10CL055YF484C8G vs 10CL080YF484C6G

對 10CL055YF484C8G 和 10CL080YF484C6G 的深入比較,為您帶來關於其規格和關鍵特性的寶貴見解。我們詳細介紹了重要因素,包括 RoHS 合規性、REACH 狀態、系列、安裝方式、封裝類型以及其他相關特性。並排展示差異,簡化了元件選擇,讓您更輕鬆地為您的特定應用選擇最佳方案。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10CL080YF484C6G is a viable functional replacement candidate for the 10CL055YF484C8G, sharing the same package, logic family, and supply architecture, though the higher logic density and faster speed grade of the 10CL080YF484C6G require timing and power budget validation before substitution.

Package Type High match
Logic Family High match
Logic Density Validation required
Speed Grade Validation required

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10CL055YF484C8G 10CL080YF484C6G Why it matters
Logic Elements (LEs) 55,000 80,000 LE count determines the amount of programmable logic available; a higher count allows more complex designs, so the two devices are not directly substitutable for logic-capacity-bound designs.
Total RAM Bits 2,396,160 2,810,880 Embedded memory capacity affects how much data can be buffered or stored on-chip; differing RAM sizes can change whether a design fits without external memory.
Embedded Multiplier (18x18) Blocks 156 244 DSP blocks determine digital signal processing throughput; fewer multipliers may limit arithmetic-intensive applications such as filtering or FFTs.
Maximum User I/O Pins 321 321 I/O count defines how many external signals the device can interface with; matching I/O counts supports similar board-level connectivity.
Speed Grade 8 6 Speed grade indicates the maximum operating frequency and timing performance; a faster grade (lower number) can meet tighter timing requirements but may consume more power.
Core Supply Voltage 1.2 V 1.2 V Core voltage must match the board power design; identical values allow the same power rail to be reused.
Package / Case 484-FBGA (23x23) 484-FBGA (23x23) Package and footprint must match for physical board compatibility; identical packages allow drop-in replacement without PCB changes.
Operating Temperature Range 0°C to 85°C (Commercial) 0°C to 85°C (Commercial) Temperature range determines the environments in which the device can reliably operate; matching ranges ensure equivalent environmental suitability.
Configuration Memory Type SRAM-based (volatile) SRAM-based (volatile) Volatile SRAM configuration requires external configuration memory at power-up; both devices share the same boot and configuration architecture.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10CL055YF484C8G 10CL080YF484C6G
Supplier - Intel
Series Cyclone® 10 LP Cyclone® 10 LP
Part Status Active Active
Number of LABs/CLBs 3491 5079
Number of Logic Elements/Cells 55856 81264
Total RAM Bits 2396160 2810880
Number of I/O 321 289
Voltage - Supply 1.2V 1.2V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 10CL055YF484C8G and the 10CL080YF484C6G?

The 10CL055YF484C8G is an Intel Cyclone 10 LP FPGA with 55,000 logic elements and a speed grade of 8, while the 10CL080YF484C6G has 80,000 logic elements and a speed grade of 6. Both are in the same 484-pin FBGA package, but the 10CL080 offers higher logic density and a faster speed grade.

Are the 10CL055YF484C8G and 10CL080YF484C6G pin-compatible?

Yes, both devices use the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel for the Cyclone 10 LP family. However, designers must verify that all I/O and power pins are correctly assigned for the specific device configuration.

Can the 10CL055YF484C8G be used as a drop-in replacement for the 10CL080YF484C6G?

No, they are not direct drop-in replacements. The 10CL080YF484C6G has a higher logic density and a faster speed grade (6 vs. 8), which may affect timing, power consumption, and configuration bitstream. A redesign and recompilation are required.

What is the operating temperature range for both devices?

Both the 10CL055YF484C8G and 10CL080YF484C6G are specified for commercial temperature range (0°C to 85°C junction temperature) as indicated by the "C" in the part number suffix. Industrial and automotive variants are available with different suffixes.

Which device consumes more power?

The 10CL080YF484C6G generally consumes more power than the 10CL055YF484C8G due to its higher logic density and faster speed grade. Exact power consumption depends on the design's resource utilization, clock frequency, and I/O activity, and should be estimated using Intel's PowerPlay Early Power Estimator.

Are the configuration methods the same for both FPGAs?

Yes, both devices support the same configuration schemes as part of the Cyclone 10 LP family, including active serial (AS), passive serial (PS), JTAG, and fast passive parallel (FPP). The configuration bitstream size differs due to different logic densities.

What is the maximum number of user I/O pins available on each device?

The 10CL055YF484C8G provides up to 321 user I/O pins, while the 10CL080YF484C6G provides up to 321 user I/O pins in the same 484-pin FBGA package. The actual number available depends on the configuration and whether dedicated pins are used.

Do both devices support the same embedded memory and multiplier resources?

No, the 10CL080YF484C6G offers more embedded memory blocks and embedded multipliers than the 10CL055YF484C8G. The 10CL055 has 2,340 Kbits of embedded memory and 124 18x18 multipliers, while the 10CL080 has 3,024 Kbits and 150 multipliers, according to Intel Cyclone 10 LP device specifications.