規格
| 屬性 | 價值 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
概述
Description
XCZU2CG-1SBVA484I is a Xilinx Zynq UltraScale+ MPSoC device (ZU2CG family). It combines a Processing System (ARM cores) with Programmable Logic (PL) on a single chip, enabling PS-PL tightly integrated embedded processing and custom logic.
Key points:
- Package and grade: 484-ball VFBGA in industrial (-I) temperature range.
- Architecture: Zynq UltraScale+ MPSoC with PS-PL interconnect for high-bandwidth data and control flows.
- I/O and interfaces: high-speed transceivers, DDR4/LPDDR4 memory interfaces, PCIe, USB, Gigabit Ethernet, and other common peripherals.
- Applications: embedded control and data processing, hardware acceleration, multimedia, communications, automotive, and industrial automation.
For exact specs (logic resources, transceivers, memory controllers, power, and performance), refer to the Xilinx datasheet and product pages for XCZU2CG-1SBVA484I.
Key points:
- Package and grade: 484-ball VFBGA in industrial (-I) temperature range.
- Architecture: Zynq UltraScale+ MPSoC with PS-PL interconnect for high-bandwidth data and control flows.
- I/O and interfaces: high-speed transceivers, DDR4/LPDDR4 memory interfaces, PCIe, USB, Gigabit Ethernet, and other common peripherals.
- Applications: embedded control and data processing, hardware acceleration, multimedia, communications, automotive, and industrial automation.
For exact specs (logic resources, transceivers, memory controllers, power, and performance), refer to the Xilinx datasheet and product pages for XCZU2CG-1SBVA484I.
Features
Here are the key features of XCZU2CG-1SBVA484I (Zynq UltraScale+ MPSoC ZU2CG):
- Zynq UltraScale+ MPSoC device in a 484-ball BGA, industrial temperature grade (-40 to 100 C).
- Quad-core ARM Cortex-A53 application processor with a Real-Time Processing Unit (RPU) for deterministic tasks.
- Integrated programmable logic (FPGA) fabric with LUTs/Flip-Flops, DSP slices and Block RAM for custom hardware accelerators.
- Hardened security features including cryptographic accelerators and secure boot support.
- High-speed I/O and transceivers with multiple memory and peripheral interfaces (memory controllers and broad I/O options).
- Flexible connectivity and integration potential for embedded systems requiring CPU + FPGA mix.
Note: For exact specifications (CPU frequency, exact FPGA resources, memory interface types, I/O counts), please refer to the official Xilinx/Zynq UltraScale+ MPSoC datasheet.
- Zynq UltraScale+ MPSoC device in a 484-ball BGA, industrial temperature grade (-40 to 100 C).
- Quad-core ARM Cortex-A53 application processor with a Real-Time Processing Unit (RPU) for deterministic tasks.
- Integrated programmable logic (FPGA) fabric with LUTs/Flip-Flops, DSP slices and Block RAM for custom hardware accelerators.
- Hardened security features including cryptographic accelerators and secure boot support.
- High-speed I/O and transceivers with multiple memory and peripheral interfaces (memory controllers and broad I/O options).
- Flexible connectivity and integration potential for embedded systems requiring CPU + FPGA mix.
Note: For exact specifications (CPU frequency, exact FPGA resources, memory interface types, I/O counts), please refer to the official Xilinx/Zynq UltraScale+ MPSoC datasheet.
Pinout
XCZU2CG-1SBVA484I is a Xilinx Zynq UltraScale+ MPSoC in a 484-ball BGA package (484 pins). Its function: a heterogeneous System‑on‑Chip combining ARM processing system (application and real‑time cores), FPGA programmable logic, memory controllers and high‑speed I/O (for embedded processing, hardware acceleration, and I/O‑intensive applications). (Suffixes: -1 = speed grade, BVA484 = package, I = industrial temp.)
Manufacturer
Manufacturer: Xilinx (now part of AMD — marketed as AMD Xilinx).
What kind of company: Xilinx is an American semiconductor company that designs and manufactures programmable logic devices (FPGAs), system-on-chips (e.g., Zynq UltraScale+ MPSoCs), related IP, and development tools for embedded, communications, data center, and signal-processing applications.
What kind of company: Xilinx is an American semiconductor company that designs and manufactures programmable logic devices (FPGAs), system-on-chips (e.g., Zynq UltraScale+ MPSoCs), related IP, and development tools for embedded, communications, data center, and signal-processing applications.
Application
XCZU2CG-1SBVA484I is a Zynq UltraScale+ MPSoC (ZU2) device. Common application areas:
- Industrial automation, robotics and machine-vision systems
- Embedded vision and edge AI (real-time image/video processing)
- Automotive electronics (in-vehicle gateways, ADAS, infotainment)
- Networking, communications and edge data processing
- Medical imaging and portable diagnostic devices
- Rugged aerospace/defense electronics (avionics, signal processing)
- Industrial automation, robotics and machine-vision systems
- Embedded vision and edge AI (real-time image/video processing)
- Automotive electronics (in-vehicle gateways, ADAS, infotainment)
- Networking, communications and edge data processing
- Medical imaging and portable diagnostic devices
- Rugged aerospace/defense electronics (avionics, signal processing)
Package
Package: 484‑ball BGA (FBGA/FCBGA), package code BVA484 (ball grid array, 484-ball).
