規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
概述
Description
The XC7Z030-2SBG485I is a member of the Zynq-7000 All Programmable SoC family by Xilinx. It integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic, offering both processing and programmable capabilities in a single chip. This makes it ideal for applications requiring high performance and flexibility, such as embedded systems, communications, and image processing.
Key features of the XC7Z030-2SBG485I include 125,000 logic cells, 1,065 KB of block RAM, and 400 DSP slices, providing ample resources for complex computations. It supports various interfaces like USB, Ethernet, and UART, enhancing connectivity options. The device operates over an industrial temperature range, denoted by the "-I" in its part number, making it suitable for harsh environments.
Packaged in a 485-pin BGA (Ball Grid Array), the XC7Z030-2SBG485I offers a balance of performance, power, and size, making it a versatile solution for modern electronic designs requiring integrated processing and FPGA capabilities.
Key features of the XC7Z030-2SBG485I include 125,000 logic cells, 1,065 KB of block RAM, and 400 DSP slices, providing ample resources for complex computations. It supports various interfaces like USB, Ethernet, and UART, enhancing connectivity options. The device operates over an industrial temperature range, denoted by the "-I" in its part number, making it suitable for harsh environments.
Packaged in a 485-pin BGA (Ball Grid Array), the XC7Z030-2SBG485I offers a balance of performance, power, and size, making it a versatile solution for modern electronic designs requiring integrated processing and FPGA capabilities.
Equivalent
The XC7Z030-2SBG485I is a Xilinx Zynq-7000 SoC, which integrates a dual-core ARM Cortex-A9 processor with FPGA fabric. Equivalent products may include:
1. Intel Cyclone V SoC series - Combines ARM processors with FPGA.
2. Microchip SmartFusion2 - Integrates ARM Cortex-M3 with FPGA.
3. Lattice ECP5 series - FPGA with soft processor IP.
4. Altera (Intel) Arria V SoC - ARM-based SoC with FPGA capabilities.
These alternatives vary in specific features and performance, so choosing depends on your specific requirements.
1. Intel Cyclone V SoC series - Combines ARM processors with FPGA.
2. Microchip SmartFusion2 - Integrates ARM Cortex-M3 with FPGA.
3. Lattice ECP5 series - FPGA with soft processor IP.
4. Altera (Intel) Arria V SoC - ARM-based SoC with FPGA capabilities.
These alternatives vary in specific features and performance, so choosing depends on your specific requirements.
Features
The XC7Z030-2SBG485I is part of Xilinx's Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with Xilinx's 7-series FPGA fabric. Key features include:
1. Processor System:
- Dual-core ARM Cortex-A9 MPCore processor.
- NEON engine for enhanced multimedia processing.
- Supports up to 1GHz operation.
2. FPGA Fabric:
- 125K logic cells.
- 400 DSP slices for high-performance signal processing.
- Over 200 user I/Os for flexibility in interfacing.
3. Memory and Storage:
- Integrated memory controllers supporting DDR3, DDR3L, LPDDR2.
- Advanced eMMC and SD/SDIO interfaces.
4. Connectivity:
- Gigabit Ethernet, USB 2.0, and CAN interfaces.
- Multiple high-speed serial connectivity options.
5. Temperature and Package:
- Industrial-grade temperature range (-40°C to +100°C).
- SBG485 package.
6. Additional Features:
- Advanced power management.
- Security features like AES-256 decryption and RSA authentication.
This versatile platform is ideal for applications requiring high integration and performance, such as embedded vision, automotive, and communication systems.
1. Processor System:
- Dual-core ARM Cortex-A9 MPCore processor.
- NEON engine for enhanced multimedia processing.
- Supports up to 1GHz operation.
2. FPGA Fabric:
- 125K logic cells.
- 400 DSP slices for high-performance signal processing.
- Over 200 user I/Os for flexibility in interfacing.
3. Memory and Storage:
- Integrated memory controllers supporting DDR3, DDR3L, LPDDR2.
