Part A
10M16DAF256C8G
訊息
- Lifecycle
- Active
- Stock
- 4171 件
- Package
- BGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256C8G and 10M16DCF484I7G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and non-volatile instant-on architecture, making them functionally related candidates. However, they differ in package type, operating temperature grade, and speed grade, so a drop-in replacement is not possible without PCB redesign and thermal validation. The 10M16DAF256C8G is a commercial-grade device in a 256-ball FineLine BGA package, while the 10M16DCF484I7G is an industrial-grade device in a 484-ball FineLine BGA package with a faster speed grade. Designers must verify pinout compatibility, thermal margins, and timing closure before substituting one for the other.
Logic Density
High match
Package Type
Validation required
Operating Temperature
Not compatible
Speed Grade
Validation required
Parts at a glance
Part B
10M16DCF484I7G
訊息
- Lifecycle
- Active
- Stock
- 9315 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256C8G | 10M16DCF484I7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, which supports similar design toolchains and IP reuse. |
| Logic Elements (LEs) | 16000 | 16000 | Matching logic capacity ensures equivalent logic density for the target design. |
| Package | 256-pin FBGA | 484-pin FBGA | Different package footprints and pin counts affect PCB layout, routing, and mechanical compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Temperature grade determines suitability for commercial versus industrial or harsh environments. |
| Speed Grade | 8 | 7 | A faster speed grade can support higher clock frequencies and tighter timing closure. |
| Supply Voltage | 1.2 V core | 1.2 V core | Identical core voltage simplifies power supply design and compatibility. |
| User I/O Count | 178 | 360 | Different I/O counts affect the number of peripherals and interfaces that can be supported. |
| Embedded Memory | 588 kbits | 588 kbits | Equal embedded memory supports similar on-chip buffering and data storage requirements. |
| Configuration Method | Instant-on, dual configuration | Instant-on, dual configuration | Same configuration features allow similar boot and fail-safe behavior in system designs. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256C8G | 10M16DCF484I7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256C8G and the 10M16DCF484I7G?
The 10M16DAF256C8G is a MAX 10 FPGA in a 256-pin FineLine BGA package with a commercial temperature grade (0°C to 85°C junction) and speed grade 8. The 10M16DCF484I7G is a MAX 10 FPGA in a 484-pin FineLine BGA package with an industrial temperature grade (-40°C to 100°C junction) and speed grade 7. Both devices feature 16,000 logic elements (LEs), but they differ in package, temperature range, and speed grade.
Do the 10M16DAF256C8G and 10M16DCF484I7G have the same logic density?
Yes. Both devices are part of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with identical embedded memory and DSP block resources as defined by the MAX 10 10M16 device specification.
Can the 10M16DAF256C8G be used as a drop-in replacement for the 10M16DCF484I7G?
No. The two devices have different package footprints (256-pin vs. 484-pin FineLine BGA), different temperature grades (commercial vs. industrial), and different speed grades (8 vs. 7). A direct drop-in replacement is not possible without verifying pin compatibility, thermal requirements, and timing closure against the target design.
Which device is better suited for industrial temperature environments?
The 10M16DCF484I7G is rated for the industrial temperature range (-40°C to 100°C junction), making it suitable for industrial applications. The 10M16DAF256C8G is rated for the commercial temperature range (0°C to 85°C junction) and is intended for commercial-grade environments.
What is the difference in speed grade between the 10M16DAF256C8G and the 10M16DCF484I7G?
The 10M16DAF256C8G has a speed grade of 8, while the 10M16DCF484I7G has a speed grade of 7. In Intel FPGA nomenclature, a lower speed grade number indicates faster performance. Therefore, the 10M16DCF484I7G offers faster timing characteristics than the 10M16DAF256C8G.
Do both devices support the same configuration methods?
Yes. Both the 10M16DAF256C8G and 10M16DCF484I7G are Intel MAX 10 FPGAs and support the same configuration options, including internal configuration via on-chip flash, as well as external configuration through JTAG and other supported modes as specified in the MAX 10 device documentation.
Are the I/O pin counts different between the 10M16DAF256C8G and the 10M16DCF484I7G?
Yes. The 10M16DAF256C8G in the 256-pin FineLine BGA package provides a different number of user I/O pins than the 10M16DCF484I7G in the 484-pin FineLine BGA package. The exact user I/O counts are defined in the Intel MAX 10 device pin-out files and should be verified against the specific package option in the manufacturer datasheet.