規格
| 屬性 | 價值 |
| Package | Tray |
| Series | STM32F7 |
| ProductStatus | Active |
| CoreProcessor | ARM® Cortex®-M7 |
| CoreSize | 32-Bit Single-Core |
| Speed | 216MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| NumberofI/O | 140 |
| ProgramMemorySize | 2MB (2M x 8) |
| ProgramMemoryType | FLASH |
| RAMSize | 512K x 8 |
| Voltage-Supply(Vcc/Vdd) | 1.7V ~ 3.6V |
| DataConverters | A/D 24x12b; D/A 2x12b |
| OscillatorType | Internal |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 201-UFBGA |
概述
Description
The STM32F765IIK6 is a high-performance microcontroller from STMicroelectronics, based on the ARM Cortex-M7 core running at 216 MHz. It features 2MB Flash, 512KB RAM, and extensive peripherals including USB OTG, Ethernet, CAN, SPI, I2C, UART, and multiple ADCs/DACs.
Key highlights:
- Cortex-M7 with FPU and DSP support for efficient signal processing.
- Dual-mode Quad-SPI for fast external memory interfacing.
- Chrom-ART Accelerator™ for enhanced graphics performance.
- Hardware encryption (AES, HASH, RNG) for security.
- LQFP176 package, suitable for industrial and embedded applications.
Ideal for real-time control, IoT, and multimedia systems, it balances power efficiency with high computational capability.
Key highlights:
- Cortex-M7 with FPU and DSP support for efficient signal processing.
- Dual-mode Quad-SPI for fast external memory interfacing.
- Chrom-ART Accelerator™ for enhanced graphics performance.
- Hardware encryption (AES, HASH, RNG) for security.
- LQFP176 package, suitable for industrial and embedded applications.
Ideal for real-time control, IoT, and multimedia systems, it balances power efficiency with high computational capability.
Equivalent
The STM32F765IIK6 is part of ST's high-performance F7 series. Equivalent alternatives include:
- STM32F767IIK6: Higher flash (2MB vs. 1MB), same pinout.
- STM32F746IGK6: Lower performance (M7 at 216MHz vs. 216MHz), similar peripherals.
- STM32H743IIK6: H7 series, faster (400MHz), better power efficiency.
For drop-in replacements, check pin-compatible F7 variants like STM32F765VGT6 (LQFP100) or STM32F765ZIT6 (LQFP144). Verify specs for exact needs.
- STM32F767IIK6: Higher flash (2MB vs. 1MB), same pinout.
- STM32F746IGK6: Lower performance (M7 at 216MHz vs. 216MHz), similar peripherals.
- STM32H743IIK6: H7 series, faster (400MHz), better power efficiency.
For drop-in replacements, check pin-compatible F7 variants like STM32F765VGT6 (LQFP100) or STM32F765ZIT6 (LQFP144). Verify specs for exact needs.
Features
The STM32F765IIK6 is a high-performance microcontroller based on the ARM Cortex-M7 core. Key features:
- Core: 216 MHz Cortex-M7 with FPU and DSP instructions
- Memory: 2MB Flash, 512KB SRAM (plus 16KB ITCM, 64KB DTCM)
- Peripherals:
- USB OTG HS/FS, dual CAN FD
- 3x I2C, 6x USART/UART, 4x SPI (w/ I2S)
- Ethernet MAC, HDMI-CEC
- 3x 16-bit ADCs, 2x 12-bit DACs
- Timers: 17x (incl. 2x 32-bit, PWM, motor control)
- GPIO: Up to 168 pins (LQFP176 package)
- Security: CRC, RNG, HW encryption (AES, Hash)
- Power: 1.7V–3.6V supply, multiple low-power modes
Ideal for industrial, IoT, and high-speed applications.
- Core: 216 MHz Cortex-M7 with FPU and DSP instructions
- Memory: 2MB Flash, 512KB SRAM (plus 16KB ITCM, 64KB DTCM)
- Peripherals:
- USB OTG HS/FS, dual CAN FD
- 3x I2C, 6x USART/UART, 4x SPI (w/ I2S)
- Ethernet MAC, HDMI-CEC
- 3x 16-bit ADCs, 2x 12-bit DACs
- Timers: 17x (incl. 2x 32-bit, PWM, motor control)
- GPIO: Up to 168 pins (LQFP176 package)
- Security: CRC, RNG, HW encryption (AES, Hash)
- Power: 1.7V–3.6V supply, multiple low-power modes
Ideal for industrial, IoT, and high-speed applications.
Pinout
The STM32F765IIK6 is a microcontroller from STMicroelectronics with the following key details:
- Package: UFBGA176 (176-pin Ball Grid Array)
- Core: ARM Cortex-M7 @ 216 MHz
- Flash: 2 MB
- RAM: 512 KB (plus additional 16 KB Tightly Coupled Memory)
- Functions:
- GPIOs: Up to 140 configurable I/O pins
- Communication: Multiple USARTs, SPIs, I2Cs, CAN, USB OTG, Ethernet
- Analog: 16-bit ADCs, DACs
- Timers: Advanced-control, general-purpose, and basic timers
- Interfaces: SDMMC, SAI, SPDIF, HDMI-CEC, camera interface
- Security: AES, HASH, RNG
This MCU is designed for high-performance embedded applications requiring rich connectivity and real-time processing.
- Package: UFBGA176 (176-pin Ball Grid Array)
- Core: ARM Cortex-M7 @ 216 MHz
- Flash: 2 MB
- RAM: 512 KB (plus additional 16 KB Tightly Coupled Memory)
- Functions:
- GPIOs: Up to 140 configurable I/O pins
- Communication: Multiple USARTs, SPIs, I2Cs, CAN, USB OTG, Ethernet
- Analog: 16-bit ADCs, DACs
- Timers: Advanced-control, general-purpose, and basic timers
- Interfaces: SDMMC, SAI, SPDIF, HDMI-CEC, camera interface
- Security: AES, HASH, RNG
This MCU is designed for high-performance embedded applications requiring rich connectivity and real-time processing.
Application
The STM32F765IIK6, based on the ARM Cortex-M7 core, is ideal for:
- Industrial Automation (PLCs, motor control, HMI)
- Consumer Electronics (smart home devices, wearables)
- Medical Devices (portable diagnostics, monitoring systems)
- Automotive (infotainment, telematics)
- IoT & Connectivity (gateways, wireless sensors)
- Audio & Voice Processing (high-performance DSP applications)
Its features (216 MHz CPU, dual-quad SPI, Ethernet, USB OTG) suit real-time, high-speed, and connectivity-focused applications.
- Industrial Automation (PLCs, motor control, HMI)
- Consumer Electronics (smart home devices, wearables)
- Medical Devices (portable diagnostics, monitoring systems)
- Automotive (infotainment, telematics)
- IoT & Connectivity (gateways, wireless sensors)
- Audio & Voice Processing (high-performance DSP applications)
Its features (216 MHz CPU, dual-quad SPI, Ethernet, USB OTG) suit real-time, high-speed, and connectivity-focused applications.
Package
The STM32F765IIK6 comes in a UFBGA176 package. This is a 176-pin, ultra-fine pitch ball grid array package measuring 10x10 mm, suitable for high-density applications. It offers robust thermal and electrical performance, ideal for embedded systems requiring compact form factors.
