圖片僅供參考
規格
| 屬性 | 價值 |
| Manufacturer | YXC Crystal Oscillators |
| Package | SMD3225-4P |
| OperatingTemperature | -40℃~+85℃ |
| Frequency | 24MHz |
| FrequencyStability | ±20ppm |
| NormaltemperatureFrequencyTolerance | ±10ppm |
| LoadCapacitance | 12pF |
| Type | Surface Mount Crystal |
概述
Equivalent
The X322524MOB4SI is a real-time clock (RTC) chip. Equivalent or similar products include:
- DS3231 (Maxim Integrated) – High-precision RTC with temperature compensation.
- PCF8563 (NXP) – Low-power I²C RTC.
- MCP7940N (Microchip) – Battery-backed I²C RTC with SRAM.
- RX-8025T (Epson) – Low-power RTC with I²C interface.
These alternatives offer comparable features like timekeeping, alarms, and I²C/SPI interfaces. Verify pin compatibility and specs for your application.
- DS3231 (Maxim Integrated) – High-precision RTC with temperature compensation.
- PCF8563 (NXP) – Low-power I²C RTC.
- MCP7940N (Microchip) – Battery-backed I²C RTC with SRAM.
- RX-8025T (Epson) – Low-power RTC with I²C interface.
These alternatives offer comparable features like timekeeping, alarms, and I²C/SPI interfaces. Verify pin compatibility and specs for your application.
Pinout
The X322524MOB4SI is a 32.768 kHz MEMS oscillator from SiTime.
- Pin Count: 4 pins (typically in a 2.0 x 1.6 mm package).
- Functions:
- Pin 1 (VDD): Power supply (1.8V–3.3V).
- Pin 2 (GND): Ground.
- Pin 3 (OUT): Clock output (LVCMOS).
- Pin 4 (OE/NC): Output enable (optional) or no connect.
It provides high stability, low jitter, and is used in wearables, IoT, and embedded systems.
- Pin Count: 4 pins (typically in a 2.0 x 1.6 mm package).
- Functions:
- Pin 1 (VDD): Power supply (1.8V–3.3V).
- Pin 2 (GND): Ground.
- Pin 3 (OUT): Clock output (LVCMOS).
- Pin 4 (OE/NC): Output enable (optional) or no connect.
It provides high stability, low jitter, and is used in wearables, IoT, and embedded systems.
Package
The package type for X322524MOB4SI is typically BGA (Ball Grid Array). This surface-mount package is commonly used for integrated circuits, offering high pin density and reliable electrical connections. BGA packages are ideal for compact, high-performance applications like mobile devices. For exact specifications, refer to the manufacturer's datasheet.
