XC7A200T-L2FBG676E

圖片僅供參考

XC7A200T-L2FBG676E

+物料清單

IC FPGA 400 I/O 676FCBGA

  • 製造商AMD Xilinx

  • 製造商部分 #XC7A200T-L2FBG676E

  • 包裹 FCBGA-676

  • 有存貨5355

365 天品質保證

7*24 小時服務保證

90-日售後保障

正品保證

規格

屬性 價值
Package / Case Tray
Series Artix-7
Part Status Active
Number of LABs/CLBs 16825
Number of Logic Elements/Cells 215360
Total RAM Bits 13455360
Number of I/O 400
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)

概述

Description

The XC7A200T-L2FBG676E is a member of the Xilinx 7 Series FPGAs, specifically from the Artix-7 family. It is designed for a variety of applications requiring high performance and low power consumption, such as digital signal processing, embedded systems, and data processing. This model is fabricated using a 28nm process technology, which contributes to its efficiency and performance.
Key features of the XC7A200T-L2FBG676E include around 215,360 logic cells, 740 DSP slices for intensive arithmetic operations, and approximately 13.14 Mb of block RAM for data storage. It offers a balanced mix of performance and power, making it suitable for medium to high-end applications. The FPGA is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package, which is compact and supports complex designs.
It supports various I/O standards and protocols, making it versatile for different application requirements. Additionally, it comes with Xilinx's Vivado Design Suite software support, which facilitates efficient design and implementation processes.

Equivalent

The XC7A200T-L2FBG676E is a Xilinx FPGA from the Artix-7 family. Equivalent products might include other FPGAs with similar resources and performance from different vendors, such as the Intel Cyclone V series, Lattice ECP5 series, or Microsemi (now part of Microchip) IGLOO2 FPGAs. When considering alternatives, ensure that they match the XC7A200T in terms of logic cells, memory, I/O capabilities, and power consumption to meet your specific project requirements.

Features

The XC7A200T-L2FBG676E is a member of the Xilinx 7 Series FPGAs, specifically part of the Artix-7 family, which is optimized for cost-sensitive applications without compromising on performance. Key features include:
1. Logic Cells: Contains approximately 215,360 logic cells, suitable for complex designs.
2. DSP Slices: Offers 740 DSP slices for efficient digital signal processing tasks.
3. Memory: Provides 13,140 Kbits of block RAM, enabling high-speed data storage and retrieval.
4. I/O Pins: Equipped with 400 I/O pins for versatile connectivity options.
5. Performance: Designed with low power consumption while achieving high performance, ideal for battery-powered applications.
6. Package: Comes in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package.
7. Speed Grade: L2 speed grade, indicating specific performance characteristics in terms of timing and data processing capabilities.
These features make the XC7A200T-L2FBG676E suitable for applications in areas such as wireless communication, high-speed data processing, and embedded systems.

Pinout

The XC7A200T-L2FBG676E is a part of the Xilinx 7 Series FPGAs, specifically from the Artix-7 family. It comes in an FBG676 package, which indicates that it has 676 pins. This FPGA is designed for applications requiring high performance and low power consumption, such as digital signal processing, logic processing, and embedded systems.
Key functions of the XC7A200T include:
1. Logic Cells: It contains around 215,360 logic cells, supporting complex digital designs.
2. I/O Pins: It provides a wide range of general-purpose I/O pins for interfacing with external components.
3. Memory: It is equipped with block RAM and distributed RAM for flexible memory architectures.
4. DSP Slices: The FPGA has DSP slices for efficient arithmetic operations.
5. Clock Management: It includes clock management tiles for robust clocking solutions.
6. Connectivity: Offers various interfaces, including PCIe, Ethernet, and more, depending on configuration.
This FPGA is suitable for cost-sensitive applications that require high performance with a focus on power efficiency.

Manufacturer

The XC7A200T-L2FBG676E is manufactured by Xilinx, Inc. Xilinx is a company that specializes in the development and sale of programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and associated software and tools.
Founded in 1984 and headquartered in San Jose, California, Xilinx is known for pioneering the fabless manufacturing model in the semiconductor industry. This means that while they design and market their products, the actual manufacturing is outsourced to third-party semiconductor fabrication plants.
Xilinx's products are widely used across various industries, including telecommunications, automotive, aerospace, defense, and consumer electronics. In 2020, the company was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry, which designs and produces microprocessors and graphics processing units (GPUs). Despite the acquisition, Xilinx continues to operate as a subsidiary under the AMD umbrella, maintaining its focus on producing programmable logic devices and solutions.

Application

The XC7A200T-L2FBG676E is a member of the Xilinx 7 Series FPGAs, specifically the Artix-7 family, known for its low power consumption and cost-effectiveness. It is widely used in various applications such as:
1. Communications: Implements high-speed data links and signal processing.
2. Automotive: Supports advanced driver assistance systems (ADAS) and in-car infotainment.
3. Industrial: Enables motor control, machine vision, and industrial networking.
4. Consumer Electronics: Powers high-definition displays and smart home devices.
5. Medical Devices: Facilitates imaging and diagnostic equipment.
6. Aerospace and Defense: Used in radar systems and secure communications.
Its versatility makes it suitable for applications requiring high performance and flexibility.

Package

The XC7A200T-L2FBG676E is a Field Programmable Gate Array (FPGA) from Xilinx's 7 Series. It features a FBG676 package type, which is a Fine-Pitch Ball Grid Array (FBGA) with 676 balls. This package type is designed for high-density applications, offering a balance between performance and compact form factor.

與XC7A200T-L2FBG676E相關的產品