規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 5125 |
| Number of Logic Elements/Cells | 65600 |
| Total RAM Bits | 4976640 |
| Number of I/O | 300 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
概述
Description
The XC7K70T-1FBG676I is a member of Xilinx's Kintex-7 FPGA family, built on a 28nm process. It features:
- Logic Cells: ~69K
- DSP Slices: 240
- Block RAM: 4,860 Kb
- I/O Pins: 400 (supports multiple standards like LVDS, LVCMOS)
- Package: 676-pin FineLine BGA (FBG676)
- Speed Grade: -1 (moderate performance)
Designed for high-performance, low-power applications, it suits wireless, automotive, and industrial systems. The Kintex-7 series balances cost and performance, offering PCIe Gen2/3, Gigabit Ethernet, and high-speed serial transceivers (up to 12.5 Gbps).
Key Use Cases:
- Embedded vision
- Signal processing
- Communications infrastructure
For detailed specs, refer to Xilinx's DS182 (Datasheet) and UG475 (Packaging Guide).
- Logic Cells: ~69K
- DSP Slices: 240
- Block RAM: 4,860 Kb
- I/O Pins: 400 (supports multiple standards like LVDS, LVCMOS)
- Package: 676-pin FineLine BGA (FBG676)
- Speed Grade: -1 (moderate performance)
Designed for high-performance, low-power applications, it suits wireless, automotive, and industrial systems. The Kintex-7 series balances cost and performance, offering PCIe Gen2/3, Gigabit Ethernet, and high-speed serial transceivers (up to 12.5 Gbps).
Key Use Cases:
- Embedded vision
- Signal processing
- Communications infrastructure
For detailed specs, refer to Xilinx's DS182 (Datasheet) and UG475 (Packaging Guide).
Equivalent
The XC7K70T-1FBG676I is a Kintex-7 FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Xilinx Kintex-7 family: XC7K70T-2FBG676I (faster speed grade).
- Competitors:
- Intel (Altera) Cyclone 10 GX (e.g., 10CX085).
- Lattice ECP5 (lower performance but cost-effective).
- Newer gen: Xilinx Artix-7 or Spartan-7 for lower-cost options.
Check pin compatibility and features for exact replacements.
- Xilinx Kintex-7 family: XC7K70T-2FBG676I (faster speed grade).
- Competitors:
- Intel (Altera) Cyclone 10 GX (e.g., 10CX085).
- Lattice ECP5 (lower performance but cost-effective).
- Newer gen: Xilinx Artix-7 or Spartan-7 for lower-cost options.
Check pin compatibility and features for exact replacements.
Features
The XC7K70T-1FBG676I is a Kintex-7 FPGA from Xilinx (now AMD) with key features:
- Logic Cells: ~67,200
- DSP Slices: 240
- Block RAM: 4,860 Kb
- Max I/O Pins: 400 (in FBG676 package)
- Transceivers: 8 GTX (6.6 Gbps each)
- Fabric Speed: Up to 1 GHz (varies by design)
- Process Tech: 28nm (low-power optimized)
- Package: 676-pin BGA (1mm pitch)
- Operating Temp: -40°C to +100°C (Industrial)
Ideal for high-speed data processing, embedded vision, and telecom. Supports PCIe Gen2/3, DDR3, and advanced DSP applications.
- Logic Cells: ~67,200
- DSP Slices: 240
- Block RAM: 4,860 Kb
- Max I/O Pins: 400 (in FBG676 package)
- Transceivers: 8 GTX (6.6 Gbps each)
- Fabric Speed: Up to 1 GHz (varies by design)
- Process Tech: 28nm (low-power optimized)
- Package: 676-pin BGA (1mm pitch)
- Operating Temp: -40°C to +100°C (Industrial)
Ideal for high-speed data processing, embedded vision, and telecom. Supports PCIe Gen2/3, DDR3, and advanced DSP applications.
Pinout
The XC7K70T-1FBG676I is a Kintex-7 FPGA from Xilinx (now AMD) in a 676-pin FineLine BGA (FBGA) package.
### Key Features:
- Pin Count: 676 pins (including power, ground, I/O, and configuration pins).
- Logic Cells: ~67,200 (7-series architecture).
- I/O Pins: ~300 user I/Os (supports multiple standards like LVCMOS, LVDS, HSTL).
- Memory: ~4.8 Mb block RAM, 240 DSP slices.
- Transceivers: Up to 16 GTX transceivers (6.6 Gbps each).
- Configuration: Supports JTAG, SPI, and BPI flash interfaces.
### Functions:
- High-speed serial communication (PCIe, SATA, Ethernet).
- DSP-intensive applications (signal processing, imaging).
- General-purpose FPGA tasks (prototyping, embedded systems).
This FPGA is used in industrial, automotive, and telecom applications.
### Key Features:
- Pin Count: 676 pins (including power, ground, I/O, and configuration pins).
- Logic Cells: ~67,200 (7-series architecture).
- I/O Pins: ~300 user I/Os (supports multiple standards like LVCMOS, LVDS, HSTL).
- Memory: ~4.8 Mb block RAM, 240 DSP slices.
- Transceivers: Up to 16 GTX transceivers (6.6 Gbps each).
- Configuration: Supports JTAG, SPI, and BPI flash interfaces.
### Functions:
- High-speed serial communication (PCIe, SATA, Ethernet).
- DSP-intensive applications (signal processing, imaging).
- General-purpose FPGA tasks (prototyping, embedded systems).
This FPGA is used in industrial, automotive, and telecom applications.
Package
The XC7K70T-1FBG676I is a Kintex-7 FPGA from Xilinx (now AMD). It comes in a 676-pin FineLine BGA (FBG676) package. This package type is a ball grid array (BGA) with a fine-pitch layout, designed for high-density applications. The "1" in the part number indicates a commercial temperature range (0°C to +85°C), and "I" denotes industrial-grade (-40°C to +100°C) reliability.
