature range must match the target environment. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA7F23C7N | 5CEBA2U15C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 176 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) Cyclone V E FPGA devices. The 5CEBA7F23C7N is a Cyclone V E FPGA with 149,500 logic elements in a 484-pin FBGA package, while the 5CEBA2U15C7N is a Cyclone V E FPGA with 25,000 logic elements in a 324-pin UBGA package. Both are specified with a C7 speed grade and are lead-free (N suffix).
No. They differ in logic density (149,500 vs 25,000 logic elements), package type and pin count (484-pin FBGA vs 324-pin UBGA), and available I/O and transceiver resources. A direct drop-in replacement is not possible without redesigning the PCB and revalidating the logic implementation.
The 5CEBA7F23C7N provides 149,500 logic elements, while the 5CEBA2U15C7N provides 25,000 logic elements. This makes the 5CEBA7F23C7N suitable for significantly larger and more complex logic designs than the 5CEBA2U15C7N.
No. The 5CEBA7F23C7N uses a 484-pin FBGA package, and the 5CEBA2U15C7N uses a 324-pin UBGA package. The package dimensions, ball pitch, and pinout differ, so they are not footprint-compatible.
Yes. Both part numbers carry the "N" suffix, which indicates lead-free (Pb-free) construction. Intel Cyclone V E devices with the N suffix are RoHS compliant according to the manufacturer's ordering information.
Both devices are specified with speed grade C7, as indicated by the "C7" in their part numbers. The C7 speed grade is a commercial-grade speed bin for Cyclone V E FPGAs.
The 5CEBA7F23C7N should be selected. It offers 149,500 logic elements and a 484-pin FBGA package, providing more I/O pins and logic capacity than the 5CEBA2U15C7N, which has 25,000 logic elements in a 324-pin UBGA package.
Yes. Both are members of the Intel Cyclone V E FPGA family. They share the same architecture and feature set but differ in logic density, package, and pin count.