規格
| 屬性 | 價值 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 216000 |
| Number of Logic Elements/Cells | 3780000 |
| Total RAM Bits | 514867200 |
| Number of I/O | 448 |
| Voltage - Supply | 0.698V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 110°C (TJ) |
概述
Description
XCVU13P-L2FLGA2577E is a Xilinx Versal UltraScale+ FPGA (ACAP) device, in the Versal Premium family. It combines programmable logic with hardened processing, AI Engines, and high‑bandwidth interconnect to accelerate compute, networking, and AI workloads. The part uses a L2FLGA2577E FineLine BGA package with 2,577 balls (dense pin count) for demanding boards. Typical capabilities include large configurable logic, DSP blocks, multiple high‑speed transceivers, substantial on‑chip memory, and integrated AI Engine cores for ML workloads, plus standard I/O interfaces (PCIe, memory controllers, etc.). It targets workloads such as 5G RAN, data‑center acceleration, edge computing, and advanced networking. For exact specs (logic cells, DSP slices, AI Engine count, transceivers, power, package details), refer to the official Xilinx/AMD datasheet and product page for XCVU13P‑L2FLGA2577E.
Features
XCVU13P-L2FLGA2577E is a Xilinx Versal ACAP device (L2 package, 2577-ball Flip-Chip LG). Key features:
- Heterogeneous compute: FPGA fabric + AI Engine cores for ML/AI workloads
- Process/tech: 7nm FinFET manufacturing (Versal architecture)
- High IO and interconnect: multiple high-speed transceivers and standard I/O interfaces
- Memory interfaces: multi-port memory access (DDR/LPDDR families) with on-chip storage support
- PCIe/erasable interfaces: PCIe host interface for fast data transfer
- Security: cryptographic accelerators and security features
- Power and thermal management suited for data-center, networking, and edge applications
- Target applications: data-center acceleration, 5G/edge compute, network processing, and other heterogeneous workloads
Note: exact resources (logic cells, DSPs, AI Engine count, memory size) vary by device revision. For precise numbers, consult the official datasheet and user guide.
- Heterogeneous compute: FPGA fabric + AI Engine cores for ML/AI workloads
- Process/tech: 7nm FinFET manufacturing (Versal architecture)
- High IO and interconnect: multiple high-speed transceivers and standard I/O interfaces
- Memory interfaces: multi-port memory access (DDR/LPDDR families) with on-chip storage support
- PCIe/erasable interfaces: PCIe host interface for fast data transfer
- Security: cryptographic accelerators and security features
- Power and thermal management suited for data-center, networking, and edge applications
- Target applications: data-center acceleration, 5G/edge compute, network processing, and other heterogeneous workloads
Note: exact resources (logic cells, DSPs, AI Engine count, memory size) vary by device revision. For precise numbers, consult the official datasheet and user guide.
Pinout
- Pin count: 2577 pins
- Function: Xilinx Virtex UltraScale+ FPGA (XCVU13P) in an L2FLGA2577E flip-chip land-grid array package; provides high-density programmable logic with DSP, memory interfaces, and multi‑gigabit transceivers.
- Function: Xilinx Virtex UltraScale+ FPGA (XCVU13P) in an L2FLGA2577E flip-chip land-grid array package; provides high-density programmable logic with DSP, memory interfaces, and multi‑gigabit transceivers.
Manufacturer
- Manufacturer: Xilinx (now a subsidiary of AMD).
- What kind of company: A multinational semiconductor company that designs and markets programmable logic devices, including FPGAs and adaptive compute acceleration platforms (ACAPs) and related chips.
- What kind of company: A multinational semiconductor company that designs and markets programmable logic devices, including FPGAs and adaptive compute acceleration platforms (ACAPs) and related chips.
Application
- Data-center AI/ML inference and acceleration
- 5G/telecom and high-throughput packet processing
- Edge computing, vision and AI workloads
- Automotive, robotics, radar and sensor fusion
- SDR/RF communications and DSP-intensive applications
- Industrial, defense/ISR, imaging and custom accelerator prototyping
Notes: XCVU13P-L2FLGA2577E is a Versal ACAP device suitable for heterogeneous compute, AI acceleration, programmable networking, and high-performance signal processing across data centers, telecom, edge, automotive, and defense applications.
- 5G/telecom and high-throughput packet processing
- Edge computing, vision and AI workloads
- Automotive, robotics, radar and sensor fusion
- SDR/RF communications and DSP-intensive applications
- Industrial, defense/ISR, imaging and custom accelerator prototyping
Notes: XCVU13P-L2FLGA2577E is a Versal ACAP device suitable for heterogeneous compute, AI acceleration, programmable networking, and high-performance signal processing across data centers, telecom, edge, automotive, and defense applications.
Package
FLGA: Flip-Chip Land Grid Array, 2,577-ball package (L2FLGA2577E) for XCVU13P.
