XC2S200-5FGG256I

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XC2S200-5FGG256I

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IC FPGA 176 I/O 256FBGA

  • 製造商AMD

  • 製造商部分 #XC2S200-5FGG256I

  • 有存貨7706

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規格

屬性 價值
Series Spartan®-II
Part Status Obsolete
Digi Key Programmable Not Verified
Number of Logic Elements / Cells 5292
Total RAM Bits 57344
Number of I/O 176
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number XC2S200
Number of LA Bs / CL Bs 1176
Number of Gates 200000

概述

Description

The XC2S200-5FGG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-II family. It is designed for cost-sensitive applications while retaining performance and flexibility. The "XC2S200" indicates it has approximately 200,000 system gates. The "-5" specifies its speed grade, indicating moderate performance capabilities. The "FGG256" part of the name describes the package type: a Fine Pitch Ball Grid Array (FBGA) with 256 pins. The "I" denotes its industrial-grade temperature range, suitable for harsh environments (-40°C to 100°C).
The Spartan-II series offers various advanced features, including fast, flexible, in-system programmability and re-programmability, a robust logic cell architecture, efficient memory management, and a variety of I/O standards. These features make it suitable for applications like telecommunications, consumer electronics, industrial control systems, and digital signal processing. Its cost-effectiveness makes it an ideal choice for prototyping and production systems where adaptability and performance are required without the higher costs associated with more advanced FPGA series.

Equivalent

The XC2S200-5FGG256I is a Xilinx Spartan-II FPGA. Equivalent products can include other FPGAs with similar logic gates, I/Os, and speed grades from manufacturers like Altera (now Intel) such as the Cyclone series, or Lattice's ECP or MachXO series. These alternatives should match the specific requirements like package type, operating temperature range, and performance for compatibility. Always check datasheets to ensure equivalency.

Features

The XC2S200-5FGG256I is a part of the Xilinx Spartan-II FPGA series, offering a cost-effective solution for a variety of digital applications. Key features include:
1. Logic Cells: It contains approximately 200,000 system gates and 2,376 logic cells.
2. Configurable Logic Blocks (CLBs): It contains 192 CLBs, which are configurable for implementing custom logic functions.
3. Memory: It offers 56 KB of distributed RAM.
4. I/O Pins: The device supports up to 176 user I/O pins, providing flexibility in interfacing.
5. Package: Comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.
6. Speed Grade: The "-5" denotes a specific speed grade, indicating balanced performance and power.
7. Temperature Range: The "I" suffix indicates an industrial-grade temperature range, typically from -40°C to +100°C.
8. Supply Voltage: Operates at a core voltage of 2.5V, with 3.3V for I/O.
These features make it suitable for applications requiring moderate logic density and performance within industrial environments.

Pinout

The XC2S200-5FGG256I is a member of the Spartan-II FPGA family from Xilinx. It has a pin count of 256, as indicated by the "FGG256" in its part number, where "FGG" refers to the Fine-Pitch Ball Grid Array (FBGA) package type and "256" denotes the number of pins or balls.
The primary function of the XC2S200 FPGA is to provide a flexible hardware platform that can be configured to perform a wide variety of digital logic functions. This includes implementing custom logic circuits, digital signal processing, and interfacing with other hardware components. The device includes configurable logic blocks (CLBs), input/output blocks (IOBs), and embedded memory, allowing users to implement complex digital designs. The "-5" indicates the speed grade of the device, and the "I" suffix specifies that it is rated for industrial temperature ranges.

Manufacturer

The XC2S200-5FGG256I is manufactured by Xilinx, Inc. Xilinx was a leading technology company known for designing and developing programmable logic devices such as Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and software-defined solutions. These products are used in various applications, including telecommunications, automotive, aerospace, defense, industrial, and consumer electronics. Xilinx was renowned for providing innovative and adaptable silicon solutions that allowed developers to customize hardware functionality according to specific needs.
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a prominent semiconductor company that designs and produces CPUs, GPUs, and related technologies for PC, server, and embedded system applications. The acquisition, completed in 2022, allowed AMD to expand its portfolio and strengthen its position in the data center and embedded system markets by integrating Xilinx's cutting-edge FPGA technologies.

Application

The XC2S200-5FGG256I is a Spartan-II FPGA from Xilinx, primarily used in applications requiring customizable digital logic. Key areas include:
1. Communications: Used in data processing, signal encoding/decoding, and protocol implementation.
2. Consumer Electronics: Supports video processing, image enhancement, and home automation systems.
3. Industrial Automation: Facilitates motor control, sensor interfacing, and real-time decision making.
4. Automotive: Implements infotainment systems, ADAS, and in-car networking.
5. Aerospace and Defense: Used for signal processing, encryption, and radar systems.
6. Medical Devices: Supports diagnostic equipment and patient monitoring systems.
These applications leverage the FPGA's reconfigurability, parallel processing capabilities, and performance efficiency.

Package

The XC2S200-5FGG256I is a BGA (Ball Grid Array) package. Specifically, it is a Fine-Pitch Ball Grid Array (FBGA) with 256 balls. This package type is used for Xilinx Spartan-II FPGA, providing a compact and efficient solution for mounting onto printed circuit boards.

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