5CEBA4U15I7N
訊息
- Lifecycle
- Active
- Stock
- 3835 件
- Package
- BGA-324
- Series
- 嵌入式FPGA(現場可程式設計閘陣列)
對 5CEBA4U15I7N 和 5CEBA7F23C7N 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。
Replacement verdict
The 5CEBA7F23C7N and 5CEBA4U15I7N are not drop-in replacements for one another. They differ in logic density, package type, operating temperature grade, and transceiver count, making them suitable for different design requirements rather than interchangeable use.
訊息
訊息
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA7F23C7N | 5CEBA4U15I7N | Why it matters |
|---|---|---|---|
| Family | Cyclone V E | Cyclone V E | Same device family ensures toolchain and IP compatibility. |
| Logic Elements (LE) | 149,500 | 49,000 | Determines available logic capacity for the design. |
| Adaptive Logic Modules (ALM) | 56,480 | 18,480 | Affects how much combinational and sequential logic can be implemented. |
| Embedded Memory (M10K) | 6,860 Kb | 3,080 Kb | Impacts on-chip buffering and storage for data paths. |
| 18x18 Multipliers | 312 | 112 | Determines DSP throughput for arithmetic-intensive functions. |
| Package | FBGA-484 | UBGA-324 | Package type affects PCB footprint, routing, and assembly. |
| Operating Temperature | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Temperature grade determines suitability for harsh environments. |
| Speed Grade | 7 | 7 | Speed grade influences maximum operating frequency and timing closure. |
| Supply Voltage | 1.1 V | 1.1 V | Core voltage must match board power design for correct operation. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4U15I7N | 5CEBA7F23C7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 56480 |
| Number of Logic Elements/Cells | 49000 | 149500 |
| Total RAM Bits | 3464192 | 7880704 |
| Number of I/O | 176 | 240 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEBA7F23C7N is a Cyclone V E FPGA with 150,000 logic elements in a 484-pin FBGA package, while the 5CEBA4U15I7N is a Cyclone V E FPGA with 49,000 logic elements in a 324-pin UBGA package. They differ in logic density, package type, pin count, and speed grade.
No. The 5CEBA7F23C7N uses a 484-pin FBGA package, and the 5CEBA4U15I7N uses a 324-pin UBGA package. Different package sizes, ball counts, and ball maps prevent direct pin-to-pin compatibility.
No. The two devices have different logic densities, package footprints, and pin assignments. A direct drop-in replacement is not possible without redesigning the PCB and validating all electrical and functional requirements.
The 5CEBA7F23C7N is specified for commercial temperature operation, while the 5CEBA4U15I7N is specified for industrial temperature operation. The exact temperature ranges should be confirmed from the respective Intel Cyclone V device datasheets.
Yes. Both the 5CEBA7F23C7N and the 5CEBA4U15I7N are members of the Intel Cyclone V E FPGA family, sharing the same architecture and supported development tools.
The 5CEBA7F23C7N offers higher logic density with 150,000 logic elements, compared to 49,000 logic elements in the 5CEBA4U15I7N.
No. Configuration options, transceiver count, and high-speed interface support differ between the two devices due to different logic densities and package options. Designers must verify these parameters in the Intel Cyclone V device handbook before selecting either part.