10M50DAF256I6G vs 10M50DCF256C7G

對 10M50DAF256I6G 和 10M50DCF256C7G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M50DAF256I6G and 10M50DCF256C7G are both Intel MAX 10 FPGA devices sharing the same 50,000 logic element density and 256-ball FineLine BGA footprint, making them functionally interchangeable at the board level. However, they differ in speed grade and operating temperature range, so the 10M50DCF256C7G can serve as a replacement for the 10M50DAF256I6G only when the target application tolerates the faster C7 speed grade and the narrower commercial temperature window. Designers must validate timing closure and thermal margins before committing to this substitution.

Logic Density High match
Package Type High match
Speed Grade Validation required
Operating Temperature Validation required

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M50DAF256I6G 10M50DCF256C7G Why it matters
Family / Series MAX 10 MAX 10 Both devices belong to the same MAX 10 FPGA family, which is the baseline requirement for functional substitutability.
Logic Elements (LEs) 50,000 50,000 Matching logic density ensures equivalent programmable logic capacity for the target design.
Embedded Memory 1,638 Kbits 1,638 Kbits Identical on-chip memory supports the same buffering, FIFO, and data storage requirements.
Package 256-FBGA (17x17) 256-FBGA (17x17) Same package and footprint allow drop-in board-level replacement without PCB redesign.
Operating Temperature Range -40°C to 100°C (Industrial) 0°C to 85°C (Commercial) The industrial-grade device supports harsher environments, while the commercial-grade part is limited to benign conditions; this affects deployment suitability.
Speed Grade 6 7 A faster speed grade (lower number) provides higher maximum operating frequency and tighter timing margins, which can affect timing closure.
Core Supply Voltage 1.2 V 1.2 V Identical core voltage means the same power supply design and decoupling network can be reused.
Configuration Method Instant-on / Internal Configuration Instant-on / Internal Configuration Both support single-chip instant-on operation, eliminating the need for external configuration memory.
Analog-to-Digital Converter (ADC) Yes (12-bit, 1 Msps) Yes (12-bit, 1 Msps) Integrated ADC availability is identical, so analog monitoring and sensing functions remain supported.
RoHS / Lead-Free Yes Yes Both parts are RoHS-compliant, satisfying environmental and regulatory requirements for production.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M50DAF256I6G 10M50DCF256C7G
Supplier - Intel
Series MAX® 10 MAX® 10
Part Status Active Active
Number of LABs/CLBs 3125 3125
Number of Logic Elements/Cells 50000 50000
Total RAM Bits 1677312 1677312
Number of I/O 178 178
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 10M50DAF256I6G and the 10M50DCF256C7G?

The primary differences are speed grade, temperature grade, and package option. The 10M50DAF256I6G is a 10M50D device in a 256-pin FineLine BGA (FBGA) package with speed grade 6 and industrial temperature range. The 10M50DCF256C7G is a 10M50D device in a 256-pin FBGA package with speed grade 7 and commercial temperature range. Both are Intel MAX 10 FPGA devices with 50,000 logic elements, but the "F" and "C" suffixes indicate different package/ordering options, and the "I6" versus "C7" suffixes indicate industrial speed grade 6 versus commercial speed grade 7.

Are the 10M50DAF256I6G and 10M50DCF256C7G pin-compatible?

Both devices are offered in a 256-pin FBGA package, but pin compatibility cannot be assumed solely from the package name. The 10M50DAF256I6G uses the "F256" package designation, while the 10M50DCF256C7G uses the "F256" package designation as well, but the ordering codes differ in speed and temperature grade. Designers must verify pinout, I/O bank assignments, and configuration pin behavior against the respective Intel MAX 10 device pin-out files before treating them as drop-in replacements.

Can the 10M50DAF256I6G be used as a direct substitute for the 10M50DCF256C7G?

Not necessarily. The 10M50DAF256I6G is rated for industrial temperature range and speed grade 6, while the 10M50DCF256C7G is rated for commercial temperature range and speed grade 7. A direct substitution requires validating timing closure, operating temperature requirements, and any configuration or I/O voltage differences against the Intel MAX 10 datasheet and the target design specifications.

What is the logic density of the 10M50DAF256I6G and 10M50DCF256C7G?

Both devices are members of the Intel MAX 10 FPGA family with the 10M50 density grade, which provides 50,000 logic elements (LEs). They also include integrated analog-to-digital converter (ADC) blocks, flash memory, and other MAX 10 family features. Exact resource counts such as M9K memory blocks, DSP blocks, and user I/O pins should be confirmed from the Intel MAX 10 device datasheet for the specific package and ordering code.

What do the speed grade and temperature grade suffixes indicate for these two parts?

In the 10M50DAF256I6G, the "I6" suffix indicates industrial temperature range and speed grade 6. In the 10M50DCF256C7G, the "C7" suffix indicates commercial temperature range and speed grade 7. Speed grade affects maximum operating frequency and timing performance, while temperature grade defines the ambient or junction temperature range over which the device is guaranteed to operate within specification.

Which applications are better suited for the 10M50DAF256I6G versus the 10M50DCF256C7G?

The 10M50DAF256I6G is better suited for industrial applications requiring operation over the industrial temperature range and the timing characteristics of speed grade 6. The 10M50DCF256C7G is intended for commercial-temperature applications where speed grade 7 timing is acceptable. Selection should be based on the system's temperature environment, timing margin, and power budget, as documented in the Intel MAX 10 datasheet and device pin-out files.

Do both devices support the same configuration methods?

Both the 10M50DAF256I6G and 10M50DCF256C7G are Intel MAX 10 FPGA devices and support the same MAX 10 configuration schemes, including internal configuration from on-chip flash, JTAG configuration, and external configuration from a host or configuration device. The available configuration options and pin assignments should be verified in the Intel MAX 10 General Purpose I/O User Guide and the device pin-out files for the 256-pin FBGA package.

Where can verified technical data for the 10M50DAF256I6G and 10M50DCF256C7G be found?

Verified technical data is available from Intel (now Altera) official documentation, including the MAX 10 FPGA Device Datasheet, MAX 10 FPGA Device Pin-Out Files, and MAX 10 General Purpose I/O User Guide. Distributor sources such as DigiKey, Mouser, TTI, and Future Electronics also list ordering information, package details, and environmental ratings for these ordering codes. Always confirm final parameters against the manufacturer datasheet for the exact ordering code.