Part A
10CL055YF484C8G
訊息
- Lifecycle
- Active
- Stock
- 4745 件
- Package
- FBGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Replacement verdict
Compatible functional replacement candidate
The 10CL080YF484I7G and 10CL055YF484C8G share the same 484-pin FineLine BGA package, Cyclone 10 LP device family, and 1.0 V core architecture, making them mechanically and electrically compatible at the board level. However, the 10CL080YF484I7G offers higher logic density and a wider industrial temperature range, while the 10CL055YF484C8G provides a commercial-grade, lower-density alternative. Designers must validate logic utilization, timing closure, and thermal margins before substituting one for the other in a given application.
Package Type
High match
Logic Density
Validation required
Operating Temperature
Validation required
Core Voltage
High match
Parts at a glance
Part B
10CL080YF484I7G
訊息
- Lifecycle
- Active
- Stock
- 2707 件
- Package
- BGA-484
- Series
- 嵌入式FPGA（現場可程式設計閘陣列）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10CL080YF484I7G | 10CL055YF484C8G | Why it matters |
|---|---|---|---|
| Logic Elements (LEs) | 80,000 | 55,000 | Logic capacity determines how much digital logic can be implemented; a smaller device may not fit a design built for a larger one. |
| Total RAM Bits | 2,810,624 | 2,396,160 | Embedded memory affects buffering, FIFO depth, and data storage capability; insufficient RAM can prevent a design from fitting. |
| Embedded Multiplier (18x18) Blocks | 150 | 120 | DSP blocks are needed for arithmetic-intensive functions such as filtering and multiplication; fewer blocks may limit signal processing performance. |
| Maximum User I/O Pins | 278 | 278 | I/O count determines how many external signals can be interfaced; matching counts supports similar board-level connectivity. |
| Package / Pin Count | FBGA-484 | FBGA-484 | Package and pin count must match for physical board compatibility and footprint interchangeability. |
| Speed Grade | 7 (Fastest) | 8 (Slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet timing requirements of a faster design. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Temperature grade determines suitability for harsh or industrial environments versus commercial applications. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Core voltage must match the board power design; identical values ensure electrical compatibility. |
| Family / Series | Cyclone 10 LP | Cyclone 10 LP | Same device family ensures compatible configuration tools, IP cores, and design flow. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10CL055YF484C8G | 10CL080YF484I7G |
|---|---|---|
| Series | Cyclone® 10 LP | Cyclone® 10 LP |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3491 | 5079 |
| Number of Logic Elements/Cells | 55856 | 81264 |
| Total RAM Bits | 2396160 | 2810880 |
| Number of I/O | 321 | 289 |
| Voltage - Supply | 1.2V | 1.2V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10CL080YF484I7G and the 10CL055YF484C8G?
The 10CL080YF484I7G is a Cyclone 10 LP FPGA with 80,000 logic elements and an industrial temperature grade (I7), while the 10CL055YF484C8G has 55,000 logic elements and a commercial temperature grade (C8). Both use the same 484-pin FBGA package but differ in logic density and speed/temperature grade.
Are the 10CL080YF484I7G and 10CL055YF484C8G pin-compatible?
Yes, both devices are offered in the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel's Cyclone 10 LP device family documentation. However, pin compatibility does not guarantee functional equivalence; logic density and timing differences must be evaluated.
Can the 10CL055YF484C8G be used as a direct drop-in replacement for the 10CL080YF484I7G?
No, a direct drop-in replacement is not recommended without design validation. The 10CL080YF484I7G offers higher logic density (80K LE vs. 55K LE) and a wider industrial temperature range, so the 10CL055YF484C8G may not meet the original design's resource or environmental requirements.
What are the operating temperature ranges for these two devices?
The 10CL080YF484I7G is rated for industrial temperature operation, typically -40°C to +100°C junction temperature (TJ). The 10CL055YF484C8G is rated for commercial temperature operation, typically 0°C to +85°C junction temperature (TJ). These ranges are defined in Intel's Cyclone 10 LP datasheet.
Do both devices support the same configuration and I/O standards?
Yes, both are Cyclone 10 LP family members and support the same configuration schemes (e.g., active serial, JTAG) and I/O standards (e.g., LVCMOS, LVTTL, SSTL, HSTL) as documented in the Cyclone 10 LP device handbook. The available I/O count may differ due to logic density but the package pin count is identical.
Which device has a higher maximum operating frequency?
The 10CL080YF484I7G has a speed grade of 7 (faster) while the 10CL055YF484C8G has a speed grade of 8 (slower). Therefore, the 10CL080YF484I7G generally supports higher maximum operating frequencies for core and I/O timing, as specified in Intel's Cyclone 10 LP speed grade documentation.
Are these devices RoHS compliant and lead-free?
Yes, both the 10CL080YF484I7G and 10CL055YF484C8G are offered in RoHS-compliant, lead-free packages as stated in Intel's product material declarations and distributor datasheets. The "G" suffix in the ordering code indicates lead-free/RoHS compliance.
What is the typical power consumption difference between the two devices?
The 10CL080YF484I7G, having more logic elements, generally consumes more static and dynamic power than the 10CL055YF484C8G under equivalent operating conditions. Exact power figures depend on design utilization, clock frequency, and I/O activity, and should be calculated using Intel's Early Power Estimator (EPE) tool.