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SI7613DN-T1-GE3
+物料清單MOSFET P-CH 20V 35A PPAK1212-8
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製造商矽尼克斯
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製造商部分 #SI7613DN-T1-GE3
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規格
| 屬性 | 價值 |
| Supplier | Vishay Siliconix |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | TrenchFET® |
| ProductStatus | Active |
| FETType | P-Channel |
| Technology | MOSFET (Metal Oxide) |
| DraintoSourceVoltage(Vdss) | 20 V |
| Current-ContinuousDrain(Id)@25°C | 35A (Tc) |
| DriveVoltage(MaxRdsOnMinRdsOn) | 4.5V, 10V |
| RdsOn(Max)@IdVgs | 8.7mOhm @ 17A, 10V |
| Vgs(th)(Max)@Id | 2.2V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 87 nC @ 10 V |
| Vgs(Max) | ±16V |
| InputCapacitance(Ciss)(Max)@Vds | 2620 pF @ 10 V |
| PowerDissipation(Max) | 3.8W (Ta), 52.1W (Tc) |
| OperatingTemperature | -50°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| SupplierDevicePackage | PowerPAK® 1212-8 |
概述
Description
Key specifications include a maximum drain-source voltage (V_DS) of 30V and a continuous drain current (I_D) of up to 20A, which allow it to handle significant power loads while maintaining efficient operation. Its PowerPAK SO-8 package provides excellent thermal performance, ensuring reliable operation even in high-power environments.
The SI7613DN-T1-GE3 is designed to be easy to integrate into existing systems, thanks to its standard pin configuration and compact footprint. Its low gate charge and fast switching speeds contribute to reduced power loss and improved overall efficiency. This MOSFET is commonly used in applications that demand compact size and high current handling capabilities, such as consumer electronics, industrial equipment, and automotive systems.
Equivalent
Features
1. Low On-Resistance: The device exhibits low on-resistance, which ensures minimal power loss and improved efficiency in power conversion applications.
2. High Current Capability: It supports a high continuous drain current, making it suitable for applications requiring substantial power handling.
3. Compact Package: The MOSFET comes in a PowerPAK® SO-8 package, which provides excellent thermal performance while conserving board space.
4. Fast Switching: The device is designed for fast switching speeds, which enhances performance in high-frequency applications.
5. Enhanced Thermal Characteristics: It has superior thermal characteristics for effective heat dissipation, which helps in maintaining reliability under high-power conditions.
6. Low Gate Charge: This feature contributes to reduced power consumption and increased efficiency in various circuits.
These features make the SI7613DN-T1-GE3 suitable for applications like DC-DC converters, load switching, and motor drives.
Pinout
1. Drain (D): The drain is the terminal where the main current flows out of the MOSFET. Several pins in the package are typically connected to the drain to handle high current.
2. Source (S): The source is the terminal where the current enters the MOSFET. Multiple pins might be allocated to the source as well.
3. Gate (G): The gate is the terminal used to control the flow of current between the drain and source. It usually has a separate pin.
The specific configuration of the pins (which pins are assigned to drain, source, and gate) can be found in the manufacturer's datasheet. This configuration helps in efficient heat dissipation and current handling in electronic circuits.