圖片僅供參考
規格
| 屬性 | 價值 |
| EU Ro HS | Compliant |
| ECCN (US) | 3A991.b.1.a |
| Part Status | Unconfirmed |
| HTS | 8542.32.00.71 |
| Automotive | Yes |
| PPAP | Unknown |
| Cell Type | NAND |
| Chip Density (bit) | 64G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Interface Type | Serial e-MMC |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Mounting Type | Surface Mount |
| Package Height | 1 |
| Package Width | 11.5 |
| Package Length | 13 |
| PCB changed | 153 |
| Package / Case | BGA |
| Supplier Device Package | FBGA |
| Pin Count | 153 |
概述
Description
The THGBMJG6C1LBAB7 is a product code for a specific type of NAND flash memory manufactured by Kioxia Corporation, formerly known as Toshiba Memory. This particular module is designed for embedded applications and is part of Kioxia's e-MMC (embedded MultiMediaCard) product line, which integrates NAND flash memory with a robust controller in a single package.
Key features of the THGBMJG6C1LBAB7 include high storage density, enhanced performance, and reliability suitable for a wide range of consumer electronics such as smartphones, tablets, and other portable devices. The e-MMC architecture simplifies system design by handling complex flash management tasks internally, such as wear leveling, bad block management, and error correction.
The integrated controller improves data transfer speeds and system responsiveness, making it an ideal solution for applications requiring efficient data processing and storage. The THGBMJG6C1LBAB7 aims to offer a balance of cost, performance, and ease of integration for manufacturers looking to incorporate flash memory into their products.
Key features of the THGBMJG6C1LBAB7 include high storage density, enhanced performance, and reliability suitable for a wide range of consumer electronics such as smartphones, tablets, and other portable devices. The e-MMC architecture simplifies system design by handling complex flash management tasks internally, such as wear leveling, bad block management, and error correction.
The integrated controller improves data transfer speeds and system responsiveness, making it an ideal solution for applications requiring efficient data processing and storage. The THGBMJG6C1LBAB7 aims to offer a balance of cost, performance, and ease of integration for manufacturers looking to incorporate flash memory into their products.
Equivalent
The THGBMJG6C1LBAB7 chip is a type of eMMC flash memory from Toshiba (now Kioxia). Equivalent products would typically be other eMMC chips with similar storage capacity, interface, and specifications from competing manufacturers. Examples include Samsung's eMMC offerings, Micron's eMMC series, and SK Hynix's eMMC products. These alternatives must match attributes like storage size, speed, and form factor to be considered true equivalents. Always compare specific technical details for compatibility.
Features
The THGBMJG6C1LBAB7 is a NAND flash memory product from Toshiba (now Kioxia). It is part of the e-MMC (embedded MultiMediaCard) family. Here are its key features:
1. Type: Embedded NAND Flash Memory.
2. Capacity: Typically available in different capacities, often around 8GB, but it can vary.
3. Interface: e-MMC interface, compliant with JEDEC e-MMC standard (often 4.5 or 5.0).
4. Performance: Supports high data transfer rates with features like HS200 or possibly HS400 modes, allowing for faster read/write operations.
5. Package: Commonly comes in a BGA (Ball Grid Array) package, designed for compact integration into devices.
6. Applications: Suitable for use in consumer electronics such as smartphones, tablets, and other portable devices requiring reliable and efficient storage solutions.
7. Power: Designed for low power consumption, which is essential for battery-operated devices.
8. Reliability: Incorporates error correction and wear leveling to enhance data integrity and lifespan.
Please refer to the manufacturer's datasheet for detailed specifications and confirmations, as features might slightly vary with revisions.
1. Type: Embedded NAND Flash Memory.
2. Capacity: Typically available in different capacities, often around 8GB, but it can vary.
3. Interface: e-MMC interface, compliant with JEDEC e-MMC standard (often 4.5 or 5.0).
4. Performance: Supports high data transfer rates with features like HS200 or possibly HS400 modes, allowing for faster read/write operations.
5. Package: Commonly comes in a BGA (Ball Grid Array) package, designed for compact integration into devices.
6. Applications: Suitable for use in consumer electronics such as smartphones, tablets, and other portable devices requiring reliable and efficient storage solutions.
7. Power: Designed for low power consumption, which is essential for battery-operated devices.
8. Reliability: Incorporates error correction and wear leveling to enhance data integrity and lifespan.
Please refer to the manufacturer's datasheet for detailed specifications and confirmations, as features might slightly vary with revisions.
Pinout
The THGBMJG6C1LBAB7 is a NAND flash memory chip manufactured by Toshiba (now part of Kioxia). It is part of their e-MMC (embedded MultiMediaCard) lineup. The specific model, THGBMJG6C1LBAB7, typically comes in a standard BGA (Ball Grid Array) package.
While the exact pin count can vary slightly depending on the specific configuration and manufacturing variations, e-MMC devices like this generally have around 153 to 169 pins (balls). These pins serve various functions, including power supply, ground, data input/output, clock signals, command signals, and other necessary control signals.
The primary function of the THGBMJG6C1LBAB7 is to provide non-volatile storage in electronic devices. It integrates NAND flash memory with a controller to manage data storage and retrieval, offering a compact, reliable storage solution for applications such as smartphones, tablets, and other portable electronics.
For precise pin configurations and functions, referring to the manufacturer's datasheet for this specific model is recommended.
While the exact pin count can vary slightly depending on the specific configuration and manufacturing variations, e-MMC devices like this generally have around 153 to 169 pins (balls). These pins serve various functions, including power supply, ground, data input/output, clock signals, command signals, and other necessary control signals.
The primary function of the THGBMJG6C1LBAB7 is to provide non-volatile storage in electronic devices. It integrates NAND flash memory with a controller to manage data storage and retrieval, offering a compact, reliable storage solution for applications such as smartphones, tablets, and other portable electronics.
For precise pin configurations and functions, referring to the manufacturer's datasheet for this specific model is recommended.
Manufacturer
The THGBMJG6C1LBAB7 is a part number for a type of NAND flash memory, and it is manufactured by Kioxia Corporation. Kioxia is a Japanese company that specializes in the production of flash memory and solid-state drives. It was originally part of Toshiba Corporation and was known as Toshiba Memory Corporation before being rebranded to Kioxia in October 2019. Kioxia is considered a leading company in the realm of memory solutions, focusing on developing, manufacturing, and supplying NAND flash memory and solid-state drives for a variety of applications including data centers, PCs, smartphones, and consumer electronics.
Application
The THGBMJG6C1LBAB7 is a NAND flash memory module, typically used in consumer electronics and industrial applications. Common application areas include smartphones, tablets, digital cameras, and other portable devices, where it provides data storage solutions. It is also used in embedded systems, automotive electronics, and IoT devices for reliable and efficient data storage. Its compact form factor and high storage capacity make it ideal for applications that require robust data handling and power efficiency.
Package
The THGBMJG6C1LBAB7 is a package type for a Toshiba e-MMC (embedded MultiMediaCard) NAND flash memory. It typically uses a BGA (Ball Grid Array) package, which is common for such memory components, allowing for compact and integrated circuit design suitable for various electronic devices.