規格
| 屬性 | 價值 |
| Package / Case | Tray |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 1920 |
| Number of Logic Elements/Cells | 17280 |
| Total RAM Bits | 442368 |
| Number of I/O | 173 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
概述
Description
The XC3S1000-4FTG256C is a Spartan-3 series FPGA from Xilinx, designed for cost-sensitive, high-performance applications.
### Key Features:
- Logic Cells: 1 million (1M) system gates
- Speed Grade: -4 (moderate speed)
- Package: FTG256 (Fine-Pitch Ball Grid Array, 256 pins)
- I/O Pins: 173 user I/Os
- On-Chip Memory: 432 Kbits block RAM
- DSP Slices: 4 (18x18 multipliers)
- Voltage: 1.2V core, 3.3V/2.5V I/O
### Applications:
- Embedded systems
- Digital signal processing (DSP)
- Industrial control
- Consumer electronics
### Advantages:
- Low-cost FPGA solution
- Flexible I/O support (LVCMOS, LVTTL, etc.)
- Reliable for mid-range designs
This FPGA is ideal for developers needing balance between performance and affordability.
### Key Features:
- Logic Cells: 1 million (1M) system gates
- Speed Grade: -4 (moderate speed)
- Package: FTG256 (Fine-Pitch Ball Grid Array, 256 pins)
- I/O Pins: 173 user I/Os
- On-Chip Memory: 432 Kbits block RAM
- DSP Slices: 4 (18x18 multipliers)
- Voltage: 1.2V core, 3.3V/2.5V I/O
### Applications:
- Embedded systems
- Digital signal processing (DSP)
- Industrial control
- Consumer electronics
### Advantages:
- Low-cost FPGA solution
- Flexible I/O support (LVCMOS, LVTTL, etc.)
- Reliable for mid-range designs
This FPGA is ideal for developers needing balance between performance and affordability.
Equivalent
The XC3S1000-4FTG256C is a Spartan-3 FPGA from Xilinx (now AMD). Equivalent alternatives include:
1. Lattice ECP3 (e.g., LFE3-70EA-8FN256C)
2. Microsemi (Microchip) ProASIC3 (e.g., A3P1000-FG256)
3. Intel (Altera) Cyclone III (e.g., EP3C40F256C8)
These offer similar logic capacity (~1M gates) and package compatibility (256-pin FineLine BGA). For exact replacements, check vendor migration guides or newer FPGAs like Spartan-6 or Artix-7.
1. Lattice ECP3 (e.g., LFE3-70EA-8FN256C)
2. Microsemi (Microchip) ProASIC3 (e.g., A3P1000-FG256)
3. Intel (Altera) Cyclone III (e.g., EP3C40F256C8)
These offer similar logic capacity (~1M gates) and package compatibility (256-pin FineLine BGA). For exact replacements, check vendor migration guides or newer FPGAs like Spartan-6 or Artix-7.
Features
The XC3S1000-4FTG256C is a Spartan-3 FPGA with:
- 1M system gates (15,552 logic cells).
- 4ns pin-to-pin delays (speed grade -4).
- 256-pin Fine-Pitch Ball Grid Array (FTG256) package.
- 24,576 Kb block RAM (16 blocks × 18 Kb each).
- 8 Digital Clock Managers (DCMs) & 4 Phase-Locked Loops (PLLs).
- 173 I/O pins (supports LVCMOS, LVTTL, HSTL, SSTL).
- 1.2V core voltage, 3.3V/2.5V I/O voltage.
- On-chip DSP support (multipliers).
- JTAG & SelectMAP configuration.
Ideal for embedded, communications, and consumer applications.
- 1M system gates (15,552 logic cells).
- 4ns pin-to-pin delays (speed grade -4).
- 256-pin Fine-Pitch Ball Grid Array (FTG256) package.
- 24,576 Kb block RAM (16 blocks × 18 Kb each).
- 8 Digital Clock Managers (DCMs) & 4 Phase-Locked Loops (PLLs).
- 173 I/O pins (supports LVCMOS, LVTTL, HSTL, SSTL).
- 1.2V core voltage, 3.3V/2.5V I/O voltage.
- On-chip DSP support (multipliers).
- JTAG & SelectMAP configuration.
Ideal for embedded, communications, and consumer applications.
Manufacturer
The XC3S1000-4FTG256C is a Spartan-3 series FPGA (Field-Programmable Gate Array) manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and adaptive computing solutions. Known for innovation in reconfigurable hardware, Xilinx serves industries like telecommunications, automotive, aerospace, and data centers.
The XC3S1000-4FTG256C is an older FPGA model, part of the cost-optimized Spartan-3 family, offering 1 million system gates in a 256-pin Fine-Pitch Ball Grid Array (FTG256) package.
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and adaptive computing solutions. Known for innovation in reconfigurable hardware, Xilinx serves industries like telecommunications, automotive, aerospace, and data centers.
The XC3S1000-4FTG256C is an older FPGA model, part of the cost-optimized Spartan-3 family, offering 1 million system gates in a 256-pin Fine-Pitch Ball Grid Array (FTG256) package.
Application
The XC3S1000-4FTG256C, a Spartan-3 FPGA by Xilinx, is used in:
1. Embedded Systems – For control and interfacing.
2. Industrial Automation – Motor control, PLCs.
3. Communications – Signal processing, protocol bridging.
4. Consumer Electronics – Display controllers, multimedia.
5. Automotive – Sensor processing, infotainment.
6. Medical Devices – Data acquisition, imaging.
7. Military/Aerospace – Rugged, low-power applications.
Its 1M-gate capacity, 256-pin BGA package, and low cost make it ideal for cost-sensitive, moderate-performance designs.
1. Embedded Systems – For control and interfacing.
2. Industrial Automation – Motor control, PLCs.
3. Communications – Signal processing, protocol bridging.
4. Consumer Electronics – Display controllers, multimedia.
5. Automotive – Sensor processing, infotainment.
6. Medical Devices – Data acquisition, imaging.
7. Military/Aerospace – Rugged, low-power applications.
Its 1M-gate capacity, 256-pin BGA package, and low cost make it ideal for cost-sensitive, moderate-performance designs.
Package
The XC3S1000-4FTG256C is a Spartan-3 FPGA from Xilinx, packaged in a 256-pin Fine-Pitch Ball Grid Array (FTG256). This surface-mount package features a 1.0mm ball pitch, suitable for high-density PCB designs. The "C" suffix indicates commercial temperature range (0°C to +85°C). The package is RoHS-compliant and optimized for cost-sensitive, space-constrained applications.
