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XC5VFX30T-2FFG665I
+物料清單IC FPGA 360 I/O 665FCBGA
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製造商AMD
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製造商部分 #XC5VFX30T-2FFG665I
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規格
| 屬性 | 價值 |
| Series | Virtex®-5 FXT |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 32768 |
| Total RAM Bits | 2506752 |
| Number of I/O | 360 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 665-BBGA, FCBGA |
| Supplier Device Package | 665-FCBGA (27x27) |
| Base Product Number | XC5VFX30 |
| Number of LA Bs / CL Bs | 2560 |
概述
Description
The "-2" indicates its speed grade, ensuring moderate performance characteristics. The "FFG665" refers to its package type and pin count: a Flip-Chip Ball Grid Array with 665 pins, providing robust connectivity and integration options. The "I" denotes an industrial temperature range, suitable for operation in harsher environments.
Overall, the XC5VFX30T-2FFG665I offers a versatile platform for developers looking to implement sophisticated digital designs, benefiting from Xilinx's comprehensive development tools and supporting ecosystem.
Equivalent
1. Altera Stratix III series, such as EP3SE50.
2. Lattice ECP3 series, like LFE3-35EA.
3. Microsemi (formerly Actel) ProASIC3 series, such as A3P1000.
These alternatives vary in I/O configuration, logic elements, and features, so ensure compatibility with your specific application needs.
Features
1. Architecture: Based on 65nm process technology, it offers a balance of logic, DSP, and embedded processing capabilities.
2. Logic Resources: Contains approximately 29,440 logic cells, suited for complex designs.
3. DSP Slices: Includes 192 DSP48E slices, optimized for high-speed arithmetic operations.
4. I/O and Interfaces: Supports various I/O standards with 360 I/O pins, enabling wide connectivity.
5. Embedded Processing: Features an integrated PowerPC 440 processor block for embedded applications.
6. Memory: Offers multiple Block RAMs with a total capacity of around 1.5Mb, facilitating efficient data storage and processing.
7. Performance: Operates at a speed grade of -2, ensuring high-speed data handling.
8. Temperature Range: Industrial-grade with an operating temperature range of -40°C to +100°C.
9. Package: Encapsulated in a 665-pin flip-chip fine-pitch BGA package (FFG665).
These features make the XC5VFX30T-2FFG665I suitable for a variety of high-performance and industrial applications.
Pinout
The XC5VFX30T model features include:
- 1920 slices, each containing four 6-input LUTs and four flip-flops.
- 32,640 logic cells.
- 64 DSP slices for high-performance arithmetic functions.
- 376 I/O pins with support for various high-speed interfaces.
- Embedded PowerPC 440 processor block for enhanced processing capability.
- RocketIO GTP transceivers for high-speed serial communication.
These features make it suitable for applications requiring high-performance computation, digital signal processing, and high-speed data exchange.
Manufacturer
Application
1. Telecommunications: Used for high-speed data processing, signal modulation, and demodulation.
2. Broadcast and Video Processing: Supports real-time video encoding/decoding and processing tasks.
3. Aerospace and Defense: Utilized in radar systems, signal intelligence, and secure communications.
4. Automotive: Deployed in advanced driver-assistance systems (ADAS) and infotainment solutions.
5. Industrial Automation: Applied in process control, robotics, and machine vision systems.
6. Medical Imaging: Facilitates complex image processing tasks in MRI and CT scanners.
Its adaptability and processing power make it suitable for these demanding and diverse applications.