XCVU5P-2FLVA2104E

XCVU5P-2FLVA2104E is a Xilinx Versal ACAP device from the Versal Premium family. It combines programmable logic, AI Engine cores, and adaptable hardware for accelerated workloads (AI, data center, 5G, etc.) in a single chip.
Key points:
- Family and tech: Versal Premium (VU5P) ACAP—heterogeneous compute with AI Engine, DSP, and adaptable logic blocks.
- Speed grade: -2 (typical performance tier within the device family; faster grades exist on other parts).
- Package: FLVA2104E — a 2104-ball flip-chip land-grid-array package with extended-temperature capability.
- Interfaces and use: supported by Xilinx/Vivado and Vitis toolchains for synthesis, placement, and software-defined acceleration.
Applications: AI inference/acceleration, high-performance networking, 5G, data-center workloads, and other heterogeneous compute tasks.
Note: For exact resource counts (logic, DSPs, AI Engine blocks, transceivers) and full electrical/spec details, consult the official Xilinx (AMD) XCVU5P-2FLVA2104E datasheet and product guides.

Equivalents depend on packaging/grade. XCVU5P-2FLVA2104E is a Versal Premium device. For cross-references, use Xilinx’s Product Catalog or distributor tools (Digi‑Key/Mouser) to find SKUs with the same resources/speed grade but different package codes (e.g., FFGA/FLGA variants). There isn’t a single universal equivalent without confirming packaging, temperature rating, and revision.

Here are the key features of XCVU5P-2FLVA2104E (Versal Premium ACAP):
- Versal Premium ACAP architecture with Processing System (PS) and Programmable Logic (PL), plus AI Engine for AI/ML workloads.
- Processing System: quad-core ARM Cortex-A72-based CPUs with a Real-Time Processing Unit (RPU) for deterministic tasks.
- AI Engine array for accelerated AI/ML inference and workloads.
- Adaptive Compute Engines (ACEs) and dense PL fabric (DSPs/LUTs) for domain-specific acceleration.
- High-density programmable logic with extensive DSP blocks and LUT resources.
- High-speed I/O and transceivers, including PCIe Gen4 support.
- Memory interfaces: DDR4/LPDDR4X (and related controllers); optional HBM2 on select configurations.
- Security features: cryptographic accelerators, secure boot and related protections.
- Package: Flip-Chip Ball Grid Array FLVA2104 (2104 balls).
- Suitable for data center acceleration, 5G/telecom, networking, vision, and other demanding workloads.

- Pin count: 2104 pins (FLVA2104E is a 2104-ball flip-chip land grid array).
- Function: Xilinx Versal XCVU5P device – a high-end Adaptive Compute Acceleration Platform (ACAP)/FPGA with programmable logic, DSPs, AI Engines, and high-speed I/O for acceleration in data-center, automotive, and edge workloads.

- Manufacturer: AMD Xilinx (formerly Xilinx, Inc.; now part of AMD).
- What kind of company: A semiconductor company that designs and manufactures programmable logic devices (FPGA/ACAP/SoC) and related technologies.

Typical application areas for XCVU5P-2FLVA2104E include:
- Data center and AI acceleration (inference, video analytics)
- Networking and communications (high-speed NIC offloads, SDN, 400G/800G)
- 5G and edge computing (RAN/DU, MEC)
- Vision, imaging and automotive (ADAS, machine vision, sensor fusion)
- Industrial IoT and embedded applications (edge AI, automation)
- HPC and custom accelerators (scientific compute, data processing)

Flip-Chip Land Grid Array (FLGA) package, 2104-ball; RoHS-compliant (E).