- Advanced eMMC and SD/SDIO interfaces.
4. Connectivity:
- Gigabit Ethernet, USB 2.0, and CAN interfaces.
- Multiple high-speed serial connectivity options.
5. Temperature and Package:
- Industrial-grade temperature range (-40°C to +100°C).
- SBG485 package.
6. Additional Features:
- Advanced power management.
- Security features like AES-256 decryption and RSA authentication.
This versatile platform is ideal for applications requiring high integration and performance, such as embedded vision, automotive, and communication systems.
Pinout
The XC7Z030-2SBG485I is a part of the Xilinx Zynq-7000 family, which integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic. The package type for this specific model is SBG485, which indicates a BGA (Ball Grid Array) package with 485 pins.
The primary functions of the XC7Z030-2SBG485I include processing capabilities through the ARM Cortex-A9 processors, programmable logic through the FPGA fabric, and a rich set of input/output (I/O) interfaces. It supports various interfaces such as Ethernet, USB, UART, I2C, and SPI, among others, allowing for versatile applications in embedded systems. Additionally, it features high-bandwidth memory interfaces and dynamic reconfiguration capabilities, suitable for applications requiring high performance and flexibility. Its industrial-grade rating, denoted by the "I" in the model number, ensures reliable operation over a broad temperature range, making it suitable for demanding environments.
The primary functions of the XC7Z030-2SBG485I include processing capabilities through the ARM Cortex-A9 processors, programmable logic through the FPGA fabric, and a rich set of input/output (I/O) interfaces. It supports various interfaces such as Ethernet, USB, UART, I2C, and SPI, among others, allowing for versatile applications in embedded systems. Additionally, it features high-bandwidth memory interfaces and dynamic reconfiguration capabilities, suitable for applications requiring high performance and flexibility. Its industrial-grade rating, denoted by the "I" in the model number, ensures reliable operation over a broad temperature range, making it suitable for demanding environments.
Manufacturer
The XC7Z030-2SBG485I is manufactured by Xilinx, Inc. Xilinx is a technology company known for designing and creating programmable logic devices. As a leader in the field, Xilinx specializes in producing field-programmable gate arrays (FPGAs), adaptive SoCs (system-on-chips), and a range of related technologies. These products allow for the customization of electronic circuits post-manufacturing, providing flexibility for designers and engineers in various applications such as telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a prominent player in the semiconductor industry, further expanding its capabilities and market reach.
Application
The XC7Z030-2SBG485I is part of the Xilinx Zynq-7000 series, which combines ARM Cortex-A9 processing with FPGA logic. It is used in a variety of applications, including:
1. Embedded Systems: For real-time processing and control.
2. Industrial Automation: In applications requiring precision control and monitoring.
3. Automotive: For advanced driver-assistance systems (ADAS) and infotainment.
4. Telecommunications: In wireless communication infrastructure and signal processing.
5. Medical Devices: For imaging and diagnostic equipment.
6. Aerospace and Defense: In applications requiring high reliability and processing power.
These applications leverage the device's versatile processing and flexible FPGA fabric.
1. Embedded Systems: For real-time processing and control.
2. Industrial Automation: In applications requiring precision control and monitoring.
3. Automotive: For advanced driver-assistance systems (ADAS) and infotainment.
4. Telecommunications: In wireless communication infrastructure and signal processing.
5. Medical Devices: For imaging and diagnostic equipment.
6. Aerospace and Defense: In applications requiring high reliability and processing power.
These applications leverage the device's versatile processing and flexible FPGA fabric.
Package
The XC7Z030-2SBG485I is a Xilinx Zynq-7000 SoC (System on Chip) featuring a dual-core ARM Cortex-A9 processor and Artix-7 FPGA. The "SBG485" refers to its BGA (Ball Grid Array) package type with 485 balls. The "I" indicates it is rated for industrial temperature ranges.