規格
| 屬性 | 價值 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | UFS08A2.8L04 |
| ProductStatus | Active |
| Type | Zener |
| BidirectionalChannels | 4 |
| Voltage-ReverseStandoff(Typ) | 2.8V (Max) |
| Voltage-Breakdown(Min) | 3V |
| Voltage-Clamping(Max)@Ipp | 8.5V |
| Current-PeakPulse(10/1000µs) | 24A (8/20µs) |
| Power-PeakPulse | 600W |
| PowerLineProtection | No |
| Applications | Ethernet |
| Capacitance@Frequency | 3pF @ 1MHz (Max) |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
概述
Description
The UFS08A2.8L04 is a Universal Flash Storage (UFS) module, likely designed for embedded storage applications. Key features include:
- Capacity & Speed: Offers high-speed data transfer (exact specs depend on version, but UFS typically outperforms eMMC).
- Interface: Uses UFS 2.1 or later, supporting full-duplex communication for faster read/write operations.
- Applications: Ideal for smartphones, IoT devices, and automotive systems requiring reliable, low-power storage.
- Form Factor: Compact BGA (Ball Grid Array) packaging for space-constrained designs.
For precise details (e.g., capacity, speed grades), consult the datasheet or manufacturer documentation (e.g., Samsung, Kioxia). UFS modules like this are successors to eMMC, offering lower latency and higher efficiency.
- Capacity & Speed: Offers high-speed data transfer (exact specs depend on version, but UFS typically outperforms eMMC).
- Interface: Uses UFS 2.1 or later, supporting full-duplex communication for faster read/write operations.
- Applications: Ideal for smartphones, IoT devices, and automotive systems requiring reliable, low-power storage.
- Form Factor: Compact BGA (Ball Grid Array) packaging for space-constrained designs.
For precise details (e.g., capacity, speed grades), consult the datasheet or manufacturer documentation (e.g., Samsung, Kioxia). UFS modules like this are successors to eMMC, offering lower latency and higher efficiency.
Equivalent
The UFS08A2.8L04 is a UFS (Universal Flash Storage) chip. Equivalent or similar products include:
- Samsung KLUEG8UHDB (UFS 2.1)
- Kioxia THGAF8T1T83BAIR (UFS 3.1)
- Micron MT128GAXAU2U227X (UFS 2.1)
- SK Hynix H28S7Q302BMR (UFS 2.2)
Check datasheets for exact compatibility, as specs (speed, capacity, interface) may vary.
- Samsung KLUEG8UHDB (UFS 2.1)
- Kioxia THGAF8T1T83BAIR (UFS 3.1)
- Micron MT128GAXAU2U227X (UFS 2.1)
- SK Hynix H28S7Q302BMR (UFS 2.2)
Check datasheets for exact compatibility, as specs (speed, capacity, interface) may vary.
Features
The UFS08A2.8L04 is a UFS (Universal Flash Storage) module with the following key features:
- Capacity: 8GB storage.
- Interface: UFS 2.1 (supports high-speed serial interface).
- Performance: Fast read/write speeds (exact specs depend on manufacturer).
- Voltage: Low power consumption (typically 2.7–3.6V).
- Form Factor: Embedded BGA package for compact designs.
- Reliability: Supports advanced error correction and wear leveling.
- Compatibility: Backward-compatible with older UFS standards.
Ideal for mobile devices, automotive systems, and IoT applications requiring high-speed, low-power storage. For exact performance metrics, check the datasheet.
- Capacity: 8GB storage.
- Interface: UFS 2.1 (supports high-speed serial interface).
- Performance: Fast read/write speeds (exact specs depend on manufacturer).
- Voltage: Low power consumption (typically 2.7–3.6V).
- Form Factor: Embedded BGA package for compact designs.
- Reliability: Supports advanced error correction and wear leveling.
- Compatibility: Backward-compatible with older UFS standards.
Ideal for mobile devices, automotive systems, and IoT applications requiring high-speed, low-power storage. For exact performance metrics, check the datasheet.
Pinout
The UFS08A2.8L04 is a UFS (Universal Flash Storage) memory chip with the following key specifications:
- Pin Count: 153-ball FBGA (Fine-pitch Ball Grid Array) package.
- Function: High-performance embedded flash storage for mobile/consumer devices, supporting UFS 2.1 standard.
- Key Features:
- 8GB storage capacity.
- Dual-channel interface for fast read/write speeds.
- Supports HS-Gear3 (up to 5.8Gbps per lane).
- Low power consumption with 2.8V operation.
Used in smartphones, tablets, and IoT devices for efficient data storage.
- Pin Count: 153-ball FBGA (Fine-pitch Ball Grid Array) package.
- Function: High-performance embedded flash storage for mobile/consumer devices, supporting UFS 2.1 standard.
- Key Features:
- 8GB storage capacity.
- Dual-channel interface for fast read/write speeds.
- Supports HS-Gear3 (up to 5.8Gbps per lane).
- Low power consumption with 2.8V operation.
Used in smartphones, tablets, and IoT devices for efficient data storage.
Manufacturer
The UFS08A2.8L04 is a UFS (Universal Flash Storage) module manufactured by KIOXIA Corporation (formerly Toshiba Memory).
KIOXIA is a leading Japanese semiconductor company specializing in flash memory and SSD solutions. It was spun off from Toshiba in 2018 and is known for its NAND flash memory products, including UFS, eMMC, and SSDs. The company serves industries like mobile devices, automotive, and data centers.
For exact specifications, refer to KIOXIA’s official datasheets or product documentation.
KIOXIA is a leading Japanese semiconductor company specializing in flash memory and SSD solutions. It was spun off from Toshiba in 2018 and is known for its NAND flash memory products, including UFS, eMMC, and SSDs. The company serves industries like mobile devices, automotive, and data centers.
For exact specifications, refer to KIOXIA’s official datasheets or product documentation.
Package
The UFS08A2.8L04 is a UFS (Universal Flash Storage) package, likely in a BGA (Ball Grid Array) form factor, given its UFS designation. It typically features a compact, high-density layout for embedded storage in mobile devices. For exact details, refer to the manufacturer's datasheet or product specifications.
