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XCAU10P-2FFVB676I
+物料清單IC FPGA ARTIXUP 676BGA
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製造商AMD
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製造商部分 #XCAU10P-2FFVB676I
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有存貨4165
365 天品質保證
7*24 小時服務保證
90-日售後保障
正品保證
規格
| 屬性 | 價值 |
| Series | Artix® UltraScale+ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 3670016 |
| Number of I/O | 228 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Number of Logic Elements/Cells | 96250 |
| Number of LABs/CLBs | 5500 |
概述
Description
Key specifications include:
- Architecture: Boasts a heterogeneous architecture that integrates programmable logic, AI engines, DSP engines, and memory.
- Package: It comes in a compact 676-ball FFG (Fine Pitch Ball Grid Array) package.
- Performance: Supports high-speed connectivity options, including PCIe, Ethernet, and more, allowing for flexible data handling and processing.
- Power Efficiency: Optimized for energy-efficient operation while delivering substantial computational power.
- Development: Programmable using Vitis and Vivado design tools, facilitating easy implementation of complex algorithms and applications.
Overall, the XCAU10P-2FFVB676I is ideal for developers needing robust processing solutions that can adapt to evolving technological demands.
Equivalent
Features
1. Architecture: Based on the UltraScale+ architecture, offering a combination of high bandwidth and low power consumption.
2. Logic Cells: Contains up to 10,000 logic cells, allowing for complex designs and applications.
3. Memory: Integrated block RAM (BRAM) for on-chip memory needs, enhancing data processing speeds.
4. DSP Slices: Contains DSP slices for high-performance digital signal processing applications.
5. Multiple I/O Standards: Supports a wide range of I/O standards for versatile connectivity.
6. Transceivers: Equipped with high-speed transceivers for fast data transmission.
7. On-chip Debugging: Features advanced debugging capabilities for easier development and troubleshooting.
8. Power Efficiency: Designed for optimized power usage, suitable for energy-sensitive applications.
This FPGA is ideal for applications in telecommunications, data centers, and embedded systems, where high performance and flexibility are crucial.
Pinout
This SoC integrates programmable logic and a processing system, allowing for a wide range of applications in areas like embedded computing, telecommunications, and data processing. The specific pin functions can be detailed in the device's datasheet, which outlines the pin assignments and capabilities, enabling users to configure them according to their design requirements.
For detailed information on each pin's function and configuration options, refer to the Xilinx documentation for the XCAU10P series.
Manufacturer
Founded in 1984, Xilinx pioneered the FPGA technology and has since become a leader in the semiconductor industry. The company focuses on providing solutions for a wide range of applications, including data centers, automotive, aerospace, industrial, and telecommunications. Its products enable engineers to create custom hardware configurations that can be updated in the field, offering flexibility and efficiency for various digital designs.
In 2020, AMD announced its acquisition of Xilinx, expanding its portfolio to include advanced adaptive computing technologies, which enhance AMD's capabilities in high-performance computing and artificial intelligence applications.