Part A
10M16DAF256C8G
訊息
- Lifecycle
- Active
- Stock
- 4171 件
- Package
- BGA-256
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256C8G and 10M16DCF484C7G are both Intel MAX 10 FPGA devices sharing the same 16,000 logic element density, core architecture, and 3.3 V configuration scheme, making them functionally interchangeable at the logic level. However, they differ in package type, pin count, and speed grade, so a direct drop-in replacement is not possible without PCB redesign and timing revalidation. The 10M16DAF256C8G offers a larger 256-pin FBGA package with more user I/O, while the 10M16DCF484C7G provides a compact 484-pin FBGA with a faster C7 speed grade. Designers should treat this pairing as a functional replacement candidate subject to package, I/O, and timing verification.
Logic Density
High match
Package Type
Validation required
I/O Count
Validation required
Speed Grade
Not compatible
Parts at a glance
Part B
10M16DCF484C7G
訊息
- Lifecycle
- Active
- Stock
- 6411 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256C8G | 10M16DCF484C7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which supports functional substitutability at the architecture level. |
| Logic Elements (LEs) | 16,000 | 16,000 | Equal logic capacity means both can implement the same logic designs without resource constraints. |
| Package | 256-pin FBGA | 484-pin FBGA | Different package footprints and pin counts affect PCB layout, routing, and mechanical compatibility. |
| Package Size | 17 x 17 mm | 23 x 23 mm | Board space and mechanical constraints differ, impacting physical drop-in replacement. |
| Maximum User I/O | 178 | 320 | The 484-pin device offers more I/O, enabling more peripheral connections but requiring a larger board. |
| Speed Grade | 8 (fastest) | 7 (slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Operating Temperature Range | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Identical temperature ranges ensure both devices work in the same environmental conditions. |
| Embedded Memory | 5,888 Kbits | 5,888 Kbits | Equal on-chip memory supports the same data buffering and storage requirements. |
| Analog-to-Digital Converter (ADC) | Yes (1 MSPS, 12-bit) | Yes (1 MSPS, 12-bit) | Both integrate an ADC, allowing analog signal monitoring without external components. |
| Configuration Flash Memory | Yes (internal) | Yes (internal) | Internal configuration flash enables single-chip operation and instant-on capability for both devices. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256C8G | 10M16DCF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256C8G and the 10M16DCF484C7G?
The 10M16DAF256C8G is a MAX 10 FPGA in a 256-pin FineLine BGA package with a commercial temperature grade of 0°C to 85°C junction temperature and speed grade 8. The 10M16DCF484C7G is a MAX 10 FPGA in a 484-pin FineLine BGA package with a commercial temperature grade of 0°C to 85°C junction temperature and speed grade 7. Both devices feature 16,000 logic elements (LEs), but they differ in package, pin count, and speed grade.
Do the 10M16DAF256C8G and 10M16DCF484C7G have the same logic density?
Yes. Both devices are part of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with identical embedded memory and DSP block resources as defined by the MAX 10 10M16 device specification.
Can the 10M16DAF256C8G be used as a drop-in replacement for the 10M16DCF484C7G?
No. The two devices have different package types and pin counts: the 10M16DAF256C8G uses a 256-pin FineLine BGA (FBGA) package, while the 10M16DCF484C7G uses a 484-pin FineLine BGA (FBGA) package. The PCB footprint, pinout, and available I/O pins differ, so a direct drop-in replacement is not possible without a redesign.
What is the difference in speed grade between the 10M16DAF256C8G and the 10M16DCF484C7G?
The 10M16DAF256C8G has a speed grade of 8, while the 10M16DCF484C7G has a speed grade of 7. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10M16DCF484C7G (speed grade 7) offers higher performance than the 10M16DAF256C8G (speed grade 8).
Are the operating temperature ranges the same for both devices?
Yes. Both the 10M16DAF256C8G and the 10M16DCF484C7G are specified with a commercial temperature grade, supporting a junction temperature (TJ) range of 0°C to 85°C.
Which device offers more user I/O pins?
The 10M16DCF484C7G, with its 484-pin FineLine BGA package, provides more user I/O pins than the 10M16DAF256C8G, which is housed in a 256-pin FineLine BGA package. The exact number of user I/O pins for each device should be confirmed from the official Intel MAX 10 device pin-out files.
Do both devices support the same configuration methods?
Yes. Both the 10M16DAF256C8G and the 10M16DCF484C7G are MAX 10 FPGAs and support the same configuration schemes, including internal configuration via on-chip flash memory, as well as external configuration through JTAG and other supported modes defined in the MAX 10 FPGA device documentation.